PL2585517T3 - Kompozycja polimerowa przewodząca ciepło - Google Patents
Kompozycja polimerowa przewodząca ciepłoInfo
- Publication number
- PL2585517T3 PL2585517T3 PL11727475T PL11727475T PL2585517T3 PL 2585517 T3 PL2585517 T3 PL 2585517T3 PL 11727475 T PL11727475 T PL 11727475T PL 11727475 T PL11727475 T PL 11727475T PL 2585517 T3 PL2585517 T3 PL 2585517T3
- Authority
- PL
- Poland
- Prior art keywords
- thermally conductive
- polymer composition
- conductive polymer
- thermally
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10167465 | 2010-06-28 | ||
| EP11727475.3A EP2585517B1 (en) | 2010-06-28 | 2011-06-27 | Thermally conductive polymer composition |
| PCT/EP2011/060714 WO2012000935A1 (en) | 2010-06-28 | 2011-06-27 | Thermally conductive polymer composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2585517T3 true PL2585517T3 (pl) | 2015-06-30 |
Family
ID=42467921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11727475T PL2585517T3 (pl) | 2010-06-28 | 2011-06-27 | Kompozycja polimerowa przewodząca ciepło |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130207029A1 (pl) |
| EP (1) | EP2585517B1 (pl) |
| JP (1) | JP5861185B2 (pl) |
| KR (1) | KR101787800B1 (pl) |
| CN (1) | CN102958986B (pl) |
| PL (1) | PL2585517T3 (pl) |
| WO (1) | WO2012000935A1 (pl) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687910A (zh) | 2011-07-15 | 2014-03-26 | 普立万公司 | 包含沥青碳纤维的聚酰胺复合物 |
| CA2865510C (en) | 2012-02-27 | 2019-06-11 | Momentive Performance Materials Inc. | Low drag coatings containing boron nitride powder |
| CN105143327A (zh) * | 2013-04-26 | 2015-12-09 | 帝斯曼知识产权资产管理有限公司 | 智能接线盒和用于智能接线盒的聚合物组合物 |
| KR101519717B1 (ko) * | 2013-08-06 | 2015-05-12 | 현대자동차주식회사 | 전자 제어 유닛용 방열 장치 |
| JP6397180B2 (ja) * | 2013-11-14 | 2018-09-26 | 国立研究開発法人産業技術総合研究所 | 繊維強化樹脂組成物、および繊維強化成形体 |
| WO2015130676A1 (en) * | 2014-02-25 | 2015-09-03 | Polyone Corporation | Thermally conductive polyamide compounds containing laser direct structuring additives |
| US9611414B2 (en) | 2014-07-11 | 2017-04-04 | Henkel IP & Holding GmbH | Thermal interface material with mixed aspect ratio particle dispersions |
| CN104403315A (zh) * | 2014-11-26 | 2015-03-11 | 江门市道生工程塑料有限公司 | 一种耐高温高导热pps/ppo/pa合金及其制备方法 |
| JP6686877B2 (ja) * | 2015-03-05 | 2020-04-22 | 東レ株式会社 | ポリエステルフィルムおよびそれを用いた電気絶縁シート、風力発電機、粘着テープ |
| FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
| FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| CN108884267B (zh) | 2016-02-01 | 2022-02-22 | 卡博特公司 | 包含炭黑的导热性聚合物组合物 |
| US11352480B2 (en) | 2016-03-18 | 2022-06-07 | Ticona Llc | Polyaryletherketone composition |
| US10385250B2 (en) | 2016-06-14 | 2019-08-20 | Nano And Advanced Materials Institute Limited | Thermally conductive composites and method of preparing same |
| CN105959436A (zh) * | 2016-07-09 | 2016-09-21 | 广州易键电子科技有限公司 | 一种散热手机屏幕 |
| AU2017435867B2 (en) * | 2017-10-12 | 2023-04-13 | Prysmian S.P.A. | Electric cable with improved thermoplastic insulating layer |
