GB1254101A - Improvements in or relating to microcircuit insulation - Google Patents

Improvements in or relating to microcircuit insulation

Info

Publication number
GB1254101A
GB1254101A GB52519/67A GB5251967A GB1254101A GB 1254101 A GB1254101 A GB 1254101A GB 52519/67 A GB52519/67 A GB 52519/67A GB 5251967 A GB5251967 A GB 5251967A GB 1254101 A GB1254101 A GB 1254101A
Authority
GB
United Kingdom
Prior art keywords
glaze
layers
refractory oxide
insulating
nov
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB52519/67A
Inventor
Norman Davey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Research Development Corp UK
Original Assignee
National Research Development Corp UK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Research Development Corp UK filed Critical National Research Development Corp UK
Priority to GB52519/67A priority Critical patent/GB1254101A/en
Priority to NL6816364A priority patent/NL6816364A/xx
Priority to JP8358068A priority patent/JPS5428954B1/ja
Priority to DE19681809572 priority patent/DE1809572A1/en
Publication of GB1254101A publication Critical patent/GB1254101A/en
Priority to US05/424,048 priority patent/US3950586A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/085—Particles bound with glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

1,254,101. Printed circuits. NATIONAL RESEARCH DEVELOPMENT CORP. 15 Nov., 1968 [17 Nov., 1967], No. 52519/67. Heading H1R. [Also in Division C1] A plurality of insulating layers (3, 5, 7) are formed in the construction of a multilayer microelectronic circuit by (i) depositing on a substrate (1-e.g. alumina) an insulating matarial dispersed in an organic carrier liquid, the insulating material consisting of a powdered glaze and at least one particulate refractory oxide having a melting point higher than the working temperature of the glaze, (ii) removing the organic carrier by evaporation, (iii) heating the coated substrate to the working temperature of the glaze to form a glaze layer into which the refractory oxide diffuses, thereby raising the glaze softening temperature, and (iv) repeating steps (i) to (iii) until the desired number of layers are formed. Preferably the heat treatments of all the layers are at substantially the same temperature. The refractory oxide may be Al 2 O 3 , TiO 2 , BeO, ZO 2 , CaO or MgO, and preferably comprises 10-40% by weight of the insulating material. The oxide may have a particle size of 2-30Á. The dispersion may be applied by screen-printing or spraying. The glaze used preferably fuses at 600-1300‹ C. Conductive layers (2, 4, 6) may be applied by conventional methods using, e.g. gold metallizing paste.
GB52519/67A 1967-11-17 1967-11-17 Improvements in or relating to microcircuit insulation Expired GB1254101A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB52519/67A GB1254101A (en) 1967-11-17 1967-11-17 Improvements in or relating to microcircuit insulation
NL6816364A NL6816364A (en) 1967-11-17 1968-11-15
JP8358068A JPS5428954B1 (en) 1967-11-17 1968-11-16
DE19681809572 DE1809572A1 (en) 1967-11-17 1968-11-18 Insulation material containing glaze for the production of electronic microcircuits or a circuit element and process for the production of electronic microcircuits produced using such an insulation material
US05/424,048 US3950586A (en) 1967-11-17 1973-12-12 Electrical insulator materials for use in micro-circuit construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB52519/67A GB1254101A (en) 1967-11-17 1967-11-17 Improvements in or relating to microcircuit insulation

Publications (1)

Publication Number Publication Date
GB1254101A true GB1254101A (en) 1971-11-17

Family

ID=10464226

Family Applications (1)

Application Number Title Priority Date Filing Date
GB52519/67A Expired GB1254101A (en) 1967-11-17 1967-11-17 Improvements in or relating to microcircuit insulation

Country Status (4)

Country Link
JP (1) JPS5428954B1 (en)
DE (1) DE1809572A1 (en)
GB (1) GB1254101A (en)
NL (1) NL6816364A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237606A (en) * 1976-08-13 1980-12-09 Fujitsu Limited Method of manufacturing multilayer ceramic board
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241225A1 (en) * 1982-11-09 1984-05-10 F & O Electronic Systems GmbH & Co, 6901 Neckarsteinach METHOD FOR THE PRODUCTION OF ELECTRONIC SWITCHING ELEMENTS AND / OR CIRCUITS IN MULTILAYER THICK FILM TECHNOLOGY (MULTILAYER THICK FILM TECHNOLOGY) ON A SUBSTRATE AND SWITCHING ELEMENTS MANUFACTURED AND ITS DESIGN
DE10117061A1 (en) * 2001-04-05 2002-10-10 Delphi Tech Inc Electrical connector e.g. for high current equipment in motor vehicles, includes stack of mutually aligned contact elements forming at least one connection section
JP2003110207A (en) * 2001-09-28 2003-04-11 Alps Electric Co Ltd Flexible substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237606A (en) * 1976-08-13 1980-12-09 Fujitsu Limited Method of manufacturing multilayer ceramic board
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier

Also Published As

Publication number Publication date
DE1809572A1 (en) 1969-10-16
NL6816364A (en) 1969-05-20
JPS5428954B1 (en) 1979-09-20

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