TW359881B - Method of bonding component to substrate and its apparatus, method of bonding semiconductor chip to lead frame and its apparatus - Google Patents

Method of bonding component to substrate and its apparatus, method of bonding semiconductor chip to lead frame and its apparatus

Info

Publication number
TW359881B
TW359881B TW085101116A TW85101116A TW359881B TW 359881 B TW359881 B TW 359881B TW 085101116 A TW085101116 A TW 085101116A TW 85101116 A TW85101116 A TW 85101116A TW 359881 B TW359881 B TW 359881B
Authority
TW
Taiwan
Prior art keywords
bonding
solder
diepad
chip
substrate
Prior art date
Application number
TW085101116A
Other languages
Chinese (zh)
Inventor
Isao Arakawa
Yoshinori Hirata
Kazuto Matsunaga
Takaharu Arizono
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW359881B publication Critical patent/TW359881B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying

Abstract

When a substrate (diepad) of an IC lead frame comes at a soldering point, bonding material (solder) is transferred on the diepad by a solder supplying part. An IC chip positioning part performs positioning of the component (IC chip), and bonding is performed by a bonding head. The IC chip is preheated and made to abut against the solder. At the time, a position to which the solder of the diepad is supplied is rapidly heated from the back, and the solder is fused. Then the diepad is bonded to the IC chip. Supply of gas for preventing oxidation and gas for reduction is made unnecessary.
TW085101116A 1995-11-08 1996-01-30 Method of bonding component to substrate and its apparatus, method of bonding semiconductor chip to lead frame and its apparatus TW359881B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29001195 1995-11-08

Publications (1)

Publication Number Publication Date
TW359881B true TW359881B (en) 1999-06-01

Family

ID=17750631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101116A TW359881B (en) 1995-11-08 1996-01-30 Method of bonding component to substrate and its apparatus, method of bonding semiconductor chip to lead frame and its apparatus

Country Status (3)

Country Link
KR (1) KR970030543A (en)
CN (1) CN1079992C (en)
TW (1) TW359881B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7389903B2 (en) 2001-09-27 2008-06-24 Infineon Technologies Ag Device and method for soldering contacts on semiconductor chips
CN102035934A (en) * 2009-09-30 2011-04-27 李晓 Dual-screen portable electronic equipment and management method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800230B2 (en) * 2006-04-28 2010-09-21 Denso Corporation Solder preform and electronic component
CN101229602B (en) * 2008-01-24 2010-06-02 石开轩 Method of welding thermistance chip and down lead

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5166855A (en) * 1974-12-05 1976-06-09 Sumitomo Metal Ind Kannaiidobutsutaino ichikenchihoho
JPH0376236A (en) * 1989-08-18 1991-04-02 Fujitsu Ltd Bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7389903B2 (en) 2001-09-27 2008-06-24 Infineon Technologies Ag Device and method for soldering contacts on semiconductor chips
CN102035934A (en) * 2009-09-30 2011-04-27 李晓 Dual-screen portable electronic equipment and management method

Also Published As

Publication number Publication date
CN1150329A (en) 1997-05-21
CN1079992C (en) 2002-02-27
KR970030543A (en) 1997-06-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees