MY183238A - Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board - Google Patents
Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring boardInfo
- Publication number
- MY183238A MY183238A MYPI2017703386A MYPI2017703386A MY183238A MY 183238 A MY183238 A MY 183238A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY 183238 A MY183238 A MY 183238A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- thin copper
- carrier
- extremely thin
- wiring board
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015060816 | 2015-03-24 | ||
PCT/JP2016/056014 WO2016152390A1 (ja) | 2015-03-24 | 2016-02-29 | キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY183238A true MY183238A (en) | 2021-02-18 |
Family
ID=56978004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017703386A MY183238A (en) | 2015-03-24 | 2016-02-29 | Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6650923B2 (zh) |
KR (1) | KR102531073B1 (zh) |
CN (1) | CN107428129B (zh) |
MY (1) | MY183238A (zh) |
TW (1) | TWI617436B (zh) |
WO (1) | WO2016152390A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7177956B2 (ja) * | 2020-02-04 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
WO2023189566A1 (ja) * | 2022-03-29 | 2023-10-05 | 三井金属鉱業株式会社 | キャリア付金属箔、金属張積層板及びプリント配線板 |
WO2023189565A1 (ja) * | 2022-03-29 | 2023-10-05 | 三井金属鉱業株式会社 | キャリア付金属箔、金属張積層板及びプリント配線板 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3340307B2 (ja) | 1996-03-11 | 2002-11-05 | 三井金属鉱業株式会社 | プリント配線板用銅箔の製造方法 |
JP3142270B2 (ja) | 1998-04-01 | 2001-03-07 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
EP1172025B2 (en) * | 1999-03-23 | 2006-04-26 | Circuit Foil Luxembourg S.a.r.l. | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
JP2001068816A (ja) * | 1999-08-24 | 2001-03-16 | Mitsui Mining & Smelting Co Ltd | 銅張積層板及びその銅張積層板を用いたレーザー加工方法 |
LU90532B1 (en) * | 2000-02-24 | 2001-08-27 | Circuit Foil Luxembourg Trading Sarl | Comosite copper foil and manufacturing method thereof |
JP3261119B2 (ja) * | 2000-05-16 | 2002-02-25 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
JP2002026475A (ja) * | 2000-07-07 | 2002-01-25 | Mitsui Mining & Smelting Co Ltd | キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板 |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
EP1481796B1 (en) * | 2002-03-05 | 2015-08-19 | Hitachi Chemical Co., Ltd. | Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof |
JP2004263296A (ja) * | 2003-02-12 | 2004-09-24 | Furukawa Techno Research Kk | ファインパターンプリント配線用銅箔とその製造方法 |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
JP5256747B2 (ja) * | 2008-01-21 | 2013-08-07 | 宇部興産株式会社 | セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム |
JP5242710B2 (ja) * | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
CN101892499B (zh) * | 2010-07-24 | 2011-11-09 | 江西理工大学 | 以铜箔作载体的可剥离超薄铜箔及其制备方法 |
KR20140009323A (ko) * | 2011-01-26 | 2014-01-22 | 스미토모 베이클리트 컴퍼니 리미티드 | 프린트 배선판 및 프린트 배선판의 제조 방법 |
WO2013108599A1 (ja) * | 2012-01-17 | 2013-07-25 | パナソニック株式会社 | 配線基板とその製造方法 |
JP5858849B2 (ja) * | 2012-03-30 | 2016-02-10 | Jx日鉱日石金属株式会社 | 金属箔 |
JP2014208482A (ja) * | 2013-03-29 | 2014-11-06 | Jx日鉱日石金属株式会社 | キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法 |
JP5503789B2 (ja) * | 2013-08-30 | 2014-05-28 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板 |
JP6027296B1 (ja) * | 2015-01-30 | 2016-11-16 | 株式会社フジクラ | 配線体、配線基板、及びタッチセンサ |
-
2016
- 2016-02-29 CN CN201680017908.0A patent/CN107428129B/zh active Active
- 2016-02-29 WO PCT/JP2016/056014 patent/WO2016152390A1/ja active Application Filing
- 2016-02-29 KR KR1020177014980A patent/KR102531073B1/ko active IP Right Grant
- 2016-02-29 JP JP2017507639A patent/JP6650923B2/ja active Active
- 2016-02-29 MY MYPI2017703386A patent/MY183238A/en unknown
- 2016-03-08 TW TW105107041A patent/TWI617436B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102531073B1 (ko) | 2023-05-09 |
TW201710077A (zh) | 2017-03-16 |
WO2016152390A1 (ja) | 2016-09-29 |
CN107428129B (zh) | 2019-06-18 |
CN107428129A (zh) | 2017-12-01 |
KR20170131832A (ko) | 2017-11-30 |
JPWO2016152390A1 (ja) | 2018-01-11 |
JP6650923B2 (ja) | 2020-02-19 |
TWI617436B (zh) | 2018-03-11 |
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