NO20022132D0 - Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse - Google Patents
Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelseInfo
- Publication number
- NO20022132D0 NO20022132D0 NO20022132A NO20022132A NO20022132D0 NO 20022132 D0 NO20022132 D0 NO 20022132D0 NO 20022132 A NO20022132 A NO 20022132A NO 20022132 A NO20022132 A NO 20022132A NO 20022132 D0 NO20022132 D0 NO 20022132D0
- Authority
- NO
- Norway
- Prior art keywords
- component
- solder material
- providing
- soldered connection
- cooled
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Tunnel Furnaces (AREA)
- Coating With Molten Metal (AREA)
- Heat Treatment Of Articles (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19953654A DE19953654A1 (de) | 1999-11-08 | 1999-11-08 | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
PCT/DE2000/003848 WO2001034334A1 (de) | 1999-11-08 | 2000-11-02 | Verfahren und vorrichtung zur herstellung einer lotverbindung |
Publications (3)
Publication Number | Publication Date |
---|---|
NO20022132D0 true NO20022132D0 (no) | 2002-05-03 |
NO20022132L NO20022132L (no) | 2002-05-03 |
NO323074B1 NO323074B1 (no) | 2006-12-27 |
Family
ID=7928273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20022132A NO323074B1 (no) | 1999-11-08 | 2002-05-03 | Fremgangsmate og anordning for a tilveiebringe en loddet forbindelse |
Country Status (19)
Country | Link |
---|---|
US (1) | US6796483B1 (no) |
EP (1) | EP1233841B1 (no) |
JP (1) | JP4727110B2 (no) |
KR (1) | KR100645984B1 (no) |
CN (1) | CN1275730C (no) |
AT (1) | ATE297829T1 (no) |
AU (1) | AU779191B2 (no) |
CA (1) | CA2390498C (no) |
CZ (1) | CZ302495B6 (no) |
DE (2) | DE19953654A1 (no) |
DK (1) | DK1233841T3 (no) |
ES (1) | ES2243338T3 (no) |
HU (1) | HU225907B1 (no) |
IL (2) | IL149489A0 (no) |
MX (1) | MXPA02004579A (no) |
NO (1) | NO323074B1 (no) |
PL (1) | PL194904B1 (no) |
PT (1) | PT1233841E (no) |
WO (1) | WO2001034334A1 (no) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3770238B2 (ja) * | 2002-03-22 | 2006-04-26 | セイコーエプソン株式会社 | 電子デバイス製造装置および電子デバイスの製造方法 |
DE10304774B3 (de) * | 2003-02-05 | 2004-07-15 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Temperaturbeaufschlagung von Werkstücken |
JP4537019B2 (ja) * | 2003-06-04 | 2010-09-01 | 古河スカイ株式会社 | アルミニウム材のろう付け方法 |
DE102004047359B3 (de) * | 2004-09-29 | 2006-01-26 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Verfahren und Vorrichtung zur Regelung und Überwachung eines Lötprozesses |
US7845540B2 (en) * | 2005-08-30 | 2010-12-07 | Micron Technology, Inc. | Systems and methods for depositing conductive material into openings in microfeature workpieces |
DE502007006611D1 (de) | 2006-05-29 | 2011-04-14 | Kirsten Soldering Ag | Lötanlage mit lötmodulen und mindestens einer mobilen und auswechselbar in einem lötmodul einsetzbaren lötstation ; entsprechende stand-by station |
DE102006029593A1 (de) * | 2006-05-29 | 2007-12-13 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
CN101454107B (zh) * | 2006-05-29 | 2013-03-27 | 平克塞莫***有限公司 | 对工件或元件进行温度处理的方法和装置 |
