MY183238A - Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board - Google Patents

Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Info

Publication number
MY183238A
MY183238A MYPI2017703386A MYPI2017703386A MY183238A MY 183238 A MY183238 A MY 183238A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY PI2017703386 A MYPI2017703386 A MY PI2017703386A MY 183238 A MY183238 A MY 183238A
Authority
MY
Malaysia
Prior art keywords
copper foil
thin copper
carrier
extremely thin
wiring board
Prior art date
Application number
MYPI2017703386A
Other languages
English (en)
Inventor
Daisuke Nakajima
Toru Hanada
Kazuhiro Yoshikawa
Yoshinori Shimizu
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY183238A publication Critical patent/MY183238A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
MYPI2017703386A 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board MY183238A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060816 2015-03-24
PCT/JP2016/056014 WO2016152390A1 (ja) 2015-03-24 2016-02-29 キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
MY183238A true MY183238A (en) 2021-02-18

Family

ID=56978004

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703386A MY183238A (en) 2015-03-24 2016-02-29 Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6650923B2 (zh)
KR (1) KR102531073B1 (zh)
CN (1) CN107428129B (zh)
MY (1) MY183238A (zh)
TW (1) TWI617436B (zh)
WO (1) WO2016152390A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7177956B2 (ja) * 2020-02-04 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2023189566A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔、金属張積層板及びプリント配線板
WO2023189565A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔、金属張積層板及びプリント配線板

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3340307B2 (ja) 1996-03-11 2002-11-05 三井金属鉱業株式会社 プリント配線板用銅箔の製造方法
JP3142270B2 (ja) 1998-04-01 2001-03-07 三井金属鉱業株式会社 プリント配線板の製造方法
EP1172025B2 (en) * 1999-03-23 2006-04-26 Circuit Foil Luxembourg S.a.r.l. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP2001068816A (ja) * 1999-08-24 2001-03-16 Mitsui Mining & Smelting Co Ltd 銅張積層板及びその銅張積層板を用いたレーザー加工方法
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP3261119B2 (ja) * 2000-05-16 2002-02-25 三井金属鉱業株式会社 プリント配線板の製造方法
JP2002026475A (ja) * 2000-07-07 2002-01-25 Mitsui Mining & Smelting Co Ltd キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
EP1481796B1 (en) * 2002-03-05 2015-08-19 Hitachi Chemical Co., Ltd. Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
JP2004263296A (ja) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk ファインパターンプリント配線用銅箔とその製造方法
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP5256747B2 (ja) * 2008-01-21 2013-08-07 宇部興産株式会社 セミアディティブ法による銅配線絶縁フィルムの製造法、及びこれらから製造された銅配線絶縁フィルム
JP5242710B2 (ja) * 2010-01-22 2013-07-24 古河電気工業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN101892499B (zh) * 2010-07-24 2011-11-09 江西理工大学 以铜箔作载体的可剥离超薄铜箔及其制备方法
KR20140009323A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
WO2013108599A1 (ja) * 2012-01-17 2013-07-25 パナソニック株式会社 配線基板とその製造方法
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP2014208482A (ja) * 2013-03-29 2014-11-06 Jx日鉱日石金属株式会社 キャリア付銅箔、プリント配線板、銅張積層板、電子機器及びプリント配線板の製造方法
JP5503789B2 (ja) * 2013-08-30 2014-05-28 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP6027296B1 (ja) * 2015-01-30 2016-11-16 株式会社フジクラ 配線体、配線基板、及びタッチセンサ

Also Published As

Publication number Publication date
KR102531073B1 (ko) 2023-05-09
TW201710077A (zh) 2017-03-16
WO2016152390A1 (ja) 2016-09-29
CN107428129B (zh) 2019-06-18
CN107428129A (zh) 2017-12-01
KR20170131832A (ko) 2017-11-30
JPWO2016152390A1 (ja) 2018-01-11
JP6650923B2 (ja) 2020-02-19
TWI617436B (zh) 2018-03-11

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