MY128103A - Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations - Google Patents
Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulationsInfo
- Publication number
- MY128103A MY128103A MYPI98002016A MYPI9802016A MY128103A MY 128103 A MY128103 A MY 128103A MY PI98002016 A MYPI98002016 A MY PI98002016A MY PI9802016 A MYPI9802016 A MY PI9802016A MY 128103 A MY128103 A MY 128103A
- Authority
- MY
- Malaysia
- Prior art keywords
- undercoat
- powder materials
- electrically conductive
- conductive paste
- electrodeposited
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86877197A | 1997-06-04 | 1997-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY128103A true MY128103A (en) | 2007-01-31 |
Family
ID=25352284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI98002016A MY128103A (en) | 1997-06-04 | 1998-05-06 | Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100292317B1 (zh) |
CN (1) | CN1085382C (zh) |
MY (1) | MY128103A (zh) |
SG (1) | SG76544A1 (zh) |
TW (1) | TW396471B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100347139B1 (ko) * | 1999-12-31 | 2002-08-03 | 주식회사 하이닉스반도체 | 반도체 패키지용 에폭시 수지 혼합물의 충전재 |
KR100746330B1 (ko) * | 2005-11-24 | 2007-08-03 | 한국과학기술원 | 초음파를 이용한 전자부품간의 접속방법 |
US8592256B2 (en) * | 2007-02-16 | 2013-11-26 | Sumitomo Bakelite Co., Ltd. | Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
CN102184905A (zh) * | 2011-04-26 | 2011-09-14 | 哈尔滨工业大学 | 单金属间化合物微互连焊点结构 |
EP2557571B1 (en) * | 2011-08-08 | 2014-07-02 | Tyco Electronics Corporation | Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such |
JP6132716B2 (ja) * | 2013-09-10 | 2017-05-24 | 株式会社東芝 | 金属粒子ペースト、これを用いた硬化物、および半導体装置 |
KR101678514B1 (ko) * | 2015-08-31 | 2016-12-06 | 전북대학교산학협력단 | 실버 나노덴트라이트를 포함하는 셀룰로오스 박막 전극 및 그 제조방법 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0528829A (ja) * | 1991-07-12 | 1993-02-05 | Tokyo Cosmos Electric Co Ltd | 導電塗料及びその導電膜形成方法 |
JPH065116A (ja) * | 1992-06-19 | 1994-01-14 | Shin Etsu Polymer Co Ltd | 低融点金属接合型異方導電膜 |
TW340132B (en) * | 1994-10-20 | 1998-09-11 | Ibm | Structure for use as an electrical interconnection means and process for preparing the same |
US5958590A (en) * | 1995-03-31 | 1999-09-28 | International Business Machines Corporation | Dendritic powder materials for high conductivity paste applications |
-
1998
- 1998-03-06 TW TW087103284A patent/TW396471B/zh not_active IP Right Cessation
- 1998-05-04 CN CN98108096A patent/CN1085382C/zh not_active Expired - Fee Related
- 1998-05-06 MY MYPI98002016A patent/MY128103A/en unknown
- 1998-05-14 KR KR19980017435A patent/KR100292317B1/ko not_active IP Right Cessation
- 1998-06-02 SG SG1998001183A patent/SG76544A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1202405A (zh) | 1998-12-23 |
CN1085382C (zh) | 2002-05-22 |
KR100292317B1 (ko) | 2001-11-22 |
SG76544A1 (en) | 2000-11-21 |
TW396471B (en) | 2000-07-01 |
KR19990006446A (ko) | 1999-01-25 |
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