DE102006034600B4 (de) * | 2006-07-26 | 2010-01-14 | Infineon Technologies Ag | Verfahren zur Herstellung einer Lötverbindung |
US7793819B2 (en) | 2007-03-19 | 2010-09-14 | Infineon Technologies Ag | Apparatus and method for connecting a component with a substrate |
KR101370807B1 (ko) | 2007-08-29 | 2014-03-07 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 반도체 워크피스 열처리 방법 및 장치 |
DE102008021240B4 (de) * | 2008-04-28 | 2012-11-22 | Ersa Gmbh | Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung |
DE102011081606B4 (de) * | 2011-08-26 | 2022-08-04 | Infineon Technologies Ag | Kühlvorrichtung und Lötanlage |
JP5778731B2 (ja) * | 2012-09-17 | 2015-09-16 | ピーエスケー・インコーポレーテッド | 連続線形熱処理装置の配列 |
CN102896391B (zh) * | 2012-10-15 | 2015-10-07 | 泗阳群鑫电子有限公司 | 一种链式真空炉 |
US9733130B2 (en) * | 2013-05-10 | 2017-08-15 | Illinois Tool Works Inc. | Temperature sensor belt |
DE102014106631B4 (de) | 2013-05-10 | 2021-12-02 | Seho Systemtechnik Gmbh | Vorrichtung und Verfahren zum Herstellen von Lötverbindungen |
JP2015009262A (ja) * | 2013-07-01 | 2015-01-19 | 三菱電機株式会社 | リフロー装置 |
WO2016091962A1 (de) * | 2014-12-09 | 2016-06-16 | Pink Gmbh Thermosysteme | Wärmeübertragungsvorrichtung für die lötverbindungsherstellung elektrischer bauteile |
DE102016103213A1 (de) * | 2016-02-24 | 2017-08-24 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur der inhomogenen Abkühlung eines flächigen Gegenstandes |
CN107855623B (zh) * | 2017-12-29 | 2023-07-18 | 山东才聚电子科技有限公司 | 一种真空焊接炉控制***及其控制方法 |
CN109059543A (zh) * | 2018-07-16 | 2018-12-21 | 苏州洛特兰新材料科技有限公司 | 一种用于陶瓷材料生产的工业窑炉 |
DE102019211212A1 (de) | 2019-07-29 | 2021-02-04 | Rehm Thermal Systems Gmbh | Mechatronischer Vorhang für eine Prozesskammer zur Durchführung thermischer Prozesse in der Fertigung elektronischer Baugruppen |
CN113543514B (zh) * | 2020-04-15 | 2022-09-23 | 昆山达菲乐电子产品有限公司 | 回焊炉 |
KR102572094B1 (ko) * | 2020-05-15 | 2023-08-30 | 핑크 게엠베하 써모시스테메 | 전자 조립체들을 연결하기 위한 시스템 |
CN115922172B (zh) * | 2023-03-14 | 2023-06-02 | 无锡昌鼎电子有限公司 | 一种在线式真空焊接炉组装设备及其组装方法 |
CN117139941A (zh) * | 2023-10-30 | 2023-12-01 | 北京中科同志科技股份有限公司 | 真空***及其工作方法 |
Family Cites Families (38)
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US3882596A (en) * | 1972-11-09 | 1975-05-13 | Vaw Ver Aluminium Werke Ag | Method of flux-free soldering of aluminum-containing workpieces in a controlled atmosphere |
JPS5091031A (no) * | 1973-12-17 | 1975-07-21 | ||
US3926415A (en) * | 1974-01-23 | 1975-12-16 | Park Ohio Industries Inc | Method and apparatus for carbonizing and degassing workpieces |
JPS54118358A (en) * | 1978-03-07 | 1979-09-13 | Toyo Radiator Kk | Production of aluminum heat exchanger |
JPS54125832A (en) * | 1978-03-23 | 1979-09-29 | Tobishima Construct Co Ltd | Yoke for slip form |
CS201367B1 (en) * | 1978-11-17 | 1980-11-28 | Jozef Husar | Method of capillary soldering of hollow steel products particularly the cover knifes in the vacuum or in the protective atmosphere of inert gas |
JPS58217625A (ja) * | 1982-06-09 | 1983-12-17 | Daido Steel Co Ltd | 熱処理装置 |
