PL1841561T3 - Stop lutowniczy - Google Patents
Stop lutowniczyInfo
- Publication number
- PL1841561T3 PL1841561T3 PL05811506T PL05811506T PL1841561T3 PL 1841561 T3 PL1841561 T3 PL 1841561T3 PL 05811506 T PL05811506 T PL 05811506T PL 05811506 T PL05811506 T PL 05811506T PL 1841561 T3 PL1841561 T3 PL 1841561T3
- Authority
- PL
- Poland
- Prior art keywords
- solder alloy
- solder
- alloy
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/06—Making non-ferrous alloys with the use of special agents for refining or deoxidising
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0426383A GB2421030B (en) | 2004-12-01 | 2004-12-01 | Solder alloy |
US71091505P | 2005-08-24 | 2005-08-24 | |
EP05811506.4A EP1841561B1 (en) | 2004-12-01 | 2005-12-01 | Solder alloy |
PCT/GB2005/004609 WO2006059115A1 (en) | 2004-12-01 | 2005-12-01 | Solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1841561T3 true PL1841561T3 (pl) | 2016-01-29 |
Family
ID=34043880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL05811506T PL1841561T3 (pl) | 2004-12-01 | 2005-12-01 | Stop lutowniczy |
Country Status (11)
Country | Link |
---|---|
US (2) | US9221131B2 (pl) |
EP (1) | EP1841561B1 (pl) |
JP (1) | JP5147409B2 (pl) |
KR (1) | KR101345677B1 (pl) |
CN (1) | CN101132881B (pl) |
BR (1) | BRPI0518780B1 (pl) |
CA (1) | CA2589259C (pl) |
GB (1) | GB2421030B (pl) |
MX (1) | MX2007006353A (pl) |
PL (1) | PL1841561T3 (pl) |
WO (1) | WO2006059115A1 (pl) |
Families Citing this family (82)
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CZ2005659A3 (cs) * | 2005-10-19 | 2007-01-10 | JenĂk@Jan | Bezolovnatá pájka |
US8143722B2 (en) | 2006-10-05 | 2012-03-27 | Flipchip International, Llc | Wafer-level interconnect for high mechanical reliability applications |
CN100439027C (zh) * | 2007-01-18 | 2008-12-03 | 广州有色金属研究院 | 适用于铜铝异种金属软钎焊的无铅焊料合金 |
US8502086B2 (en) * | 2007-05-17 | 2013-08-06 | Fujikura Ltd. | Laminated wiring board and method for manufacturing the same |
CN103008903A (zh) * | 2007-08-14 | 2013-04-03 | 株式会社爱科草英 | 无铅焊料组合物及使用它的印刷电路板与电子器件 |
WO2009022758A1 (en) * | 2007-08-14 | 2009-02-19 | Ecojoin | Pb-free solder compositions and pcb and electronic device using the same |
EP2179815A4 (en) * | 2007-08-24 | 2010-09-08 | Toshiba Kk | BINDING COMPOSITION |
US7847399B2 (en) * | 2007-12-07 | 2010-12-07 | Texas Instruments Incorporated | Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles |
WO2009104271A1 (ja) * | 2008-02-22 | 2009-08-27 | 株式会社日本スペリア社 | Niを含む無鉛はんだのNi濃度調整法 |
CN102066042B (zh) * | 2008-04-23 | 2016-03-23 | 千住金属工业株式会社 | 无铅焊料 |
EP2275224B1 (en) * | 2008-04-23 | 2014-01-22 | Senju Metal Industry Co., Ltd | Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
JP5379402B2 (ja) * | 2008-05-12 | 2013-12-25 | 株式会社弘輝 | 鉛フリーSn−Ag系半田合金及び半田合金粉末 |
US8421246B2 (en) * | 2008-06-23 | 2013-04-16 | Panasonic Corporation | Joint structure and electronic component |
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KR100968173B1 (ko) * | 2009-12-23 | 2010-07-07 | 코리아 오토글라스 주식회사 | 자동차 유리 솔더링용 무연 솔더 조성물 |
CN101780608B (zh) * | 2010-04-12 | 2011-09-21 | 天津市恒固科技有限公司 | 一种含Si和Ge的SnAgCu系无铅焊料 |
CN101920406B (zh) * | 2010-09-16 | 2012-05-09 | 上海交通大学 | Sn-Ag-Zn-Cr共晶无铅焊料 |
CN101927410B (zh) * | 2010-09-16 | 2012-10-17 | 上海交通大学 | Sn-Ag-Zn-Bi-Cr无铅焊料 |
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CN102085604A (zh) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr低银无铅焊料 |
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WO2014013632A1 (ja) * | 2012-07-19 | 2014-01-23 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
