MY179707A - Thermosetting silicone composition, die bonding material comprising the same, and photosemiconductor apparatus having cured product of die bonding material - Google Patents
Thermosetting silicone composition, die bonding material comprising the same, and photosemiconductor apparatus having cured product of die bonding materialInfo
- Publication number
- MY179707A MY179707A MYPI2017701731A MYPI2017701731A MY179707A MY 179707 A MY179707 A MY 179707A MY PI2017701731 A MYPI2017701731 A MY PI2017701731A MY PI2017701731 A MYPI2017701731 A MY PI2017701731A MY 179707 A MY179707 A MY 179707A
- Authority
- MY
- Malaysia
- Prior art keywords
- bonding material
- die bonding
- mass
- parts
- silicone composition
- Prior art date
Links
- 229920001296 polysiloxane Polymers 0.000 title abstract 4
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 3
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- -1 silane compound Chemical class 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000012933 diacyl peroxide Substances 0.000 abstract 1
- 150000001451 organic peroxides Chemical class 0.000 abstract 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014247516A JP6272747B2 (ja) | 2014-12-08 | 2014-12-08 | 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY179707A true MY179707A (en) | 2020-11-11 |
Family
ID=56106969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017701731A MY179707A (en) | 2014-12-08 | 2015-10-19 | Thermosetting silicone composition, die bonding material comprising the same, and photosemiconductor apparatus having cured product of die bonding material |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6272747B2 (ko) |
KR (1) | KR101947621B1 (ko) |
CN (1) | CN107001769B (ko) |
MY (1) | MY179707A (ko) |
TW (1) | TWI606093B (ko) |
WO (1) | WO2016092728A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6622171B2 (ja) | 2016-11-08 | 2019-12-18 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置 |
JP7352334B2 (ja) * | 2017-09-19 | 2023-09-28 | 三洋化成工業株式会社 | 活性エネルギー線硬化性組成物 |
US11591470B2 (en) * | 2018-01-15 | 2023-02-28 | Shin-Etsu Chemical Co., Ltd. | Silicone composition |
JP7172805B2 (ja) * | 2019-04-02 | 2022-11-16 | 信越化学工業株式会社 | 付加硬化型シリコーン接着剤組成物 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI437047B (zh) * | 2006-01-12 | 2014-05-11 | Shinetsu Chemical Co | 用於發光二極體元件的紫外光可固化矽氧組成物 |
JP5015571B2 (ja) * | 2006-01-12 | 2012-08-29 | 信越化学工業株式会社 | 発光ダイオード素子用紫外線硬化型シリコーン組成物 |
JP4563977B2 (ja) * | 2006-09-22 | 2010-10-20 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子 |
JP5292704B2 (ja) * | 2007-02-23 | 2013-09-18 | 横浜ゴム株式会社 | 発光素子用封止材組成物、その硬化物および発光素子封止体 |
JP2010013572A (ja) * | 2008-07-04 | 2010-01-21 | Nippon Kayaku Co Ltd | 感光性樹脂組成物及び反射防止フィルム |
JP2012107127A (ja) * | 2010-11-17 | 2012-06-07 | Yokohama Rubber Co Ltd:The | シリコーン樹脂組成物、ならびに、これを用いて得られるシリコーン樹脂含有構造体および光半導体素子封止体 |
JP5805420B2 (ja) * | 2011-03-31 | 2015-11-04 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサンを用いた熱硬化性樹脂組成物、光半導体用封止材、半導体用ダイボンド材、光半導体パッケージ、光半導体 |
WO2014017887A1 (ko) * | 2012-07-27 | 2014-01-30 | 주식회사 엘지화학 | 경화성 조성물 |
JP2014031394A (ja) * | 2012-08-01 | 2014-02-20 | Shin Etsu Chem Co Ltd | 付加硬化型シリコーン組成物、及び該組成物の硬化物により半導体素子が被覆された半導体装置 |
JP6096087B2 (ja) * | 2012-12-21 | 2017-03-15 | 信越化学工業株式会社 | 硬化性シリコーン樹脂組成物、その硬化物及び光半導体デバイス |
JP6387270B2 (ja) * | 2013-08-29 | 2018-09-05 | 旭化成株式会社 | 光反射材用樹脂組成物、光反射材、光半導体部品用リフレクタ、及び光半導体部品 |
-
2014
- 2014-12-08 JP JP2014247516A patent/JP6272747B2/ja active Active
-
2015
- 2015-10-19 KR KR1020177015519A patent/KR101947621B1/ko active IP Right Grant
- 2015-10-19 MY MYPI2017701731A patent/MY179707A/en unknown
- 2015-10-19 CN CN201580065668.7A patent/CN107001769B/zh active Active
- 2015-10-19 WO PCT/JP2015/005250 patent/WO2016092728A1/ja active Application Filing
- 2015-10-27 TW TW104135267A patent/TWI606093B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN107001769A (zh) | 2017-08-01 |
TWI606093B (zh) | 2017-11-21 |
JP6272747B2 (ja) | 2018-01-31 |
KR20170092571A (ko) | 2017-08-11 |
CN107001769B (zh) | 2019-07-09 |
JP2016108456A (ja) | 2016-06-20 |
WO2016092728A1 (ja) | 2016-06-16 |
KR101947621B1 (ko) | 2019-02-14 |
TW201631040A (zh) | 2016-09-01 |
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