US4568277A (en) * | 1983-12-20 | 1986-02-04 | International Business Machines Corporation | Apparatus for heating objects to and maintaining them at a desired temperature |
JPS61125618A (ja) | 1984-11-24 | 1986-06-13 | Ohkura Electric Co Ltd | パタ−ン切換式温度制御装置 |
JPS61206667A (ja) * | 1985-03-09 | 1986-09-12 | Matsushita Electric Ind Co Ltd | ドツトプリンタ用印字ヘツド |
US4804128A (en) | 1986-12-04 | 1989-02-14 | General Motors Corporation | Vacuum brazing of aluminum alloy workpieces |
JPS63177961A (ja) * | 1987-01-19 | 1988-07-22 | Koki:Kk | 予熱ヒ−タ自動制御方法 |
DE3737563A1 (de) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | Loetmaschine |
JPH0714353Y2 (ja) * | 1988-07-08 | 1995-04-05 | 中外炉工業株式会社 | ローラハース型熱処理炉 |
JP2858009B2 (ja) * | 1988-08-02 | 1999-02-17 | 利光 武者 | ゆらぎ照明装置 |
JPH0244694A (ja) * | 1988-08-04 | 1990-02-14 | Matsushita Graphic Commun Syst Inc | 原稿照明装置 |
DE3843191C2 (de) * | 1988-12-22 | 1994-09-15 | Broadcast Television Syst | Vorrichtung zum Löten |
JP2750747B2 (ja) * | 1989-09-20 | 1998-05-13 | 日本真空技術株式会社 | 連続式真空ろう付炉 |
DE3934103A1 (de) * | 1989-10-12 | 1991-04-25 | Ipsen Ind Int Gmbh | Ofen zur partiellen waermebehandlung von werkzeugen |
US5341980A (en) * | 1990-02-19 | 1994-08-30 | Hitachi, Ltd. | Method of fabricating electronic circuit device and apparatus for performing the same method |
JP3066436B2 (ja) * | 1990-09-05 | 2000-07-17 | 東洋ラジエーター株式会社 | 熱交換器の真空ろう付け方法 |
US5128506A (en) * | 1990-10-30 | 1992-07-07 | Westinghouse Electric Corp. | Method and apparatus for selective infrared soldering using shielding fixtures |
CS609090A3 (en) * | 1990-12-07 | 1992-06-17 | Vyzk Ustav Zvaracsky | Process of cladding metallic materials with a solder foil |
US5516031A (en) * | 1991-02-19 | 1996-05-14 | Hitachi, Ltd. | Soldering method and apparatus for use in connecting electronic circuit devices |
US5147083A (en) * | 1991-09-25 | 1992-09-15 | General Motors Corporation | Method and apparatus for convection brazing of aluminum heat exchangers |
JPH05308186A (ja) * | 1991-11-06 | 1993-11-19 | Sanden Corp | ろう付加熱装置 |
JPH05161961A (ja) * | 1991-11-14 | 1993-06-29 | Tamura Seisakusho Co Ltd | リフロー炉 |
NL9202279A (nl) * | 1992-07-29 | 1994-02-16 | Soltec Bv | Reflow-soldeermachine. |
JPH07115169B2 (ja) * | 1992-08-11 | 1995-12-13 | 株式会社サーマル | ろう付け連続装置 |
US5439160A (en) * | 1993-03-31 | 1995-08-08 | Siemens Corporate Research, Inc. | Method and apparatus for obtaining reflow oven settings for soldering a PCB |
US5341978A (en) | 1993-08-16 | 1994-08-30 | General Motors Corporation | Braze furnace with improved inert gas system |
DE4432730A1 (de) | 1994-09-14 | 1996-03-21 | Emitec Emissionstechnologie | Verfahren zur Herstellung einer metallischen Struktur |
JPH08125099A (ja) * | 1994-10-28 | 1996-05-17 | Toshiba Corp | 半導体装置の製造方法 |
DE29505496U1 (de) * | 1995-03-31 | 1995-06-01 | Ipsen Industries International GmbH, 47533 Kleve | Vorrichtung zur Wärmebehandlung metallischer Werkstücke unter Vakuum |
JP2793528B2 (ja) * | 1995-09-22 | 1998-09-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハンダ付け方法、ハンダ付け装置 |
