MY153576A - Semi-conductor module - Google Patents

Semi-conductor module

Info

Publication number
MY153576A
MY153576A MYPI2011004567A MYPI2011004567A MY153576A MY 153576 A MY153576 A MY 153576A MY PI2011004567 A MYPI2011004567 A MY PI2011004567A MY PI2011004567 A MYPI2011004567 A MY PI2011004567A MY 153576 A MY153576 A MY 153576A
Authority
MY
Malaysia
Prior art keywords
semi
resin body
metal plate
conductor chip
metal
Prior art date
Application number
MYPI2011004567A
Inventor
Shinsuke Oota
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of MY153576A publication Critical patent/MY153576A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/4901—Structure
    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A RESIN BODY (20) IS FORMED IN A PLATE SHAPE COVERING A SEMI-CONDUCTOR CHIP (10). MULTIPLE TERMINALS (31, 33) ARE ELECTRICALLY CONNECTED TO THE SEMI-CONDUCTOR CHIP (10) AND PROTRUDING FROM THE RESIN BODY (20), SO THAT THE PROTRUDING TERMINALS (31, 33) ARE SOLDERED TO WIRING PATTERNS (180) FORMED ON A CIRCUIT BOARD (130). A METAL PLATE (40) IS FORMED IN A PLATE SHAPE AND PROVIDED AT ONE RESIN SURFACE (21) OF THE RESIN BODY (20). ONE METAL SURFACE (43) OF THE METAL PLATE (40) IS EXPOSED TO THE OUTSIDE, WHILE THE OTHER METAL SURFACE (44) IS ELECTRICALLY CONNECTED TO THE SEMI-CONDUCTOR CHIP. THE METAL PLATE (40) HAS AN EXTENDING PORTION (42). THE METAL PLATE (40) AND THE RESIN BODY SATISFY A RELATION OF ?0.5 ? SM/SR ? 1.0?, WHEREIN ?SM? IS AN AREA OF THE EXTENDING PORTION (42) AND ?SR? IS AN AREA OF THE RESIN BODY (20).
MYPI2011004567A 2010-09-27 2011-09-26 Semi-conductor module MY153576A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010215601A JP5454438B2 (en) 2010-09-27 2010-09-27 Semiconductor module

Publications (1)

Publication Number Publication Date
MY153576A true MY153576A (en) 2015-02-27

Family

ID=45944532

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011004567A MY153576A (en) 2010-09-27 2011-09-26 Semi-conductor module

Country Status (3)

Country Link
JP (1) JP5454438B2 (en)
CN (1) CN102420199B (en)
MY (1) MY153576A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019146402A1 (en) * 2018-01-25 2019-08-01 三菱電機株式会社 Power conversion device and method for manufacturing power conversion device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06349980A (en) * 1993-06-03 1994-12-22 Canon Inc Semiconductor element
JPH0846104A (en) * 1994-05-31 1996-02-16 Motorola Inc Surface installation electronic device and its preparation
JP3922809B2 (en) * 1998-07-09 2007-05-30 株式会社東芝 Semiconductor device
JP2002134685A (en) * 2000-10-26 2002-05-10 Rohm Co Ltd Integrated circuit device
JP4084984B2 (en) * 2002-10-23 2008-04-30 株式会社ルネサステクノロジ Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP5454438B2 (en) 2014-03-26
JP2012069887A (en) 2012-04-05
CN102420199A (en) 2012-04-18
CN102420199B (en) 2015-04-22

Similar Documents

Publication Publication Date Title
TW200635453A (en) Hybrid circuit board and display device having the same
TW201130110A (en) Multi-layer semiconductor package
TWI260056B (en) Module structure having an embedded chip
MY158237A (en) Electronic control unit
MY163911A (en) Leadless integrated circuit package having high density contacts
TW200644343A (en) Printed circuit board, connector, and electronic device
IN2012DN03163A (en)
WO2008146603A1 (en) Semiconductor device and its manufacturing method, and display and its manufacturing method
WO2008090734A1 (en) Semiconductor device for power
TW200731140A (en) A semiconductor device and a method for manufacturing the same
TW200623549A (en) Connector and electronic apparatus having the same
TW200633632A (en) Shielding structure
TW200730051A (en) Wiring board
MY166129A (en) Electronic card having an external connector
WO2009031588A1 (en) Circuit board, circuit module and circuit board manufacturing method
TW200723972A (en) Circuit board module and forming method thereof
TW200721418A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device
WO2012064095A3 (en) Light-emitting module
TW200733471A (en) Connection apparatus for chip antenna
WO2008091474A3 (en) Stackable leadless electronic package
MY153576A (en) Semi-conductor module
WO2008129713A1 (en) Semiconductor chip and high frequency circuit
JP2014120582A5 (en)
TW200802640A (en) Carrier structure for semiconductor component and stack structure thereof
TW200632350A (en) Application module of test board