NO982053D0 - Kontaktavbildningsanordning - Google Patents

Kontaktavbildningsanordning

Info

Publication number
NO982053D0
NO982053D0 NO982053A NO982053A NO982053D0 NO 982053 D0 NO982053 D0 NO 982053D0 NO 982053 A NO982053 A NO 982053A NO 982053 A NO982053 A NO 982053A NO 982053 D0 NO982053 D0 NO 982053D0
Authority
NO
Norway
Prior art keywords
imaging device
contact imaging
contact
imaging
Prior art date
Application number
NO982053A
Other languages
English (en)
Other versions
NO982053L (no
Inventor
Stephen J Borza
Original Assignee
Dew Engineering & Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dew Engineering & Dev Ltd filed Critical Dew Engineering & Dev Ltd
Publication of NO982053D0 publication Critical patent/NO982053D0/no
Publication of NO982053L publication Critical patent/NO982053L/no

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
NO982053A 1995-11-06 1998-05-06 Kontaktavbildningsanordning NO982053L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/554,357 US5907627A (en) 1995-11-06 1995-11-06 Contact imaging device
PCT/CA1996/000718 WO1997017668A1 (en) 1995-11-06 1996-10-30 Contact imaging device

Publications (2)

Publication Number Publication Date
NO982053D0 true NO982053D0 (no) 1998-05-06
NO982053L NO982053L (no) 1998-07-03

Family

ID=24213022

Family Applications (1)

Application Number Title Priority Date Filing Date
NO982053A NO982053L (no) 1995-11-06 1998-05-06 Kontaktavbildningsanordning

Country Status (8)

Country Link
US (1) US5907627A (no)
EP (1) EP0859991B1 (no)
JP (1) JP2000513839A (no)
AU (1) AU7273796A (no)
CA (1) CA2233520A1 (no)
DE (1) DE69618478T2 (no)
NO (1) NO982053L (no)
WO (1) WO1997017668A1 (no)