JPH10339377A (ja) * | 1997-06-06 | 1998-12-22 | Nec Corp | ゲートバルブ |
US6039236A (en) * | 1997-06-11 | 2000-03-21 | Soltec B.V. | Reflow soldering apparatus with improved cooling |
JPH1177294A (ja) * | 1997-08-28 | 1999-03-23 | Toyota Motor Corp | 減圧ロウ付け方法 |
-
1999
- 1999-11-08 DE DE19953654A patent/DE19953654A1/de not_active Ceased
-
2000
- 2000-11-02 AU AU25010/01A patent/AU779191B2/en not_active Ceased
- 2000-11-02 US US10/129,575 patent/US6796483B1/en not_active Expired - Lifetime
- 2000-11-02 CA CA002390498A patent/CA2390498C/en not_active Expired - Lifetime
- 2000-11-02 WO PCT/DE2000/003848 patent/WO2001034334A1/de active IP Right Grant
- 2000-11-02 EP EP00988556A patent/EP1233841B1/de not_active Expired - Lifetime
- 2000-11-02 PL PL355529A patent/PL194904B1/pl unknown
- 2000-11-02 PT PT00988556T patent/PT1233841E/pt unknown
- 2000-11-02 DE DE50010577T patent/DE50010577D1/de not_active Expired - Lifetime
- 2000-11-02 CZ CZ20021603A patent/CZ302495B6/cs not_active IP Right Cessation
- 2000-11-02 CN CNB008154392A patent/CN1275730C/zh not_active Expired - Lifetime
- 2000-11-02 DK DK00988556T patent/DK1233841T3/da active
- 2000-11-02 IL IL14948900A patent/IL149489A0/xx active IP Right Grant
- 2000-11-02 MX MXPA02004579A patent/MXPA02004579A/es active IP Right Grant
- 2000-11-02 JP JP2001536316A patent/JP4727110B2/ja not_active Expired - Lifetime
- 2000-11-02 AT AT00988556T patent/ATE297829T1/de active
- 2000-11-02 ES ES00988556T patent/ES2243338T3/es not_active Expired - Lifetime
- 2000-11-02 HU HU0203145A patent/HU225907B1/hu unknown
- 2000-11-02 KR KR1020027005763A patent/KR100645984B1/ko active IP Right Grant
-
2002
- 2002-05-03 NO NO20022132A patent/NO323074B1/no not_active IP Right Cessation
- 2002-05-06 IL IL149489A patent/IL149489A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HUP0203145A2 (en) | 2002-12-28 |
PL194904B1 (pl) | 2007-07-31 |
US6796483B1 (en) | 2004-09-28 |
CA2390498C (en) | 2009-06-30 |
NO323074B1 (no) | 2006-12-27 |
HU225907B1 (en) | 2007-12-28 |
CN1387468A (zh) | 2002-12-25 |
WO2001034334A1 (de) | 2001-05-17 |
CA2390498A1 (en) | 2001-05-17 |
JP2003517376A (ja) | 2003-05-27 |
DK1233841T3 (da) | 2005-10-10 |
ES2243338T3 (es) | 2005-12-01 |
AU779191B2 (en) | 2005-01-13 |
CN1275730C (zh) | 2006-09-20 |
PT1233841E (pt) | 2005-09-30 |
AU2501001A (en) | 2001-06-06 |
JP4727110B2 (ja) | 2011-07-20 |
CZ20021603A3 (cs) | 2003-05-14 |
NO20022132L (no) | 2002-05-03 |
DE19953654A1 (de) | 2001-05-23 |
DE50010577D1 (de) | 2005-07-21 |
CZ302495B6 (cs) | 2011-06-15 |
MXPA02004579A (es) | 2004-09-10 |
KR20020062935A (ko) | 2002-07-31 |
PL355529A1 (en) | 2004-05-04 |
EP1233841A1 (de) | 2002-08-28 |
KR100645984B1 (ko) | 2006-11-13 |
EP1233841B1 (de) | 2005-06-15 |
IL149489A (en) | 2006-10-31 |
ATE297829T1 (de) | 2005-07-15 |
IL149489A0 (en) | 2002-11-10 |
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Legal Events
Date | Code | Title | Description |
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MM1K | Lapsed by not paying the annual fees |