MY197276A - Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same - Google Patents

Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same

Info

Publication number
MY197276A
MY197276A MYPI2022006321A MYPI2022006321A MY197276A MY 197276 A MY197276 A MY 197276A MY PI2022006321 A MYPI2022006321 A MY PI2022006321A MY PI2022006321 A MYPI2022006321 A MY PI2022006321A MY 197276 A MY197276 A MY 197276A
Authority
MY
Malaysia
Prior art keywords
liquid
crystalline resin
resin composition
relays
relay
Prior art date
Application number
MYPI2022006321A
Other languages
English (en)
Inventor
Takuma Matsumura
Akihiro Nagae
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of MY197276A publication Critical patent/MY197276A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/10Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12Polyester-amides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H45/00Details of relays
    • H01H45/02Bases; Casings; Covers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/016Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
MYPI2022006321A 2020-05-13 2021-03-26 Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same MY197276A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020084717 2020-05-13
PCT/JP2021/012893 WO2021229931A1 (ja) 2020-05-13 2021-03-26 表面実装リレー用液晶性樹脂組成物及びそれを用いた表面実装リレー

Publications (1)

Publication Number Publication Date
MY197276A true MY197276A (en) 2023-06-09

Family

ID=78525706

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022006321A MY197276A (en) 2020-05-13 2021-03-26 Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same

Country Status (5)

Country Link
JP (1) JP7019110B1 (ko)
KR (1) KR102501091B1 (ko)
CN (1) CN115551948B (ko)
MY (1) MY197276A (ko)
WO (1) WO2021229931A1 (ko)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3463310B2 (ja) 1993-03-12 2003-11-05 オムロン株式会社 表面実装リレー
JP2015021063A (ja) * 2013-07-19 2015-02-02 東レ株式会社 液晶ポリエステル樹脂組成物
JP6206174B2 (ja) * 2013-12-26 2017-10-04 東レ株式会社 液晶性ポリエステル樹脂組成物およびその成形品
KR102081231B1 (ko) 2015-09-01 2020-02-25 포리프라스틱 가부시키가이샤 카메라 모듈용 액정성 수지 조성물 및 그것을 이용한 카메라 모듈
JP6779906B2 (ja) * 2015-12-09 2020-11-04 住友化学株式会社 液晶ポリエステル組成物及び成形体
CN108291078B (zh) * 2015-12-09 2020-09-29 住友化学株式会社 液晶聚酯组合物和成形体
KR102052662B1 (ko) * 2016-10-07 2019-12-05 포리프라스틱 가부시키가이샤 복합 수지 조성물, 및 당해 복합 수지 조성물로 성형된 커넥터
WO2018066416A1 (ja) * 2016-10-07 2018-04-12 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
JP6321899B1 (ja) * 2016-10-21 2018-05-09 ポリプラスチックス株式会社 複合樹脂組成物、及び当該複合樹脂組成物から成形されたコネクター
CN109844028B (zh) * 2016-12-21 2020-09-11 宝理塑料株式会社 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器
CN109844027B (zh) * 2016-12-22 2020-08-04 宝理塑料株式会社 表面安装继电器用液晶性树脂组合物及使用其的表面安装继电器
JP6762228B2 (ja) 2016-12-26 2020-09-30 ポリプラスチックス株式会社 カメラモジュール用液晶性樹脂組成物及びそれを用いたカメラモジュール
JP6837184B2 (ja) * 2018-04-16 2021-03-03 ポリプラスチックス株式会社 液晶性樹脂組成物
KR102397208B1 (ko) * 2018-11-15 2022-05-12 포리프라스틱 가부시키가이샤 액정성 수지 조성물 및 상기 액정성 수지 조성물의 성형품을 포함하는 커넥터

Also Published As

Publication number Publication date
JP7019110B1 (ja) 2022-02-14
KR20220158871A (ko) 2022-12-01
CN115551948B (zh) 2023-04-11
WO2021229931A1 (ja) 2021-11-18
CN115551948A (zh) 2022-12-30
KR102501091B1 (ko) 2023-02-17
JPWO2021229931A1 (ko) 2021-11-18

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