NL268503A - - Google Patents
Info
- Publication number
- NL268503A NL268503A NL268503DA NL268503A NL 268503 A NL268503 A NL 268503A NL 268503D A NL268503D A NL 268503DA NL 268503 A NL268503 A NL 268503A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/938—Vapor deposition or gas diffusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12444—Embodying fibers interengaged or between layers [e.g., paper, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12583—Component contains compound of adjacent metal
- Y10T428/1259—Oxide
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Photovoltaic Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74872A US3106489A (en) | 1960-12-09 | 1960-12-09 | Semiconductor device fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
NL268503A true NL268503A (xx) |
Family
ID=22122171
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL268503D NL268503A (xx) | 1960-12-09 | ||
NL128768D NL128768C (xx) | 1960-12-09 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL128768D NL128768C (xx) | 1960-12-09 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3106489A (xx) |
JP (1) | JPS387274B1 (xx) |
BE (1) | BE606680A (xx) |
CH (1) | CH422161A (xx) |
DE (1) | DE1200439B (xx) |
FR (1) | FR1298148A (xx) |
GB (1) | GB991174A (xx) |
NL (2) | NL128768C (xx) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3261984A (en) * | 1961-03-10 | 1966-07-19 | Philco Corp | Tunnel-emission amplifying device and circuit therefor |
US3376163A (en) * | 1961-08-11 | 1968-04-02 | Itek Corp | Photosensitive cell |
US3518066A (en) * | 1962-12-26 | 1970-06-30 | Philips Corp | Metallizing non-metals |
US3310685A (en) * | 1963-05-03 | 1967-03-21 | Gtc Kk | Narrow band emitter devices |
NL134170C (xx) * | 1963-12-17 | 1900-01-01 | ||
US3442701A (en) * | 1965-05-19 | 1969-05-06 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
FR1450654A (fr) * | 1965-07-01 | 1966-06-24 | Radiotechnique | Perfectionnements aux dispositifs semi-conducteurs de détection de radiations ionisantes |
US3390969A (en) * | 1966-04-27 | 1968-07-02 | Infrared Ind Inc | Noble metal coated ceramic substrate for glass seals and electronic connector elements |
US3629776A (en) * | 1967-10-24 | 1971-12-21 | Nippon Kogaku Kk | Sliding thin film resistance for measuring instruments |
US3465211A (en) * | 1968-02-01 | 1969-09-02 | Friden Inc | Multilayer contact system for semiconductors |
US3471756A (en) * | 1968-03-11 | 1969-10-07 | Us Army | Metal oxide-silicon diode containing coating of vanadium pentoxide-v2o5 deposited on n-type material with nickel electrodes |
FR2014594B1 (xx) * | 1968-07-15 | 1974-02-22 | Ibm | |
US3567508A (en) * | 1968-10-31 | 1971-03-02 | Gen Electric | Low temperature-high vacuum contact formation process |
US4016589A (en) * | 1971-11-10 | 1977-04-05 | Omron Tateisi Electronics Co., Ltd. | Semiconductor device |
US4011577A (en) * | 1972-03-21 | 1977-03-08 | Omron Tateisi Electronics Co. | Mechanical-electrical force transducer with semiconductor-insulating layer-tin oxide composite |
GB1419143A (en) * | 1972-04-04 | 1975-12-24 | Omron Tateisi Electronics Co | Semiconductor photoelectric device |
NL163370C (nl) * | 1972-04-28 | 1980-08-15 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon. |
US3983284A (en) * | 1972-06-02 | 1976-09-28 | Thomson-Csf | Flat connection for a semiconductor multilayer structure |
JPS5120277B2 (xx) * | 1972-08-17 | 1976-06-23 | ||
US3977905A (en) * | 1973-02-13 | 1976-08-31 | Communications Satellite Corporation (Comsat) | Solar cell with niobium pentoxide anti-reflective coating |
CA1017840A (en) * | 1973-02-13 | 1977-09-20 | Communications Satellite Corporation | Niobium pentoxide anti-reflective coating |
US4082568A (en) * | 1977-05-10 | 1978-04-04 | Joseph Lindmayer | Solar cell with multiple-metal contacts |
US4153518A (en) * | 1977-11-18 | 1979-05-08 | Tektronix, Inc. | Method of making a metalized substrate having a thin film barrier layer |
US4307132A (en) * | 1977-12-27 | 1981-12-22 | International Business Machines Corp. | Method for fabricating a contact on a semiconductor substrate by depositing an aluminum oxide diffusion barrier layer |
US4392010A (en) * | 1979-01-16 | 1983-07-05 | Solarex Corporation | Photovoltaic cells having contacts and method of applying same |
US4235644A (en) * | 1979-08-31 | 1980-11-25 | E. I. Du Pont De Nemours And Company | Thick film silver metallizations for silicon solar cells |
US4471405A (en) * | 1981-12-28 | 1984-09-11 | International Business Machines Corporation | Thin film capacitor with a dual bottom electrode structure |
US4871617A (en) * | 1984-04-02 | 1989-10-03 | General Electric Company | Ohmic contacts and interconnects to silicon and method of making same |
US4702967A (en) * | 1986-06-16 | 1987-10-27 | Harris Corporation | Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffusion barrier layer structure for gold-base microcircuit interconnection |
US5532031A (en) * | 1992-01-29 | 1996-07-02 | International Business Machines Corporation | I/O pad adhesion layer for a ceramic substrate |
US5679982A (en) * | 1993-02-24 | 1997-10-21 | Intel Corporation | Barrier against metal diffusion |
US6690044B1 (en) * | 1993-03-19 | 2004-02-10 | Micron Technology, Inc. | Approach to avoid buckling BPSG by using an intermediate barrier layer |
WO1995002900A1 (en) * | 1993-07-15 | 1995-01-26 | Astarix, Inc. | Aluminum-palladium alloy for initiation of electroless plating |
US6051879A (en) | 1997-12-16 | 2000-04-18 | Micron Technology, Inc. | Electrical interconnection for attachment to a substrate |
US7637801B2 (en) * | 2000-09-28 | 2009-12-29 | Sharp Kabushiki Kaisha | Method of making solar cell |
US6563185B2 (en) * | 2001-05-21 | 2003-05-13 | The Regents Of The University Of Colorado | High speed electron tunneling device and applications |
JP2006310348A (ja) * | 2005-04-26 | 2006-11-09 | Sanyo Electric Co Ltd | 積層型光起電力装置 |
JP2008021750A (ja) * | 2006-07-11 | 2008-01-31 | Matsushita Electric Ind Co Ltd | 抵抗変化素子およびその製造方法、ならびにそれを用いた抵抗変化型メモリ |
JP5191527B2 (ja) * | 2010-11-19 | 2013-05-08 | 日本発條株式会社 | 積層体および積層体の製造方法 |
US9166004B2 (en) * | 2010-12-23 | 2015-10-20 | Intel Corporation | Semiconductor device contacts |
CN113223953B (zh) * | 2021-03-31 | 2022-09-27 | 青岛惠科微电子有限公司 | 一种快恢复芯片的制造方法、制造设备和快恢复芯片 |
CN113223944B (zh) * | 2021-03-31 | 2022-09-27 | 青岛惠科微电子有限公司 | 一种快恢复芯片的制造方法、制造设备和快恢复芯片 |
CN113178385B (zh) * | 2021-03-31 | 2022-12-23 | 青岛惠科微电子有限公司 | 一种芯片的制造方法、制造设备和芯片 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2695852A (en) * | 1952-02-15 | 1954-11-30 | Bell Telephone Labor Inc | Fabrication of semiconductors for signal translating devices |
US2799600A (en) * | 1954-08-17 | 1957-07-16 | Noel W Scott | Method of producing electrically conducting transparent coatings on optical surfaces |
NL190331A (xx) * | 1954-08-26 | 1900-01-01 | ||
DE1067131B (de) * | 1954-09-15 | 1959-10-15 | Siemens &. Halske Aktiengesell schatt Berlin und München | Verfahren zum Herstellen einer Halbleiteranordnung mit einer zwischen einer Metallschicht und der Oberflache des Halbleiterkristalls erzeugten Randschicht |
US2922092A (en) * | 1957-05-09 | 1960-01-19 | Westinghouse Electric Corp | Base contact members for semiconductor devices |
GB829170A (en) * | 1957-06-03 | 1960-02-24 | Sperry Rand Corp | Method of bonding an element of semiconducting material to an electrode |
-
0
- NL NL268503D patent/NL268503A/xx unknown
- NL NL128768D patent/NL128768C/xx active
-
1960
- 1960-12-09 US US74872A patent/US3106489A/en not_active Expired - Lifetime
-
1961
- 1961-07-28 BE BE606680A patent/BE606680A/fr unknown
- 1961-07-28 GB GB27529/61A patent/GB991174A/en not_active Expired
- 1961-08-04 DE DEW30470A patent/DE1200439B/de active Pending
- 1961-08-21 FR FR871230A patent/FR1298148A/fr not_active Expired
- 1961-10-06 JP JP3591361A patent/JPS387274B1/ja active Pending
- 1961-10-26 CH CH1241961A patent/CH422161A/de unknown
Also Published As
Publication number | Publication date |
---|---|
CH422161A (de) | 1966-10-15 |
FR1298148A (fr) | 1962-07-06 |
GB991174A (en) | 1965-05-05 |
JPS387274B1 (xx) | 1963-05-28 |
NL128768C (xx) | |
BE606680A (fr) | 1961-11-16 |
US3106489A (en) | 1963-10-08 |
DE1200439B (de) | 1965-09-09 |