NL182605C - Hoogfrequent-transistorinrichting. - Google Patents
Hoogfrequent-transistorinrichting.Info
- Publication number
- NL182605C NL182605C NLAANVRAGE7706232,A NL7706232A NL182605C NL 182605 C NL182605 C NL 182605C NL 7706232 A NL7706232 A NL 7706232A NL 182605 C NL182605 C NL 182605C
- Authority
- NL
- Netherlands
- Prior art keywords
- frequent
- transistor device
- transistor
- frequent transistor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01072—Hafnium [Hf]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microwave Amplifiers (AREA)
- Bipolar Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Amplifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/694,252 US4042952A (en) | 1976-06-09 | 1976-06-09 | R. F. power transistor device with controlled common lead inductance |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7706232A NL7706232A (nl) | 1977-12-13 |
NL182605B NL182605B (nl) | 1987-11-02 |
NL182605C true NL182605C (nl) | 1988-04-05 |
Family
ID=24788045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7706232,A NL182605C (nl) | 1976-06-09 | 1977-06-06 | Hoogfrequent-transistorinrichting. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4042952A (nl) |
JP (1) | JPS52150969A (nl) |
CA (1) | CA1082372A (nl) |
DE (1) | DE2726040C3 (nl) |
FR (1) | FR2354635A1 (nl) |
GB (1) | GB1574497A (nl) |
NL (1) | NL182605C (nl) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4193083A (en) * | 1977-01-07 | 1980-03-11 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
JPS5386576A (en) * | 1977-01-10 | 1978-07-31 | Nec Corp | Package for semiconductor element |
US4168507A (en) * | 1977-11-21 | 1979-09-18 | Motorola, Inc. | Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package |
JPS55140251A (en) * | 1979-04-12 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
FR2455785A1 (fr) * | 1979-05-02 | 1980-11-28 | Thomson Csf | Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support |
US4376287A (en) * | 1980-10-29 | 1983-03-08 | Rca Corporation | Microwave power circuit with an active device mounted on a heat dissipating substrate |
FR2563050B1 (fr) * | 1984-04-13 | 1987-01-16 | Thomson Csf | Combineur compact de dispositifs semiconducteurs, fonctionnant en hyperfrequences |
DE3444076A1 (de) * | 1984-12-04 | 1986-06-05 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Kontaktierung einer auf einem substrat angeordneten mikrowellenschaltung |
JPS6318648A (ja) * | 1986-07-11 | 1988-01-26 | Toshiba Corp | 窒化アルミニウム回路基板 |
US4891686A (en) * | 1988-04-08 | 1990-01-02 | Directed Energy, Inc. | Semiconductor packaging with ground plane conductor arrangement |
US5103283A (en) * | 1989-01-17 | 1992-04-07 | Hite Larry R | Packaged integrated circuit with in-cavity decoupling capacitors |
JPH0583017A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | マイクロ波集積回路装置 |
JP2864841B2 (ja) * | 1992-02-04 | 1999-03-08 | 三菱電機株式会社 | 高周波高出力トランジスタ |
US5311399A (en) * | 1992-06-24 | 1994-05-10 | The Carborundum Company | High power ceramic microelectronic package |
JP3053298B2 (ja) * | 1992-08-19 | 2000-06-19 | 株式会社東芝 | 半導体装置 |
TW238419B (nl) * | 1992-08-21 | 1995-01-11 | Olin Corp | |
US5360942A (en) * | 1993-11-16 | 1994-11-01 | Olin Corporation | Multi-chip electronic package module utilizing an adhesive sheet |
JP3429921B2 (ja) * | 1995-10-26 | 2003-07-28 | 三菱電機株式会社 | 半導体装置 |
US6049126A (en) * | 1995-12-14 | 2000-04-11 | Nec Corporation | Semiconductor package and amplifier employing the same |
US5889319A (en) * | 1996-07-19 | 1999-03-30 | Ericsson, Inc. | RF power package with a dual ground |
US6529081B1 (en) | 2000-06-08 | 2003-03-04 | Zeta, Division Of Sierra Tech Inc. | Method of operating a solid state power amplifying device |
WO2002005342A1 (en) * | 2000-07-06 | 2002-01-17 | Zeta, A Division Of Sierratech, Inc. | A solid state power amplifying device |
JP4789348B2 (ja) * | 2001-05-31 | 2011-10-12 | リンテック株式会社 | 面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法 |
US6617679B2 (en) * | 2002-02-08 | 2003-09-09 | Advanced Energy Industries, Inc. | Semiconductor package for multiple high power transistors |
US7683480B2 (en) * | 2006-03-29 | 2010-03-23 | Freescale Semiconductor, Inc. | Methods and apparatus for a reduced inductance wirebond array |
US7948078B2 (en) * | 2006-07-25 | 2011-05-24 | Rohm Co., Ltd. | Semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1193519A (en) * | 1967-08-31 | 1970-06-03 | Texas Instruments Ltd | Semiconductor Devices |
US3590341A (en) * | 1968-08-19 | 1971-06-29 | Kmc Semiconductor Corp | Microwave transistor package |
US3713006A (en) * | 1971-02-08 | 1973-01-23 | Trw Inc | Hybrid transistor |
US3908185A (en) * | 1974-03-06 | 1975-09-23 | Rca Corp | High frequency semiconductor device having improved metallized patterns |
-
1976
- 1976-06-09 US US05/694,252 patent/US4042952A/en not_active Expired - Lifetime
-
1977
- 1977-05-23 GB GB21663/77A patent/GB1574497A/en not_active Expired
- 1977-06-03 CA CA279,847A patent/CA1082372A/en not_active Expired
- 1977-06-06 NL NLAANVRAGE7706232,A patent/NL182605C/nl not_active IP Right Cessation
- 1977-06-06 JP JP6587177A patent/JPS52150969A/ja active Granted
- 1977-06-08 DE DE2726040A patent/DE2726040C3/de not_active Expired
- 1977-06-09 FR FR7717763A patent/FR2354635A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
CA1082372A (en) | 1980-07-22 |
FR2354635A1 (fr) | 1978-01-06 |
US4042952A (en) | 1977-08-16 |
DE2726040C3 (de) | 1982-02-18 |
NL182605B (nl) | 1987-11-02 |
GB1574497A (en) | 1980-09-10 |
JPS5757867B2 (nl) | 1982-12-07 |
DE2726040B2 (de) | 1981-05-27 |
JPS52150969A (en) | 1977-12-15 |
NL7706232A (nl) | 1977-12-13 |
FR2354635B1 (nl) | 1981-12-24 |
DE2726040A1 (de) | 1977-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BC | A request for examination has been filed | ||
A85 | Still pending on 85-01-01 | ||
V1 | Lapsed because of non-payment of the annual fee |