NL177956B - Fotokoppelinrichting. - Google Patents
Fotokoppelinrichting.Info
- Publication number
- NL177956B NL177956B NLAANVRAGE7710763,A NL7710763A NL177956B NL 177956 B NL177956 B NL 177956B NL 7710763 A NL7710763 A NL 7710763A NL 177956 B NL177956 B NL 177956B
- Authority
- NL
- Netherlands
- Prior art keywords
- photocouple
- photocouple device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
- H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51117789A JPS582468B2 (ja) | 1976-09-30 | 1976-09-30 | 光結合半導体装置 |
JP15715776A JPS5380990A (en) | 1976-12-25 | 1976-12-25 | Optical combination semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
NL7710763A NL7710763A (nl) | 1978-04-03 |
NL177956B true NL177956B (nl) | 1985-07-16 |
NL177956C NL177956C (nl) | 1985-12-16 |
Family
ID=26455832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7710763,A NL177956C (nl) | 1976-09-30 | 1977-09-30 | Fotokoppelinrichting. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4143385A (nl) |
DE (1) | DE2744167C2 (nl) |
NL (1) | NL177956C (nl) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2471014A1 (fr) * | 1979-11-28 | 1981-06-12 | Radiotechnique Compelec | Dispositif d'affichage a diodes electroluminescentes |
US4279465A (en) * | 1979-11-30 | 1981-07-21 | The Singer Company | Device for transmitting and receiving optical data on the same optical transmission line |
US4332341A (en) * | 1979-12-26 | 1982-06-01 | Bell Telephone Laboratories, Incorporated | Fabrication of circuit packages using solid phase solder bonding |
US4352449A (en) * | 1979-12-26 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | Fabrication of circuit packages |
JPS6080264A (ja) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | 半導体装置 |
US4672421A (en) * | 1984-04-02 | 1987-06-09 | Motorola, Inc. | Semiconductor packaging and method |
US4754912A (en) * | 1984-04-05 | 1988-07-05 | National Semiconductor Corporation | Controlled collapse thermocompression gang bonding |
JPH0815167B2 (ja) * | 1986-03-26 | 1996-02-14 | 株式会社日立製作所 | 半導体装置 |
DE3633181C2 (de) * | 1986-09-30 | 1998-12-10 | Siemens Ag | Reflexlichtschranke |
DE3713067A1 (de) * | 1986-09-30 | 1988-03-31 | Siemens Ag | Optoelektronisches koppelelement und verfahren zu dessen herstellung |
DE3817600C2 (de) * | 1987-05-26 | 1994-06-23 | Matsushita Electric Works Ltd | Verfahren zur Herstellung einer Halbleitervorrichtung mit einem keramischen Substrat und einem integrierten Schaltungskreis |
US4897711A (en) * | 1988-03-03 | 1990-01-30 | American Telephone And Telegraph Company | Subassembly for optoelectronic devices |
US4945400A (en) * | 1988-03-03 | 1990-07-31 | At&T Bell Laboratories | Subassembly for optoelectronic devices |
US4948960A (en) * | 1988-09-20 | 1990-08-14 | The University Of Delaware | Dual mode light emitting diode/detector diode for optical fiber transmission lines |
US5081520A (en) * | 1989-05-16 | 1992-01-14 | Minolta Camera Kabushiki Kaisha | Chip mounting substrate having an integral molded projection and conductive pattern |
JP3337405B2 (ja) * | 1996-12-27 | 2002-10-21 | シャープ株式会社 | 発光表示素子およびその電気配線基板への接続方法ならびに製造方法 |
GB2344455A (en) | 1998-12-01 | 2000-06-07 | Mitel Semiconductor Ab | Semiconductor device with low parasitic capacitance |
JP4897133B2 (ja) * | 1999-12-09 | 2012-03-14 | ソニー株式会社 | 半導体発光素子、その製造方法および配設基板 |
KR100411811B1 (ko) * | 2001-04-02 | 2003-12-24 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
US6812064B2 (en) * | 2001-11-07 | 2004-11-02 | Micron Technology, Inc. | Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate |
WO2003058720A1 (de) * | 2002-01-09 | 2003-07-17 | Infineon Technologies Ag | Photodiodenanordnung und verfahren zur herstellung einer verbindung zwischen einem ersten halbleiterbauelement und einem zweiten halbleiterbauelement |
JP2004128219A (ja) * | 2002-10-02 | 2004-04-22 | Shinko Electric Ind Co Ltd | 付加機能を有する半導体装置及びその製造方法 |
US7453058B2 (en) * | 2005-03-15 | 2008-11-18 | Fujitsu Limited | Optical bumps for low-loss interconnection between a device and its supported substrate and related methods |
WO2009115994A2 (en) * | 2008-03-20 | 2009-09-24 | Nxp B.V. | An optoelectronic coupler device and a method of manufacturing the same |
TWI607587B (zh) * | 2016-09-13 | 2017-12-01 | 台灣琭旦股份有限公司 | 固晶穩固製程 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2609429A (en) * | 1950-07-29 | 1952-09-02 | Rca Corp | Semiconduction electrode construction |
CH440478A (de) * | 1963-07-01 | 1967-07-31 | Asea Ab | Verfahren zum Herabsetzen der Durchlasspannung in einem gleichrichtenden Halbleiterkörper und Anordnung zur Ausführung des Verfahrens |
GB1007876A (en) * | 1963-08-15 | 1965-10-22 | Mullard Ltd | Improvements in and relating to opto-electronic semiconductor devices |
DE1190506B (de) * | 1963-10-10 | 1965-04-08 | Siemens Ag | Optisch gesteuerte, mindestens vier Zonen von abwechselnd unterschiedlichem Leitungstyp aufweisende Schalt- oder Kippdiode |
FR1413301A (fr) * | 1963-10-17 | 1965-10-08 | Ibm | Appareil de commutation et de multiplexage de circuits électriques |
US3355635A (en) * | 1964-05-28 | 1967-11-28 | Rca Corp | Semiconductor device assemblage having two convex tabs |
USB411062I5 (nl) * | 1964-11-13 | |||
FR1486855A (nl) * | 1965-07-17 | 1967-10-05 | ||
US3871015A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform connector joints |
JPS5310862Y2 (nl) * | 1972-12-28 | 1978-03-23 | ||
US4012833A (en) * | 1973-12-28 | 1977-03-22 | Sony Corporation | Method of making display structure having light emitting diodes |
JPS5642148B2 (nl) * | 1975-01-24 | 1981-10-02 | ||
JPS584470B2 (ja) * | 1975-04-02 | 1983-01-26 | 株式会社日立製作所 | ヒカリケツゴウハンドウタイソウチ オヨビ ソノセイホウ |
US4005457A (en) * | 1975-07-10 | 1977-01-25 | Semimetals, Inc. | Semiconductor assembly, method of manufacturing same, and bonding agent therefor |
JPS52137279A (en) * | 1976-05-12 | 1977-11-16 | Hitachi Ltd | Semiconductor device for optical coupling |
-
1977
- 1977-09-29 US US05/837,710 patent/US4143385A/en not_active Expired - Lifetime
- 1977-09-30 NL NLAANVRAGE7710763,A patent/NL177956C/nl not_active IP Right Cessation
- 1977-09-30 DE DE2744167A patent/DE2744167C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL177956C (nl) | 1985-12-16 |
DE2744167C2 (de) | 1984-05-10 |
US4143385A (en) | 1979-03-06 |
NL7710763A (nl) | 1978-04-03 |
DE2744167A1 (de) | 1978-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
V1 | Lapsed because of non-payment of the annual fee |