| CN110172749A (zh) * | 2018-03-08 | 2019-08-27 | 上海舟汉纤维材料科技有限公司 | 一种抗静电聚芳酯纤维及其制备方法 |
| US11118053B2 (en) | 2018-03-09 | 2021-09-14 | Ticona Llc | Polyaryletherketone/polyarylene sulfide composition |
| US11826993B2 (en) * | 2019-02-21 | 2023-11-28 | Textron Innovations Inc. | Thermally conductive curing process for composite rotorcraft structure fabrication |
| US11725079B2 (en) | 2020-07-20 | 2023-08-15 | The Boeing Company | Polyimide compositions and articles incorporating the same |
| CN112094681B (zh) * | 2020-08-20 | 2022-10-11 | 安徽绿环泵业有限公司 | 一种耐腐蚀泵用润滑密封填料的制备方法 |
| US11845834B2 (en) * | 2020-09-23 | 2023-12-19 | The Boeing Company | Polyamide compositions and articles incorporating the same |
| US11697709B2 (en) | 2020-10-07 | 2023-07-11 | The Boeing Company | Poly(arylene ether) compositions and articles incorporating the same |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050016714A1 (en) * | 2003-07-09 | 2005-01-27 | Chung Deborah D.L. | Thermal paste for improving thermal contacts |
| JP2006022130A (ja) * | 2004-07-06 | 2006-01-26 | Idemitsu Kosan Co Ltd | 熱伝導性樹脂組成物及びその製造方法 |
| JP4973114B2 (ja) * | 2005-11-07 | 2012-07-11 | 東レ株式会社 | 樹脂組成物、それからなる錠剤の製造方法、および成形品 |
| EP1979415A2 (en) * | 2006-02-01 | 2008-10-15 | PolyOne Corporation | Exothermic polyphenylene sulfide compounds |
| JP2007250911A (ja) * | 2006-03-16 | 2007-09-27 | Sumitomo Metal Mining Co Ltd | 導電性組成物、導電性組成物シートおよびそれらを用いた有機質正特性サーミスタ素子ならびに該有機質正特性サーミスタ素子の製造方法 |
| WO2007149783A1 (en) * | 2006-06-20 | 2007-12-27 | Polyone Corporation | Thermally conductive polymer compounds containing zinc sulfide and thermal carbon black |
| US20080153959A1 (en) | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP4709795B2 (ja) * | 2007-03-16 | 2011-06-22 | 株式会社東芝 | 高熱伝導性材料 |
| DE102007037316A1 (de) * | 2007-08-08 | 2009-02-12 | Lanxess Deutschland Gmbh | Thermisch leitfähige und elektrisch isolierende thermoplastische Compounds |
| US20090111948A1 (en) * | 2007-10-25 | 2009-04-30 | Thomas Eugene Dueber | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto |
-
2011
- 2011-06-27 CN CN201180032038.1A patent/CN102958986B/zh active Active
- 2011-06-27 WO PCT/EP2011/060714 patent/WO2012000935A1/en active Application Filing
- 2011-06-27 US US13/807,482 patent/US20130207029A1/en not_active Abandoned
- 2011-06-27 EP EP11727475.3A patent/EP2585517B1/en active Active
- 2011-06-27 KR KR1020137002025A patent/KR101787800B1/ko active IP Right Grant
- 2011-06-27 PL PL11727475T patent/PL2585517T3/pl unknown
- 2011-06-27 JP JP2013517228A patent/JP5861185B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130038910A (ko) | 2013-04-18 |
| EP2585517B1 (en) | 2014-12-24 |
| CN102958986B (zh) | 2016-05-04 |
| CN102958986A (zh) | 2013-03-06 |
| US20130207029A1 (en) | 2013-08-15 |
| KR101787800B1 (ko) | 2017-10-18 |
| JP5861185B2 (ja) | 2016-02-16 |
| JP2013532219A (ja) | 2013-08-15 |
| EP2585517A1 (en) | 2013-05-01 |
| WO2012000935A1 (en) | 2012-01-05 |
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