MY128103A - Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations - Google Patents

Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations

Info

Publication number
MY128103A
MY128103A MYPI98002016A MYPI9802016A MY128103A MY 128103 A MY128103 A MY 128103A MY PI98002016 A MYPI98002016 A MY PI98002016A MY PI9802016 A MYPI9802016 A MY PI9802016A MY 128103 A MY128103 A MY 128103A
Authority
MY
Malaysia
Prior art keywords
undercoat
powder materials
electrically conductive
conductive paste
electrodeposited
Prior art date
Application number
MYPI98002016A
Inventor
Sung Kwon Kan
Sampath Purushothaman
Rajinder Singh Rai
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY128103A publication Critical patent/MY128103A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

WHAT IS DESCRIBED IS NEW ELECTRODEPOSITED POWDER MATERIALS TO BE USED FOR THE ELECTRICALLY CONDUCTIVE PASTE FORMULATIONS, IN SEVERAL TYPES OF THEIR STRUCTURES AS FOLLOWS: ELECTRODEPOSITED POWDER CONSISTING OF SN(UNDERCOAT)/CU(DENDRITE)/SN(BARRIER)/IN(OVERCOAT.THE SN (BARRIER) LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn, Ni, Co, Cr, Fe, AND Pd.THE UNDERCOAT SN LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn IN, Zn, Sb, Bi AND Ag. ELECTRODEPOSITED POWDER CONSISTING OF Sn (UNDERCOAT)/CU(DENDRITE)/Bi-Sn (OVERCOAT).WHAT IS ADDITIONALLY CLAIMED IS THE USAGE OF THIS ELECTRODEPOSITED POWDER MATERIALS TO MAKE FILLED POLYMER PASTES FOR MAKING CONDUCTING LINES, GROUND PLANES, AND VIA FILLS IN THE CONVENTIONAL PRINTED CIRCUIT BOARDS BY REPLACING EITHER THE ADDITIVE OR SUBTRACTIVE CU TECHNOLOGY. THIS WILL FACILITATE THE ELIMINATION OF PROCESS STEPS AND CHEMICALS THUS REDUCING COST AND THE ENVIRONMENTAL IMPACT ASSOCIATED WITH PRINTED CIRCUIT BOARD MANUFACTURING. IT IS ALSO CLAIMED THAT THE PASTE CAN BE USED TO ATTACH ELECTRONIC COMPONENTS SUCH AS CHIPS AND CHIP CARRIER TAPES TO SUBSTRATES SUCH AS CHIP CARRIERS THAT PANEL DISPLAY GLASS AND PRINTED WIRING BOARDS.(FIG. 5)
MYPI98002016A 1997-06-04 1998-05-06 Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations MY128103A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86877197A 1997-06-04 1997-06-04

Publications (1)

Publication Number Publication Date
MY128103A true MY128103A (en) 2007-01-31

Family

ID=25352284

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI98002016A MY128103A (en) 1997-06-04 1998-05-06 Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations

Country Status (5)

Country Link
KR (1) KR100292317B1 (en)
CN (1) CN1085382C (en)
MY (1) MY128103A (en)
SG (1) SG76544A1 (en)
TW (1) TW396471B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100347139B1 (en) * 1999-12-31 2002-08-03 주식회사 하이닉스반도체 Filler of epoxy resin compositions for semiconductor package
KR100746330B1 (en) * 2005-11-24 2007-08-03 한국과학기술원 Method for bonding between electrical devices using ultrasonication
US8592256B2 (en) * 2007-02-16 2013-11-26 Sumitomo Bakelite Co., Ltd. Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device
CN102184905A (en) * 2011-04-26 2011-09-14 哈尔滨工业大学 Micro-interconnection welding spot structure of single intermetallic compounds
EP2557571B1 (en) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such
JP6132716B2 (en) * 2013-09-10 2017-05-24 株式会社東芝 Metal particle paste, cured product using the same, and semiconductor device
KR101678514B1 (en) * 2015-08-31 2016-12-06 전북대학교산학협력단 Cellulose thin film electrode comprising silver nanodendrites and fabrication method for the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0528829A (en) * 1991-07-12 1993-02-05 Tokyo Cosmos Electric Co Ltd Conductive coating and conductive film formation thereof
JPH065116A (en) * 1992-06-19 1994-01-14 Shin Etsu Polymer Co Ltd Low melting point metal joined type anisotropic conductive film
TW340132B (en) * 1994-10-20 1998-09-11 Ibm Structure for use as an electrical interconnection means and process for preparing the same
US5958590A (en) * 1995-03-31 1999-09-28 International Business Machines Corporation Dendritic powder materials for high conductivity paste applications

Also Published As

Publication number Publication date
CN1202405A (en) 1998-12-23
CN1085382C (en) 2002-05-22
KR100292317B1 (en) 2001-11-22
SG76544A1 (en) 2000-11-21
TW396471B (en) 2000-07-01
KR19990006446A (en) 1999-01-25

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