MY197276A - Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same - Google Patents
Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using sameInfo
- Publication number
- MY197276A MY197276A MYPI2022006321A MYPI2022006321A MY197276A MY 197276 A MY197276 A MY 197276A MY PI2022006321 A MYPI2022006321 A MY PI2022006321A MY PI2022006321 A MYPI2022006321 A MY PI2022006321A MY 197276 A MY197276 A MY 197276A
- Authority
- MY
- Malaysia
- Prior art keywords
- liquid
- crystalline resin
- resin composition
- relays
- relay
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H45/00—Details of relays
- H01H45/02—Bases; Casings; Covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020084717 | 2020-05-13 | ||
PCT/JP2021/012893 WO2021229931A1 (ja) | 2020-05-13 | 2021-03-26 | 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー |
Publications (1)
Publication Number | Publication Date |
---|---|
MY197276A true MY197276A (en) | 2023-06-09 |
Family
ID=78525706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2022006321A MY197276A (en) | 2020-05-13 | 2021-03-26 | Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7019110B1 (ko) |
KR (1) | KR102501091B1 (ko) |
CN (1) | CN115551948B (ko) |
MY (1) | MY197276A (ko) |
WO (1) | WO2021229931A1 (ko) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3463310B2 (ja) | 1993-03-12 | 2003-11-05 | オムロン株式会社 | 表面実装リレー |
JP2015021063A (ja) * | 2013-07-19 | 2015-02-02 | 東レ株式会社 | 液晶ポリエステル樹脂組成物 |
JP6206174B2 (ja) * | 2013-12-26 | 2017-10-04 | 東レ株式会社 | 液晶性ポリエステル樹脂組成物およびその成形品 |
KR102081231B1 (ko) | 2015-09-01 | 2020-02-25 | 포리프라스틱 가부시키가이샤 | 카메라 모듈용 액정성 수지 조성물 및 그것을 이용한 카메라 모듈 |
JP6779906B2 (ja) * | 2015-12-09 | 2020-11-04 | 住友化学株式会社 | 液晶ポリエステル組成物及び成形体 |
CN108291078B (zh) * | 2015-12-09 | 2020-09-29 | 住友化学株式会社 | 液晶聚酯组合物和成形体 |
KR102052662B1 (ko) * | 2016-10-07 | 2019-12-05 | 포리프라스틱 가부시키가이샤 | 복합 수지 조성물, 및 당해 복합 수지 조성물로 성형된 커넥터 |
WO2018066416A1 (ja) * | 2016-10-07 | 2018-04-12 | ポリプラスチックス株式会社 | 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品 |
JP6321899B1 (ja) * | 2016-10-21 | 2018-05-09 | ポリプラスチックス株式会社 | 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター |
CN109844028B (zh) * | 2016-12-21 | 2020-09-11 | 宝理塑料株式会社 | 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器 |
CN109844027B (zh) * | 2016-12-22 | 2020-08-04 | 宝理塑料株式会社 | 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器 |
JP6762228B2 (ja) | 2016-12-26 | 2020-09-30 | ポリプラスチックス株式会社 | カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール |
JP6837184B2 (ja) * | 2018-04-16 | 2021-03-03 | ポリプラスチックス株式会社 | 液晶性樹脂組成物 |
KR102397208B1 (ko) * | 2018-11-15 | 2022-05-12 | 포리프라스틱 가부시키가이샤 | 액정성 수지 조성물 및 상기 액정성 수지 조성물의 성형품을 포함하는 커넥터 |
-
2021
- 2021-03-26 WO PCT/JP2021/012893 patent/WO2021229931A1/ja active Application Filing
- 2021-03-26 JP JP2021547691A patent/JP7019110B1/ja active Active
- 2021-03-26 MY MYPI2022006321A patent/MY197276A/en unknown
- 2021-03-26 CN CN202180034532.5A patent/CN115551948B/zh active Active
- 2021-03-26 KR KR1020227040467A patent/KR102501091B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP7019110B1 (ja) | 2022-02-14 |
KR20220158871A (ko) | 2022-12-01 |
CN115551948B (zh) | 2023-04-11 |
WO2021229931A1 (ja) | 2021-11-18 |
CN115551948A (zh) | 2022-12-30 |
KR102501091B1 (ko) | 2023-02-17 |
JPWO2021229931A1 (ko) | 2021-11-18 |
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