PL3159435T3 - Dodatek do elektrolitów do stopu srebro-palladowego - Google Patents

Dodatek do elektrolitów do stopu srebro-palladowego

Info

Publication number
PL3159435T3
PL3159435T3 PL15190885T PL15190885T PL3159435T3 PL 3159435 T3 PL3159435 T3 PL 3159435T3 PL 15190885 T PL15190885 T PL 15190885T PL 15190885 T PL15190885 T PL 15190885T PL 3159435 T3 PL3159435 T3 PL 3159435T3
Authority
PL
Poland
Prior art keywords
additive
palladium alloy
silver palladium
alloy electrolytes
electrolytes
Prior art date
Application number
PL15190885T
Other languages
English (en)
Inventor
Bernd Weyhmueller
Alexander Peters
Uwe Manz
Original Assignee
Umicore Galvanotechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik Gmbh filed Critical Umicore Galvanotechnik Gmbh
Publication of PL3159435T3 publication Critical patent/PL3159435T3/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/64Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C5/00Alloys based on noble metals
    • C22C5/06Alloys based on silver
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/023Composite material having a noble metal as the basic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL15190885T 2015-10-21 2015-10-21 Dodatek do elektrolitów do stopu srebro-palladowego PL3159435T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15190885.2A EP3159435B1 (de) 2015-10-21 2015-10-21 Zusatz für silber-palladium-legierungselektrolyte

Publications (1)

Publication Number Publication Date
PL3159435T3 true PL3159435T3 (pl) 2018-10-31

Family

ID=54360003

Family Applications (1)

Application Number Title Priority Date Filing Date
PL15190885T PL3159435T3 (pl) 2015-10-21 2015-10-21 Dodatek do elektrolitów do stopu srebro-palladowego

Country Status (8)

Country Link
US (1) US20190071789A1 (pl)
EP (2) EP3159435B1 (pl)
JP (1) JP2018535318A (pl)
KR (1) KR20180072774A (pl)
CN (1) CN108350592A (pl)
PL (1) PL3159435T3 (pl)
TW (1) TW201728787A (pl)
WO (1) WO2017067985A1 (pl)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018215057A1 (en) * 2017-05-23 2018-11-29 Saxonia Edelmetalle Gmbh Noble metal salt preparation, a method for production thereof and use for electroplating
EP3841233A1 (de) * 2018-08-21 2021-06-30 Umicore Galvanotechnik GmbH Elektrolyt für die cyanidfreie abscheidung von silber
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
DE102018126174B3 (de) 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung
US11242609B2 (en) 2019-10-15 2022-02-08 Rohm and Hass Electronic Materials LLC Acidic aqueous silver-nickel alloy electroplating compositions and methods
DE102020109818A1 (de) * 2020-04-08 2021-04-22 Doduco Solutions Gmbh Elektrischer Steckverbinder zum Anschließen eines Elektrofahrzeugs an eine Ladestation
CN111455360A (zh) * 2020-05-06 2020-07-28 广东工业大学 一种化学镀钯还原剂及化学镀钯液

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
DE2445538C2 (de) 1974-09-20 1984-05-30 Schering AG, 1000 Berlin und 4709 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
DE3118908C2 (de) 1981-05-13 1986-07-10 Degussa Ag, 6000 Frankfurt Galvanisches Palladiumbad
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4465563A (en) * 1982-12-22 1984-08-14 Learonal, Inc. Electrodeposition of palladium-silver alloys
PL157733B1 (pl) * 1988-05-10 1992-06-30 Lubelska Polt Sposób otrzymywania stopów palladu ze srebrem PL PL PL
DE3935664C1 (en) * 1989-10-26 1991-03-28 W.C. Heraeus Gmbh, 6450 Hanau, De Palladium-silver alloys for electrical contacts - deposited from ammoniacal bath contg. palladium tetramine complex, silver di:amine complex and organic sulphur cpd.
EP0693579B1 (de) * 1994-07-21 1997-08-27 W.C. Heraeus GmbH Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
US6251249B1 (en) 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP2001335986A (ja) * 2000-05-30 2001-12-07 Matsuda Sangyo Co Ltd パラジウムめっき液
FR2825721B1 (fr) * 2001-06-12 2003-10-03 Engelhard Clal Sas Melange utilisable comme brillanteur dans un bain de depot electrolytique d'argent, d'or ou d'un de leurs alliages
US6773573B2 (en) * 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
DE102011105207B4 (de) * 2011-06-17 2015-09-10 Umicore Galvanotechnik Gmbh Elektrolyt und seine Verwendung zur Abscheidung von Schwarz-Ruthenium-Überzügen und so erhaltene Überzüge und Artikel
US9512529B2 (en) * 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
DE102013215476B3 (de) 2013-08-06 2015-01-08 Umicore Galvanotechnik Gmbh Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung

Also Published As

Publication number Publication date
TW201728787A (zh) 2017-08-16
KR20180072774A (ko) 2018-06-29
WO2017067985A1 (en) 2017-04-27
JP2018535318A (ja) 2018-11-29
EP3159435B1 (de) 2018-05-23
EP3159435A1 (de) 2017-04-26
EP3365478A1 (en) 2018-08-29
US20190071789A1 (en) 2019-03-07
CN108350592A (zh) 2018-07-31

Similar Documents

Publication Publication Date Title
HK1259425A1 (zh) 無鉛焊料合金
HRP20182112T1 (hr) Legura za lemljenje bez olova
SG11201603421PA (en) Lead-free, silver-free solder alloys
SG11201605991UA (en) Interface for mounting interchangable components
EP3056578A4 (en) Copper alloy
ZA201502055B (en) Methods for processing alloys
HK1218225A2 (zh) 種終端
EP3042985A4 (en) ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN
AP2016009302A0 (en) Copper processing method
PL3159435T3 (pl) Dodatek do elektrolitów do stopu srebro-palladowego
PL2945772T3 (pl) Stopy lutownicze
EP3294489A4 (en) LEAD-FREE BRAZE BASED ON INDIUM-TIN-SILVER
HK1218228A2 (zh) 種終端
SG11201505623XA (en) Pb-FREE SOLDER ALLOY
EP3042984A4 (en) ZINKLEGIERUNGSPLATTIERUNGSVERFAHREN
PL3031566T3 (pl) Bezołowiowy stop lutowniczy
HUE049929T2 (hu) Elektrolit galvanizáláshoz
RS61025B1 (sr) Legura mesinga
GB201312000D0 (en) Alloy
SG11201600900SA (en) Lead-free solder alloy
EP3363928A4 (en) AUTOCATALYTIC PLATE PLATING SOLUTION
HK1246831A1 (zh) 首飾用pt合金
GB201408299D0 (en) An alloy
SG10201509913XA (en) Silver alloyed copper wire
SG10201508104TA (en) Alloyed silver wire