NO930197L - Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver - Google Patents

Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver

Info

Publication number
NO930197L
NO930197L NO93930197A NO930197A NO930197L NO 930197 L NO930197 L NO 930197L NO 93930197 A NO93930197 A NO 93930197A NO 930197 A NO930197 A NO 930197A NO 930197 L NO930197 L NO 930197L
Authority
NO
Norway
Prior art keywords
semiconductor
setting
environment
plate
setting surface
Prior art date
Application number
NO93930197A
Other languages
English (en)
Other versions
NO930197D0 (no
Inventor
Joseph Prusak
Anthony Bassaro
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of NO930197D0 publication Critical patent/NO930197D0/no
Publication of NO930197L publication Critical patent/NO930197L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Jigs For Machine Tools (AREA)
  • Clamps And Clips (AREA)

Abstract

En anordning (10) til oppnåelse av ensartet innstilling av en halvledersklve som underkastes bearbeiding innbefatter en plate (38) hvorpå en omgivelse (14) er stilt inn. Omgivelsen (14) er stilt inn på platen (38) ved sammenpassende to pinner (42), (40), som stikker opp fra platen (38) til et hull (44) og et spor (46) i omgivelsen (14). En første innstillingsflate (16) for innstilling av et flatt parti (20) på en halvlederskive (12) er fast montert på omgivelsen (14). En andre innstillingsflate (18) for innstilling av et punkt (24) på omkretsen av halvledersklven (12) er fast montert på omgivelsen (14). En tredje stillbar innstillingsflate (26) stiller også inn mot et punkt (28) på omkretsen av skiven (12). Denne tredje innstillingsflate (26) er fjærbelastet for å ta hensyn til små diametervaria- sjoner på på hverandre følgende behandlede halv- lederskiver og for å utøve en kraft som holder skiven (12 ) på plass.
NO93930197A 1992-01-24 1993-01-21 Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver NO930197L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/825,520 US5180150A (en) 1992-01-24 1992-01-24 Apparatus for providing consistent registration of semiconductor wafers

Publications (2)

Publication Number Publication Date
NO930197D0 NO930197D0 (no) 1993-01-21
NO930197L true NO930197L (no) 1993-07-26

Family

ID=25244210

Family Applications (1)

Application Number Title Priority Date Filing Date
NO93930197A NO930197L (no) 1992-01-24 1993-01-21 Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver

Country Status (6)

Country Link
US (1) US5180150A (no)
EP (1) EP0552966B1 (no)
JP (1) JPH0746695B2 (no)
DE (1) DE69300284T2 (no)
IL (1) IL104267A (no)
NO (1) NO930197L (no)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352249A (en) * 1992-08-28 1994-10-04 Hughes Aircraft Company Apparatus for providing consistent, non-jamming registration of semiconductor wafers
US5700297A (en) * 1992-08-28 1997-12-23 Ipec Precision, Inc. Apparatus for providing consistent, non-jamming registration of notched semiconductor wafers
US5280894A (en) * 1992-09-30 1994-01-25 Honeywell Inc. Fixture for backside wafer etching
IL109193A0 (en) * 1993-04-12 1994-06-24 Hughes Aircraft Co Apparatus and method for providing consistent, nonjamming registration of notched semiconductor wafers
US5701013A (en) * 1996-06-07 1997-12-23 Mosel Viltelic, Inc. Wafer metrology pattern integrating both overlay and critical dimension features for SEM or AFM measurements
US6388226B1 (en) 1997-06-26 2002-05-14 Applied Science And Technology, Inc. Toroidal low-field reactive gas source
US7569790B2 (en) * 1997-06-26 2009-08-04 Mks Instruments, Inc. Method and apparatus for processing metal bearing gases
US8779322B2 (en) 1997-06-26 2014-07-15 Mks Instruments Inc. Method and apparatus for processing metal bearing gases
US6150628A (en) * 1997-06-26 2000-11-21 Applied Science And Technology, Inc. Toroidal low-field reactive gas source
US7166816B1 (en) 1997-06-26 2007-01-23 Mks Instruments, Inc. Inductively-coupled torodial plasma source
US6815633B1 (en) 1997-06-26 2004-11-09 Applied Science & Technology, Inc. Inductively-coupled toroidal plasma source
DE19856102C2 (de) * 1998-12-04 2003-11-20 Tyco Electronics Logistics Ag Transportsystem für Kleinbauteile
US6367635B1 (en) * 1999-09-30 2002-04-09 Auer Precision Company, Inc. Ultra precision process carrier for semi-conductor manufacturing
KR200435062Y1 (ko) * 2006-08-22 2007-01-09 (주)테크윙 테스트핸들러용 하이픽스보드 클램핑장치
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
US8271120B2 (en) * 2009-08-03 2012-09-18 Lawrence Livermore National Security, Llc Method and system for processing optical elements using magnetorheological finishing
EP2777069A4 (en) 2011-11-08 2015-01-14 Intevac Inc SUBSTRATE PROCESSING SYSTEM AND METHOD

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55148433A (en) * 1979-05-08 1980-11-19 Nec Corp Manufacture of semiconductor device and device therefor
GB2146935B (en) * 1983-08-18 1986-10-22 Plessey Co Plc Jigs for locating electrical components
US4703920A (en) * 1986-08-25 1987-11-03 Amp Incorporated Manufacturing method for integrated circuit chip carriers and work holder for use in the method
JP2508540B2 (ja) * 1987-11-02 1996-06-19 三菱マテリアル株式会社 ウェ―ハの位置検出装置
JPS63296237A (ja) * 1988-04-22 1988-12-02 Hitachi Ltd ウエーハの自動アライメント方法
FR2633452B1 (fr) * 1988-06-28 1990-11-02 Doue Julien Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur
US4970772A (en) * 1989-12-05 1990-11-20 Sulzer Brothers Limited Wafer alignment fixture

Also Published As

Publication number Publication date
JPH0613451A (ja) 1994-01-21
US5180150A (en) 1993-01-19
JPH0746695B2 (ja) 1995-05-17
IL104267A0 (en) 1993-05-13
EP0552966A1 (en) 1993-07-28
IL104267A (en) 1994-07-31
DE69300284D1 (de) 1995-08-31
EP0552966B1 (en) 1995-07-26
NO930197D0 (no) 1993-01-21
DE69300284T2 (de) 1995-12-21

Similar Documents

Publication Publication Date Title
NO930197L (no) Anordning for aa tilveiebringe sammenhengende registreringav halvlederskiver
TW369457B (en) Apparatus for applying an urging force to a wafer
EP0392516A3 (en) Plasma processing device
WO2001097260A3 (en) Holder for a substrate cassette and device provided with such a holder
KR950012672A (ko) 기판을 처리 챔버내의 지지 수단에 해제 가능하게 클램핑하기 위한 장치 및 방법
MY121995A (en) Apparatus for mirror-polishing thin plate.
EP0398589A3 (en) Perimeter wafer seal and method of using the same
ES2010615A6 (es) Tornillo de banco de maquina con amplificador de potencia.
AU7540791A (en) Process for making a versatile clamping device designed to hold objects without damaging them, such a device and its use
US2467600A (en) Clamp having spring-pressed movable jaw actuated by cam-advanced and spring-retracted pressure plate
ES445862A1 (es) Un dispositivo de fijacion para fijar un registro portador de informacion en forma de disco con un agujero central.
DE50006720D1 (de) Spanneinrichtung
ES367186A1 (es) Embrague de friccion.
ES2021785B3 (es) Dispositivo para el centrado y apriete de piezas de trabajo
CA2006463A1 (en) Device for tightly attaching a fragile object
GB843383A (en) Improvements in and relating to a drawing table
GB1040184A (en) Automatic record changer
GB766545A (en) Improvements in or relating to clamping devices
JPS6449887A (en) Pasting device of frame to mount semiconductor wafer
GB909656A (en) Improvements relating to chucks
JPS6470734A (en) Z-theta fine adjustment table
JPS6425446A (en) Mounting structure of semiconductor device on heat sink
SU541631A2 (ru) Универсальный прихват дл закреплени деталей
KR910010647A (ko) Sog를 이용한 soi소자 제조방법
JPS6464161A (en) Disk aligning device