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US6263090B1 (en) 1997-05-19 2001-07-17 Cross Match Technologies, Inc. Code reader fingerprint scanner
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JP3592487B2 (ja) * 1997-07-02 2004-11-24 日本電信電話株式会社 指紋認識集積回路
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KR20010022575A (ko) * 1997-08-05 2001-03-26 칼 하인쯔 호르닝어 매우 작은 캐패시턴스를 결정하기 위한 방법 및 센서
GB9804539D0 (en) * 1998-03-05 1998-04-29 Philips Electronics Nv Fingerprint sensing devices and systems incorporating such
US6178255B1 (en) 1998-04-28 2001-01-23 Cross Match Technologies, Inc. Individualized fingerprint scanner
DE19841001C1 (de) * 1998-09-08 2000-04-20 Siemens Ag Verfahren und Vorrichtung zur kapazitiven Bilderfassung
US6478976B1 (en) * 1998-12-30 2002-11-12 Stmicroelectronics, Inc. Apparatus and method for contacting a conductive layer
US6686546B2 (en) 1998-12-30 2004-02-03 Stmicroelectronics, Inc. Static charge dissipation for an active circuit surface
US6440814B1 (en) 1998-12-30 2002-08-27 Stmicroelectronics, Inc. Electrostatic discharge protection for sensors
US6346739B1 (en) * 1998-12-30 2002-02-12 Stmicroelectronics, Inc. Static charge dissipation pads for sensors
US6326227B1 (en) 1998-12-30 2001-12-04 Stmicroelectronics, Inc. Topographical electrostatic protection grid for sensors
US6330145B1 (en) 1998-12-30 2001-12-11 Stmicroelectronics, Inc. Apparatus and method for contacting a sensor conductive layer
US6674993B1 (en) * 1999-04-30 2004-01-06 Microvision, Inc. Method and system for identifying data locations associated with real world observations
US6272562B1 (en) 1999-05-28 2001-08-07 Cross Match Technologies, Inc. Access control unit interface
US6744910B1 (en) 1999-06-25 2004-06-01 Cross Match Technologies, Inc. Hand-held fingerprint scanner with on-board image normalization data storage
US6886104B1 (en) 1999-06-25 2005-04-26 Cross Match Technologies Rechargeable mobile hand-held fingerprint scanner with a data and power communication interface
US6423995B1 (en) * 1999-07-26 2002-07-23 Stmicroelectronics, Inc. Scratch protection for direct contact sensors
DE19935910A1 (de) * 1999-07-30 2001-02-08 Siemens Ag Passivierungsschichtstruktur
US7162060B1 (en) 1999-08-09 2007-01-09 Cross Match Technologies Method, system, and computer program product for control of platen movement during a live scan
US6658164B1 (en) * 1999-08-09 2003-12-02 Cross Match Technologies, Inc. Calibration and correction in a fingerprint scanner
EP1210688A1 (en) * 1999-08-09 2002-06-05 Cross Match Technologies, Inc. Method, system, and computer program product for a gui to fingerprint scanner interface
JP2003506793A (ja) * 1999-08-09 2003-02-18 クロス マッチ テクノロジーズ， インコーポレイテッド インターフェイスケーブルを介して位置アドレスおよびラインスキャンデータを有するパケットを送信するシステムおよび方法
US6483932B1 (en) * 1999-08-19 2002-11-19 Cross Match Technologies, Inc. Method and apparatus for rolled fingerprint capture
GB9922572D0 (en) * 1999-09-24 1999-11-24 Koninkl Philips Electronics Nv Capacitive sensing array devices
GB9922570D0 (en) * 1999-09-24 1999-11-24 Koninkl Philips Electronics Nv Capacitive sensing array devices
JP2003512873A (ja) 1999-10-22 2003-04-08 クロス マッチ テクノロジーズ， インコーポレイテッド 可動性プリズムプラテンを有するテンプリントスキャナにおける調節可能な回転式フィンガーガイド
US7239227B1 (en) * 1999-12-30 2007-07-03 Upek, Inc. Command interface using fingerprint sensor input system
US7565541B1 (en) * 2000-06-21 2009-07-21 Microvision, Inc. Digital fingerprint identification system
AU2001222942A1 (en) * 2000-08-18 2002-03-04 Cross Match Technologies, Inc. Fingerprint scanner auto-capture system and method
US6694269B2 (en) * 2001-04-23 2004-02-17 Sentronics Corporation Capacitive circuit array for fingerprint sensing
AU2002305229A1 (en) * 2001-04-26 2002-11-11 Cross Match Technologies, Inc. Silicone rubber surfaces for biometric print tir prisms
CN1509895A (zh) * 2001-06-22 2004-07-07 ��Τ����˹ 彩色复制方法
US6672174B2 (en) 2001-07-23 2004-01-06 Fidelica Microsystems, Inc. Fingerprint image capture device with a passive sensor array
US6545486B2 (en) * 2001-08-30 2003-04-08 Stmicroelectronics, Inc. Solution and methodology for detecting surface damage on capacitive sensor integrated circuit
KR100432490B1 (ko) * 2001-09-17 2004-05-22 (주)니트 젠 광학식 지문취득 장치
US6867850B2 (en) * 2002-01-17 2005-03-15 Cross Match Technologies, Inc. Light wedge for illuminating a platen in a print scanner
