NO982053L - Kontaktavbildningsanordning - Google Patents

Kontaktavbildningsanordning

Info

Publication number
NO982053L
NO982053L NO982053A NO982053A NO982053L NO 982053 L NO982053 L NO 982053L NO 982053 A NO982053 A NO 982053A NO 982053 A NO982053 A NO 982053A NO 982053 L NO982053 L NO 982053L
Authority
NO
Norway
Prior art keywords
pieces
row
sensor
sensing circuit
circuit
Prior art date
Application number
NO982053A
Other languages
English (en)
Other versions
NO982053D0 (no
Inventor
Stephen J Borza
Original Assignee
Dew Engineering & Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dew Engineering & Dev Ltd filed Critical Dew Engineering & Dev Ltd
Publication of NO982053D0 publication Critical patent/NO982053D0/no
Publication of NO982053L publication Critical patent/NO982053L/no

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

En fingeravtrykks-føleranordning og et gjenkjennelsessystem innbefatter en regulær oppstilling av halvlederbrikker som er anbrakt med liten avstand fra hverandre, og er heftforankret til et substrat. Brikkene har en minimal avstand fid hverandre som vil sikre at tilstøtende kanter på brikkene ikke stryker mot nverandre når en finger presses ned på dem. Hver brikke innbefatter en rad/kolonne-oppstilling av følerelementer som er koblet til en drivkrets og en avfølingskrets med sett av henholdsvis rad- og kolonne-ledere. Følerelementene er aktivt adresserbare fra drivkretsen. Kapasitanser som resulterer fra individuelle finger-overflatedeler i kombinasjon med følerelektroder, avføles av avfølingskretsen ved at et potensial påføres på følerelektrodene, og oppladningsegenskapene måles.
NO982053A 1995-11-06 1998-05-06 Kontaktavbildningsanordning NO982053L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/554,357 US5907627A (en) 1995-11-06 1995-11-06 Contact imaging device
PCT/CA1996/000718 WO1997017668A1 (en) 1995-11-06 1996-10-30 Contact imaging device

Publications (2)

Publication Number Publication Date
NO982053D0 NO982053D0 (no) 1998-05-06
NO982053L true NO982053L (no) 1998-07-03

Family

ID=24213022

Family Applications (1)

Application Number Title Priority Date Filing Date
NO982053A NO982053L (no) 1995-11-06 1998-05-06 Kontaktavbildningsanordning

Country Status (8)

Country Link
US (1) US5907627A (no)
EP (1) EP0859991B1 (no)
JP (1) JP2000513839A (no)
AU (1) AU7273796A (no)
CA (1) CA2233520A1 (no)
DE (1) DE69618478T2 (no)
NO (1) NO982053L (no)
WO (1) WO1997017668A1 (no)

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US6178255B1 (en) 1998-04-28 2001-01-23 Cross Match Technologies, Inc. Individualized fingerprint scanner
DE19841001C1 (de) * 1998-09-08 2000-04-20 Siemens Ag Verfahren und Vorrichtung zur kapazitiven Bilderfassung
US6346739B1 (en) * 1998-12-30 2002-02-12 Stmicroelectronics, Inc. Static charge dissipation pads for sensors
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US6326227B1 (en) 1998-12-30 2001-12-04 Stmicroelectronics, Inc. Topographical electrostatic protection grid for sensors
US6330145B1 (en) 1998-12-30 2001-12-11 Stmicroelectronics, Inc. Apparatus and method for contacting a sensor conductive layer
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US6886104B1 (en) 1999-06-25 2005-04-26 Cross Match Technologies Rechargeable mobile hand-held fingerprint scanner with a data and power communication interface
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WO2001011544A1 (en) * 1999-08-09 2001-02-15 Cross Match Technologies, Inc. System and method for sending a packet with position address and line scan data over an interface cable
EP1210688A1 (en) * 1999-08-09 2002-06-05 Cross Match Technologies, Inc. Method, system, and computer program product for a gui to fingerprint scanner interface
US7162060B1 (en) 1999-08-09 2007-01-09 Cross Match Technologies Method, system, and computer program product for control of platen movement during a live scan
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US6694269B2 (en) * 2001-04-23 2004-02-17 Sentronics Corporation Capacitive circuit array for fingerprint sensing
AU2002305229A1 (en) * 2001-04-26 2002-11-11 Cross Match Technologies, Inc. Silicone rubber surfaces for biometric print tir prisms
CN1509895A (zh) * 2001-06-22 2004-07-07 ��Τ����˹ 彩色复制方法
US6672174B2 (en) 2001-07-23 2004-01-06 Fidelica Microsystems, Inc. Fingerprint image capture device with a passive sensor array
US6545486B2 (en) * 2001-08-30 2003-04-08 Stmicroelectronics, Inc. Solution and methodology for detecting surface damage on capacitive sensor integrated circuit
KR100432490B1 (ko) * 2001-09-17 2004-05-22 (주)니트 젠 광학식 지문취득 장치
US6867850B2 (en) * 2002-01-17 2005-03-15 Cross Match Technologies, Inc. Light wedge for illuminating a platen in a print scanner
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US6954260B2 (en) * 2002-01-17 2005-10-11 Cross Match Technologies, Inc. Systems and methods for illuminating a platen in a print scanner
KR100447141B1 (ko) * 2002-03-09 2004-09-07 (주)멜파스 차폐수단을 포함하는 반도체 지문감지장치
US6653723B2 (en) * 2002-03-09 2003-11-25 Fujitsu Limited System for providing an open-cavity low profile encapsulated semiconductor package
KR100500691B1 (ko) * 2002-03-12 2005-07-12 비오이 하이디스 테크놀로지 주식회사 화상 표시 모드와 지문 인식 모드를 모두 수행하는 액정디스플레이 장치
KR100500692B1 (ko) * 2002-03-12 2005-07-12 비오이 하이디스 테크놀로지 주식회사 화상 표시 모드와 지문 인식 모드를 모두 수행하는 액정디스플레이 장치
US7079007B2 (en) * 2002-04-19 2006-07-18 Cross Match Technologies, Inc. Systems and methods utilizing biometric data
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US9189675B2 (en) 2011-04-28 2015-11-17 Moon J. Kim Adaptive fingerprint scanning
US8699762B2 (en) 2011-05-13 2014-04-15 Moon J. Kim Multi-sided card having a resistive fingerprint imaging array
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Also Published As

Publication number Publication date
NO982053D0 (no) 1998-05-06
EP0859991B1 (en) 2002-01-09
EP0859991A1 (en) 1998-08-26
AU7273796A (en) 1997-05-29
DE69618478T2 (de) 2002-12-12
US5907627A (en) 1999-05-25
JP2000513839A (ja) 2000-10-17
CA2233520A1 (en) 1997-05-15
WO1997017668A1 (en) 1997-05-15
DE69618478D1 (de) 2002-02-14

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