NL6816364A - - Google Patents
Info
- Publication number
- NL6816364A NL6816364A NL6816364A NL6816364A NL6816364A NL 6816364 A NL6816364 A NL 6816364A NL 6816364 A NL6816364 A NL 6816364A NL 6816364 A NL6816364 A NL 6816364A NL 6816364 A NL6816364 A NL 6816364A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/085—Particles bound with glass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB52519/67A GB1254101A (en) | 1967-11-17 | 1967-11-17 | Improvements in or relating to microcircuit insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6816364A true NL6816364A (de) | 1969-05-20 |
Family
ID=10464226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6816364A NL6816364A (de) | 1967-11-17 | 1968-11-15 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5428954B1 (de) |
| DE (1) | DE1809572A1 (de) |
| GB (1) | GB1254101A (de) |
| NL (1) | NL6816364A (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5328266A (en) * | 1976-08-13 | 1978-03-16 | Fujitsu Ltd | Method of producing multilayer ceramic substrate |
| US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
| US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
| DE3241225A1 (de) * | 1982-11-09 | 1984-05-10 | F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach | Verfahren zur herstellung elektronischer schaltelemente und/oder schaltungen in vielschicht-dickfilmtechnik (multilayer thick film technology) auf einem substrat und dergestalt hergestellte schaltelemente und/oder schaltungen |
| DE10117061A1 (de) * | 2001-04-05 | 2002-10-10 | Delphi Tech Inc | Elektrischer Verbinder |
| JP2003110207A (ja) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | フレキシブル基板 |
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1967
- 1967-11-17 GB GB52519/67A patent/GB1254101A/en not_active Expired
-
1968
- 1968-11-15 NL NL6816364A patent/NL6816364A/xx unknown
- 1968-11-16 JP JP8358068A patent/JPS5428954B1/ja active Pending
- 1968-11-18 DE DE19681809572 patent/DE1809572A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE1809572A1 (de) | 1969-10-16 |
| GB1254101A (en) | 1971-11-17 |
| JPS5428954B1 (de) | 1979-09-20 |