AU2003207563A1 (en) * 2002-01-17 2003-09-02 Cross Match Technologies, Inc. Fingerprint workstation and methods
US6954260B2 (en) * 2002-01-17 2005-10-11 Cross Match Technologies, Inc. Systems and methods for illuminating a platen in a print scanner
KR100447141B1 (ko) * 2002-03-09 2004-09-07 (주)멜파스 차폐수단을 포함하는 반도체 지문감지장치
US6653723B2 (en) * 2002-03-09 2003-11-25 Fujitsu Limited System for providing an open-cavity low profile encapsulated semiconductor package
KR100500692B1 (ko) * 2002-03-12 2005-07-12 비오이 하이디스 테크놀로지 주식회사 화상 표시 모드와 지문 인식 모드를 모두 수행하는 액정디스플레이 장치
KR100500691B1 (ko) * 2002-03-12 2005-07-12 비오이 하이디스 테크놀로지 주식회사 화상 표시 모드와 지문 인식 모드를 모두 수행하는 액정디스플레이 장치
US7079007B2 (en) * 2002-04-19 2006-07-18 Cross Match Technologies, Inc. Systems and methods utilizing biometric data
US7073711B2 (en) * 2002-04-19 2006-07-11 Cross Match Technologies, Inc. Mobile handheld code reader and print scanner system and method
US7006078B2 (en) * 2002-05-07 2006-02-28 Mcquint, Inc. Apparatus and method for sensing the degree and touch strength of a human body on a sensor
US6806454B1 (en) * 2002-05-31 2004-10-19 Analog Devices, Inc. Image sensors with via-coupled photoconductive mediums
WO2004013801A2 (en) * 2002-08-02 2004-02-12 Cross Match Technologies, Inc. System and method for counting ridges in a captured print image
JP2005536792A (ja) * 2002-08-21 2005-12-02 セキユジエン・コーポレイシヨン 改良された撮像表面を有するｔｆｔ検出装置
CN100437635C (zh) * 2002-09-10 2008-11-26 艾维智能技术有限公司 安全的生物身份验证
CZ2005209A3 (cs) * 2002-09-10 2005-12-14 Ivi Smart Technologies, Inc. Bezpečné biometrické ověření identity
US7164440B2 (en) * 2003-02-28 2007-01-16 Cross Match Technologies, Inc. Dynamic image adaptation method for adjusting the quality of digital prints
US20050047631A1 (en) * 2003-08-26 2005-03-03 Cross Match Technologies, Inc. Method and apparatus for rolled fingerprint image capture with variable blending
DE602004017768D1 (de) * 2003-09-24 2008-12-24 Authentec Inc Biometrischer fingersensor mit über dünnfilm- und brennkristall-substrate verteilter sensorelektronik und diesbezügliche verfahren
US20050094855A1 (en) * 2003-10-29 2005-05-05 Proano Cesar H. Fingerprint imaging using a flat panel detector
JP4440603B2 (ja) * 2003-11-06 2010-03-24 アルプス電気株式会社 容量検出回路及び検出方法並びにそれを用いた指紋センサ
US8918900B2 (en) * 2004-04-26 2014-12-23 Ivi Holdings Ltd. Smart card for passport, electronic passport, and method, system, and apparatus for authenticating person holding smart card or electronic passport
US20100131414A1 (en) * 2007-03-14 2010-05-27 Gavin Randall Tame Personal identification device for secure transactions
CN102272816B (zh) * 2008-11-05 2014-07-02 奈克斯特生物测定学公司 通过降低噪声的差分通道的用于大型传感器阵列的电压读取技术
US9060146B2 (en) 2009-01-06 2015-06-16 Next Biometrics Group Asa Low noise reading architecture for active sensor arrays
US9189675B2 (en) 2011-04-28 2015-11-17 Moon J. Kim Adaptive fingerprint scanning
US8699762B2 (en) 2011-05-13 2014-04-15 Moon J. Kim Multi-sided card having a resistive fingerprint imaging array
US8675928B2 (en) 2011-06-14 2014-03-18 Moon J. Kim Multiple charge-coupled biometric sensor array
US8836478B2 (en) * 2011-09-25 2014-09-16 Authentec, Inc. Electronic device including finger sensor and related methods
TWI564817B (zh) * 2014-08-20 2017-01-01 速博思股份有限公司 組合式感應之指紋辨識裝置及方法
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
TW201721492A (zh) * 2015-12-10 2017-06-16 台瀚科技股份有限公司 三明治式指紋辨識裝置
US10242244B2 (en) * 2016-01-27 2019-03-26 Japan Display Inc. Fingerprint detection device and display device
CN107203737A (zh) * 2016-03-17 2017-09-26 台瀚科技股份有限公司 具有光学膜的薄型化指纹辨识装置
US10073305B2 (en) * 2016-10-07 2018-09-11 Keycore Technology Corp. Liquid crystal device with fingerprint identification function
US10073288B2 (en) * 2016-10-07 2018-09-11 Keycore Technology Corp. Liquid crystal module with fingerprint identification function
US10055637B2 (en) * 2016-12-07 2018-08-21 Synaptics Incorporated Optical sensor with substrate light filter
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Also Published As

Publication number Publication date
DE69618478T2 (de) 2002-12-12
DE69618478D1 (de) 2002-02-14
AU7273796A (en) 1997-05-29
EP0859991B1 (en) 2002-01-09
CA2233520A1 (en) 1997-05-15
NO982053L (no) 1998-07-03
JP2000513839A (ja) 2000-10-17
EP0859991A1 (en) 1998-08-26
US5907627A (en) 1999-05-25
WO1997017668A1 (en) 1997-05-15

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application