NO893734D0 - Uv-herdbare blandinger for fremstilling av loddemaskeringsbelegg. - Google Patents

Uv-herdbare blandinger for fremstilling av loddemaskeringsbelegg.

Info

Publication number
NO893734D0
NO893734D0 NO893734A NO893734A NO893734D0 NO 893734 D0 NO893734 D0 NO 893734D0 NO 893734 A NO893734 A NO 893734A NO 893734 A NO893734 A NO 893734A NO 893734 D0 NO893734 D0 NO 893734D0
Authority
NO
Norway
Prior art keywords
sold
preparing
hardenable mixtures
coats
masking
Prior art date
Application number
NO893734A
Other languages
English (en)
Other versions
NO893734L (no
Inventor
Paul Ling Kong Hung
Kenneth Kuo-Shu Tseng
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Publication of NO893734D0 publication Critical patent/NO893734D0/no
Publication of NO893734L publication Critical patent/NO893734L/no

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
NO89893734A 1988-09-20 1989-09-19 Uv-herdbare blandinger for fremstilling av loddemaskeringsbelegg. NO893734L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/247,052 US5006436A (en) 1988-09-20 1988-09-20 UV curable compositions for making tentable solder mask coating

Publications (2)

Publication Number Publication Date
NO893734D0 true NO893734D0 (no) 1989-09-19
NO893734L NO893734L (no) 1990-03-21

Family

ID=22933355

Family Applications (1)

Application Number Title Priority Date Filing Date
NO89893734A NO893734L (no) 1988-09-20 1989-09-19 Uv-herdbare blandinger for fremstilling av loddemaskeringsbelegg.

Country Status (13)

Country Link
US (1) US5006436A (no)
EP (1) EP0360579A1 (no)
JP (1) JPH02210443A (no)
KR (1) KR900005230A (no)
CN (1) CN1043397A (no)
AU (1) AU4145989A (no)
BR (1) BR8904708A (no)
DK (1) DK461589A (no)
FI (1) FI894430A (no)
IL (1) IL91686A0 (no)
NO (1) NO893734L (no)
PT (1) PT91735A (no)
ZA (1) ZA897138B (no)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420171A (en) * 1991-12-31 1995-05-30 Tech Spray, Inc. UV curable temporary solder mask
JPH06295060A (ja) * 1992-10-29 1994-10-21 Ajinomoto Co Inc 感光性樹脂組成物又は感光性熱硬化性樹脂組成物及びそれらを使用したフォトソルダ−レジスト組成物
WO1994017452A1 (en) * 1993-01-20 1994-08-04 Agfa-Gevaert Naamloze Vennootschap Photopolymerizable composition of high sensitivity and method for obtaining images therewith
ES2136838T3 (es) * 1994-03-04 1999-12-01 Asahi Chemical Ind Composicion de resina fotosensible liquida a utilizar en la formacion de una estructura de relieve.
JP2000502463A (ja) 1995-12-21 2000-02-29 ザ ダウ ケミカル カンパニー はんだマスク組成物
US5707782A (en) * 1996-03-01 1998-01-13 The Board Of Trustees Of The University Of Illinois Photoimageable, dielectric, crosslinkable copolyesters
EP0860742B1 (en) * 1997-02-25 2001-04-04 E.I. Du Pont De Nemours And Company Flexible, flame-retardant, photoimageable composition for coating printing circuits
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
EP1042410A1 (en) * 1997-11-06 2000-10-11 The Edgington Company Coating composition
ES2260825T3 (es) 1997-12-02 2006-11-01 Ciba Specialty Chemicals Holding Inc. Materiales poliolefinicos que tienen durabilidad superficial mejorada y metodos para su obtencion mediante exposicion a radiacion.
US6331317B1 (en) * 1999-11-12 2001-12-18 Alkermes Controlled Therapeutics Ii Inc. Apparatus and method for preparing microparticles
AU2001284499A1 (en) * 2000-09-11 2002-03-26 Showa Denko K K Photosensitive composition, cured article thereof, and printed circuit board using the same
US6762231B2 (en) * 2000-12-15 2004-07-13 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6667357B2 (en) 2000-12-15 2003-12-23 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US6927247B2 (en) * 2000-12-15 2005-08-09 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
US7312266B2 (en) * 2000-12-15 2007-12-25 The College Of William And Mary Organic thiol metal-free stabilizers and plasticizers for halogen-containing polymers
JP4581706B2 (ja) * 2004-01-29 2010-11-17 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4587865B2 (ja) * 2004-04-22 2010-11-24 昭和電工株式会社 感光性樹脂組成物及びその硬化物並びにそれらを使用するプリント配線基板の製造方法
JP2007010785A (ja) * 2005-06-28 2007-01-18 Fujifilm Holdings Corp 永久パターン形成方法
TWI426351B (zh) * 2006-11-15 2014-02-11 Taiyo Holdings Co Ltd Photolithography (Phototool) and the formation of resistance to resistance pattern
JP6361944B1 (ja) * 2017-01-24 2018-07-25 東洋インキＳｃホールディングス株式会社 カラーフィルタ用感光性組成物及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3048502A1 (de) * 1980-12-22 1982-07-22 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial
US4422914A (en) * 1981-01-16 1983-12-27 W. R. Grace & Co. Polymer composition having terminal alkene and terminal carboxyl groups
JPS5986045A (ja) * 1982-11-05 1984-05-18 Nippon Soda Co Ltd 永久レジスト用光硬化性樹脂組成物
US4572890A (en) * 1983-05-11 1986-02-25 Ciba-Geigy Corporation Process for the production of images
DE3412992A1 (de) * 1984-04-06 1985-10-24 Hoechst Ag, 6230 Frankfurt Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
US4849320A (en) * 1986-05-10 1989-07-18 Ciba-Geigy Corporation Method of forming images

Also Published As

Publication number Publication date
ZA897138B (en) 1990-06-27
FI894430A0 (fi) 1989-09-19
CN1043397A (zh) 1990-06-27
PT91735A (pt) 1990-03-30
DK461589D0 (da) 1989-09-19
FI894430A (fi) 1990-03-21
AU4145989A (en) 1990-03-29
IL91686A0 (en) 1990-04-29
KR900005230A (ko) 1990-04-13
US5006436A (en) 1991-04-09
BR8904708A (pt) 1990-05-01
JPH02210443A (ja) 1990-08-21
NO893734L (no) 1990-03-21
EP0360579A1 (en) 1990-03-28
DK461589A (da) 1990-03-21

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