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CN102848100B (zh) * | 2012-10-10 | 2015-03-25 | 南京航空航天大学 | 含Nd、Ga的低银Sn-Ag-Cu无铅钎料 |
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JP5730354B2 (ja) * | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
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KR102247498B1 (ko) * | 2017-07-07 | 2021-05-03 | 덕산하이메탈(주) | 솔더 합금, 솔더볼 및 그 제조방법 |
JP6292342B1 (ja) * | 2017-09-20 | 2018-03-14 | 千住金属工業株式会社 | Cu管及び/又はFe管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手 |
CN108080810A (zh) * | 2017-12-13 | 2018-05-29 | 柳州智臻智能机械有限公司 | 一种电子封装用焊料合金及其制备方法 |
CN112518167A (zh) * | 2018-04-04 | 2021-03-19 | 史国民 | 耐腐蚀低温焊接材料 |
KR102253739B1 (ko) * | 2018-04-13 | 2021-05-18 | 센주긴조쿠고교 가부시키가이샤 | 솔더 페이스트 |
JP6439893B1 (ja) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN108941971B (zh) * | 2018-08-16 | 2020-12-18 | 广东省科学院中乌焊接研究所 | 一种免清洗水性锡膏及其制备方法 |
CN108994479B (zh) * | 2018-08-24 | 2020-08-07 | 温州市星峰新材料有限公司 | 一种耐腐蚀高强度的焊接材料及其制造方法 |
KR102187085B1 (ko) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법 |
JP6649595B1 (ja) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手 |
JP6721851B1 (ja) | 2019-06-28 | 2020-07-15 | 千住金属工業株式会社 | はんだ合金、鋳造物、形成物およびはんだ継手 |
JP6700568B1 (ja) * | 2019-08-09 | 2020-05-27 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手 |
JP6912742B1 (ja) * | 2020-02-14 | 2021-08-04 | 千住金属工業株式会社 | 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手 |
CN111702280B (zh) * | 2020-05-13 | 2021-09-24 | 中国科学院金属研究所 | Ti2AlNb基合金同材或异材钎焊专用中温Ti基钎料及其制备方法和钎焊工艺 |
JP6889387B1 (ja) * | 2020-06-23 | 2021-06-18 | 千住金属工業株式会社 | はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、及びecu電子回路装置 |
CN113182726A (zh) * | 2021-04-07 | 2021-07-30 | 河南鸿昌电子有限公司 | 一种焊接半导体所用的焊锡和焊锡的使用方法 |
CN114871628A (zh) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | 一种低银高强度无铅锡基钎料及其制备方法 |
CN115365699A (zh) * | 2022-09-19 | 2022-11-22 | 云南锡业锡材有限公司 | 一种焊点无微裂纹Sn-Ag-Cu系无铅焊料合金及制备方法 |
CN115815872B (zh) * | 2023-01-09 | 2023-06-27 | 广州汉源新材料股份有限公司 | 一种无铅无锑强化焊料合金及其制备方法 |
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-
2004
- 2004-12-01 GB GB0426383A patent/GB2421030B/en not_active Ceased
-
2005
- 2005-12-01 JP JP2007543916A patent/JP5147409B2/ja active Active
- 2005-12-01 KR KR1020077015074A patent/KR101345677B1/ko active IP Right Grant
- 2005-12-01 WO PCT/GB2005/004609 patent/WO2006059115A1/en active Application Filing
- 2005-12-01 CN CN200580045736XA patent/CN101132881B/zh active Active
- 2005-12-01 PL PL05811506T patent/PL1841561T3/pl unknown
- 2005-12-01 MX MX2007006353A patent/MX2007006353A/es active IP Right Grant
- 2005-12-01 CA CA2589259A patent/CA2589259C/en active Active
- 2005-12-01 US US11/720,578 patent/US9221131B2/en active Active
- 2005-12-01 BR BRPI0518780-0A patent/BRPI0518780B1/pt active IP Right Grant
- 2005-12-01 EP EP05811506.4A patent/EP1841561B1/en active Active
-
2015
- 2015-12-22 US US14/977,853 patent/US20160107267A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CA2589259A1 (en) | 2006-06-08 |
CA2589259C (en) | 2014-11-18 |
US9221131B2 (en) | 2015-12-29 |
BRPI0518780A2 (pt) | 2008-12-09 |
US20080292492A1 (en) | 2008-11-27 |
CN101132881A (zh) | 2008-02-27 |
US20160107267A1 (en) | 2016-04-21 |
EP1841561A1 (en) | 2007-10-10 |
MX2007006353A (es) | 2008-01-22 |
JP5147409B2 (ja) | 2013-02-20 |
EP1841561B1 (en) | 2015-08-12 |
GB0426383D0 (en) | 2005-01-05 |
KR101345677B1 (ko) | 2013-12-30 |
JP2008521619A (ja) | 2008-06-26 |
WO2006059115A1 (en) | 2006-06-08 |
GB2421030B (en) | 2008-03-19 |
CN101132881B (zh) | 2011-02-09 |
BRPI0518780B1 (pt) | 2012-12-11 |
KR20070118588A (ko) | 2007-12-17 |
GB2421030A (en) | 2006-06-14 |
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