MY166727A - Electronic device - Google Patents

Electronic device

Info

Publication number
MY166727A
MY166727A MYPI2013702011A MYPI2013702011A MY166727A MY 166727 A MY166727 A MY 166727A MY PI2013702011 A MYPI2013702011 A MY PI2013702011A MY PI2013702011 A MYPI2013702011 A MY PI2013702011A MY 166727 A MY166727 A MY 166727A
Authority
MY
Malaysia
Prior art keywords
board
electronic component
sealing resin
metal cover
electronic device
Prior art date
Application number
MYPI2013702011A
Inventor
Tomoya Akashi
Takeshi Yanagisawa
Ryota Takagi
Yuki Yoshimura
Original Assignee
Shindengen Electric Mfg
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Mfg, Honda Motor Co Ltd filed Critical Shindengen Electric Mfg
Publication of MY166727A publication Critical patent/MY166727A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present electronic device includes: a board; an electronic component provided on a mounting surface of the board; a metal cover provided on the board and covering the electronic component; a casing housing the board, the electronic component, and the metal cover; and a sealing resin filling the casing. The board and the electronic component are buried in the sealing resin, and space inside and outside the metal cover is filled with the sealing resin. Figure 1.
MYPI2013702011A 2012-10-03 2012-10-03 Electronic device MY166727A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/075719 WO2014054145A1 (en) 2012-10-03 2012-10-03 Electronic device

Publications (1)

Publication Number Publication Date
MY166727A true MY166727A (en) 2018-07-18

Family

ID=50434504

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013702011A MY166727A (en) 2012-10-03 2012-10-03 Electronic device

Country Status (7)

Country Link
JP (1) JP5528641B1 (en)
CN (1) CN104718804B (en)
BR (1) BR112013028804B1 (en)
IT (1) ITTO20130777A1 (en)
MY (1) MY166727A (en)
TW (1) TWI559835B (en)
WO (1) WO2014054145A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6287595B2 (en) * 2014-06-03 2018-03-07 株式会社デンソー Electronic equipment
WO2017056727A1 (en) * 2015-09-29 2017-04-06 日立オートモティブシステムズ株式会社 Electronic control device
DE102016224083A1 (en) 2016-12-02 2018-06-07 Robert Bosch Gmbh Electrical assembly
US10834827B2 (en) * 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap
JP7366676B2 (en) * 2019-09-27 2023-10-23 メイコーエンベデッドプロダクツ株式会社 Electronics
US11330734B2 (en) * 2020-05-28 2022-05-10 Htc Corporation Case assembly and electronic device
CN111988936A (en) * 2020-08-17 2020-11-24 中国兵器工业集团第二一四研究所苏州研发中心 Electronic module high overload resistance reinforcing structure and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1123515A (en) * 1994-11-24 1996-05-29 三菱电机株式会社 Resin-molded electronic circuit device
JP4121185B2 (en) * 1998-06-12 2008-07-23 新電元工業株式会社 Electronic circuit equipment
JP3858801B2 (en) * 2002-10-10 2006-12-20 株式会社日立製作所 In-vehicle millimeter-wave radar device, millimeter-wave radar module, and manufacturing method thereof
JP4682762B2 (en) * 2005-09-13 2011-05-11 東芝ライテック株式会社 Electronic device, lighting device, and lighting fixture
US7994635B2 (en) * 2007-05-18 2011-08-09 Sansha Electric Manufacturing Co., Ltd. Power semiconductor module
WO2009037807A1 (en) * 2007-09-21 2009-03-26 Panasonic Corporation Electronic component package and method for producing the same
JP2009146953A (en) * 2007-12-11 2009-07-02 Toshiba Lighting & Technology Corp Electronic apparatus, and luminaire
JP5413829B2 (en) * 2008-11-10 2014-02-12 サンデン株式会社 Inverter-integrated electric compressor
JP4948613B2 (en) * 2010-02-25 2012-06-06 三菱電機株式会社 Resin-sealed electronic control device and manufacturing method thereof
JP2011216652A (en) * 2010-03-31 2011-10-27 Toshiba Lighting & Technology Corp Electrical apparatus

Also Published As

Publication number Publication date
ITTO20130777A1 (en) 2014-04-04
CN104718804B (en) 2018-10-23
JP5528641B1 (en) 2014-06-25
JPWO2014054145A1 (en) 2016-08-25
TWI559835B (en) 2016-11-21
WO2014054145A1 (en) 2014-04-10
CN104718804A (en) 2015-06-17
BR112013028804A2 (en) 2017-01-31
BR112013028804B1 (en) 2020-11-17
TW201427544A (en) 2014-07-01

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