MY128103A - Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations - Google Patents
Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulationsInfo
- Publication number
- MY128103A MY128103A MYPI98002016A MYPI9802016A MY128103A MY 128103 A MY128103 A MY 128103A MY PI98002016 A MYPI98002016 A MY PI98002016A MY PI9802016 A MYPI9802016 A MY PI9802016A MY 128103 A MY128103 A MY 128103A
- Authority
- MY
- Malaysia
- Prior art keywords
- undercoat
- powder materials
- electrically conductive
- conductive paste
- electrodeposited
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
WHAT IS DESCRIBED IS NEW ELECTRODEPOSITED POWDER MATERIALS TO BE USED FOR THE ELECTRICALLY CONDUCTIVE PASTE FORMULATIONS, IN SEVERAL TYPES OF THEIR STRUCTURES AS FOLLOWS: ELECTRODEPOSITED POWDER CONSISTING OF SN(UNDERCOAT)/CU(DENDRITE)/SN(BARRIER)/IN(OVERCOAT.THE SN (BARRIER) LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn, Ni, Co, Cr, Fe, AND Pd.THE UNDERCOAT SN LAYER CAN BE REPLACED BY ONE OF THE FOLLOWING METALS AND THEIR ALLOYS; Sn IN, Zn, Sb, Bi AND Ag. ELECTRODEPOSITED POWDER CONSISTING OF Sn (UNDERCOAT)/CU(DENDRITE)/Bi-Sn (OVERCOAT).WHAT IS ADDITIONALLY CLAIMED IS THE USAGE OF THIS ELECTRODEPOSITED POWDER MATERIALS TO MAKE FILLED POLYMER PASTES FOR MAKING CONDUCTING LINES, GROUND PLANES, AND VIA FILLS IN THE CONVENTIONAL PRINTED CIRCUIT BOARDS BY REPLACING EITHER THE ADDITIVE OR SUBTRACTIVE CU TECHNOLOGY. THIS WILL FACILITATE THE ELIMINATION OF PROCESS STEPS AND CHEMICALS THUS REDUCING COST AND THE ENVIRONMENTAL IMPACT ASSOCIATED WITH PRINTED CIRCUIT BOARD MANUFACTURING. IT IS ALSO CLAIMED THAT THE PASTE CAN BE USED TO ATTACH ELECTRONIC COMPONENTS SUCH AS CHIPS AND CHIP CARRIER TAPES TO SUBSTRATES SUCH AS CHIP CARRIERS THAT PANEL DISPLAY GLASS AND PRINTED WIRING BOARDS.(FIG. 5)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86877197A | 1997-06-04 | 1997-06-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY128103A true MY128103A (en) | 2007-01-31 |
Family
ID=25352284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI98002016A MY128103A (en) | 1997-06-04 | 1998-05-06 | Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100292317B1 (en) |
CN (1) | CN1085382C (en) |
MY (1) | MY128103A (en) |
SG (1) | SG76544A1 (en) |
TW (1) | TW396471B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100347139B1 (en) * | 1999-12-31 | 2002-08-03 | 주식회사 하이닉스반도체 | Filler of epoxy resin compositions for semiconductor package |
KR100746330B1 (en) * | 2005-11-24 | 2007-08-03 | 한국과학기술원 | Method for bonding between electrical devices using ultrasonication |
US8592256B2 (en) * | 2007-02-16 | 2013-11-26 | Sumitomo Bakelite Co., Ltd. | Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
CN102184905A (en) * | 2011-04-26 | 2011-09-14 | 哈尔滨工业大学 | Micro-interconnection welding spot structure of single intermetallic compounds |
EP2557571B1 (en) * | 2011-08-08 | 2014-07-02 | Tyco Electronics Corporation | Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such |
JP6132716B2 (en) * | 2013-09-10 | 2017-05-24 | 株式会社東芝 | Metal particle paste, cured product using the same, and semiconductor device |
KR101678514B1 (en) * | 2015-08-31 | 2016-12-06 | 전북대학교산학협력단 | Cellulose thin film electrode comprising silver nanodendrites and fabrication method for the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0528829A (en) * | 1991-07-12 | 1993-02-05 | Tokyo Cosmos Electric Co Ltd | Conductive coating and conductive film formation thereof |
JPH065116A (en) * | 1992-06-19 | 1994-01-14 | Shin Etsu Polymer Co Ltd | Low melting point metal joined type anisotropic conductive film |
TW340132B (en) * | 1994-10-20 | 1998-09-11 | Ibm | Structure for use as an electrical interconnection means and process for preparing the same |
US5958590A (en) * | 1995-03-31 | 1999-09-28 | International Business Machines Corporation | Dendritic powder materials for high conductivity paste applications |
-
1998
- 1998-03-06 TW TW087103284A patent/TW396471B/en not_active IP Right Cessation
- 1998-05-04 CN CN98108096A patent/CN1085382C/en not_active Expired - Fee Related
- 1998-05-06 MY MYPI98002016A patent/MY128103A/en unknown
- 1998-05-14 KR KR19980017435A patent/KR100292317B1/en not_active IP Right Cessation
- 1998-06-02 SG SG1998001183A patent/SG76544A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN1202405A (en) | 1998-12-23 |
CN1085382C (en) | 2002-05-22 |
KR100292317B1 (en) | 2001-11-22 |
SG76544A1 (en) | 2000-11-21 |
TW396471B (en) | 2000-07-01 |
KR19990006446A (en) | 1999-01-25 |
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