MX336698B - Sensor de presion de fluido y sonda de medicion. - Google Patents
Sensor de presion de fluido y sonda de medicion.Info
- Publication number
- MX336698B MX336698B MX2014006922A MX2014006922A MX336698B MX 336698 B MX336698 B MX 336698B MX 2014006922 A MX2014006922 A MX 2014006922A MX 2014006922 A MX2014006922 A MX 2014006922A MX 336698 B MX336698 B MX 336698B
- Authority
- MX
- Mexico
- Prior art keywords
- lateral walls
- fluid pressure
- sensitive membrane
- pressure sensor
- measurement probe
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
La presente invención se refiere a un sensor de medición de la presión de fluido (11) que comprende un chip de sistema microelectromecánico (MEMS) (23). El chip de MEMS (23) comprende dos paredes laterales (56), una membrana sensible (49) conectada a tales paredes laterales (56) y cavidad sellada (9). Las superficies exteriores de las paredes laterales (56) y la membrana sensitiva (49) están expuestas a la presión de fluido. Las paredes laterales (56) están diseñadas para someter la membrana sensitiva (49) a un estrés de compresión transmitido por las paredes laterales opuestas (56) donde tales paredes laterales (56) están conectadas a la membrana sensitiva (49) de manera que la membrana sensitiva (49) funciona en compresión solamente. El chip de MEMS (23) también comprende un circuito de detección de estrés (31) para medir el estado de compresión de la membrana sensitiva (49) el cual es proporcional a la presión del fluido.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1161376A FR2983955B1 (fr) | 2011-12-09 | 2011-12-09 | Capteur de pression pour fluide |
PCT/EP2012/074873 WO2013083821A1 (en) | 2011-12-09 | 2012-12-07 | Fluid pressure sensor and measurement probe |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2014006922A MX2014006922A (es) | 2015-01-22 |
MX336698B true MX336698B (es) | 2016-01-28 |
Family
ID=47435906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2014006922A MX336698B (es) | 2011-12-09 | 2012-12-07 | Sensor de presion de fluido y sonda de medicion. |
Country Status (9)
Country | Link |
---|---|
US (1) | US8931347B2 (es) |
EP (1) | EP2788732B1 (es) |
CN (1) | CN104040315B (es) |
AU (1) | AU2012350278B2 (es) |
BR (1) | BR112014013857B1 (es) |
CA (1) | CA2858146C (es) |
FR (1) | FR2983955B1 (es) |
MX (1) | MX336698B (es) |
WO (1) | WO2013083821A1 (es) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014205395A1 (en) | 2013-06-20 | 2014-12-24 | The Regents Of The University Of Michigan | Microdischarge-based transducer |
JP6273358B2 (ja) * | 2013-07-26 | 2018-01-31 | アジレント・テクノロジーズ・インクAgilent Technologies, Inc. | Hplc用途のための圧力判定 |
CN103604556A (zh) * | 2013-11-26 | 2014-02-26 | 无锡市纳微电子有限公司 | 一种流体压力传感器 |
JP6166185B2 (ja) * | 2014-01-06 | 2017-07-19 | アルプス電気株式会社 | Memsセンサ |
US9902611B2 (en) * | 2014-01-13 | 2018-02-27 | Nextinput, Inc. | Miniaturized and ruggedized wafer level MEMs force sensors |
WO2015142949A1 (en) | 2014-03-17 | 2015-09-24 | The Regents Of The University Of Michigan | Packaged microsystems |
DE102015104410B4 (de) * | 2015-03-24 | 2018-09-13 | Tdk-Micronas Gmbh | Drucksensor |
DE102015210919A1 (de) * | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
CN106313350B (zh) * | 2015-07-06 | 2018-06-29 | 天津职业技术师范大学 | 一种多线切割切割区温度测量装置 |
IT201600118077A1 (it) * | 2016-11-22 | 2018-05-22 | Francesco Tondolo | Sistema integrato e metodo per la misura della deformazione e/o tensione in elementi monodimensionali. |
WO2018148503A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated digital force sensors and related methods of manufacture |
WO2018148510A1 (en) | 2017-02-09 | 2018-08-16 | Nextinput, Inc. | Integrated piezoresistive and piezoelectric fusion force sensor |
IT201700071798A1 (it) * | 2017-06-27 | 2018-12-27 | St Microelectronics Srl | Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale |
CN111448446B (zh) | 2017-07-19 | 2022-08-30 | 触控解决方案股份有限公司 | 在mems力传感器中的应变传递堆叠 |
WO2019023309A1 (en) | 2017-07-25 | 2019-01-31 | Nextinput, Inc. | FORCE SENSOR AND INTEGRATED FINGERPRINTS |
WO2019023552A1 (en) | 2017-07-27 | 2019-01-31 | Nextinput, Inc. | PIEZORESISTIVE AND PIEZOELECTRIC FORCE SENSOR ON WAFER AND METHODS OF MANUFACTURING THE SAME |
US11579028B2 (en) | 2017-10-17 | 2023-02-14 | Nextinput, Inc. | Temperature coefficient of offset compensation for force sensor and strain gauge |
US11385108B2 (en) | 2017-11-02 | 2022-07-12 | Nextinput, Inc. | Sealed force sensor with etch stop layer |
US11874185B2 (en) | 2017-11-16 | 2024-01-16 | Nextinput, Inc. | Force attenuator for force sensor |
CN108760140A (zh) * | 2018-07-26 | 2018-11-06 | 沈阳白云机械有限公司 | 压力检测仪 |
US10962427B2 (en) | 2019-01-10 | 2021-03-30 | Nextinput, Inc. | Slotted MEMS force sensor |
WO2020175408A1 (ja) * | 2019-02-28 | 2020-09-03 | アルプスアルパイン株式会社 | 圧力センサ |
DE102019129411A1 (de) * | 2019-09-12 | 2021-03-18 | Wika Alexander Wiegand Se & Co. Kg | Aufnehmerkörper mit einem Messelement und Herstellungsverfahren für einen Aufnehmerkörper |
CN110749268A (zh) * | 2019-10-28 | 2020-02-04 | 江苏厚生新能源科技有限公司 | 适于检测隔膜弓形的测试装置及其工作方法 |
US11492255B2 (en) | 2020-04-03 | 2022-11-08 | Saudi Arabian Oil Company | Steam methane reforming with steam regeneration |
US11703408B1 (en) * | 2020-04-30 | 2023-07-18 | Senva, Inc. | Versatilely mountable pressure sensing apparatus, system, and/or method |
EP4158144A1 (en) | 2020-05-26 | 2023-04-05 | Saudi Arabian Oil Company | Geosteering in directional drilling |
EP4158154A1 (en) | 2020-05-26 | 2023-04-05 | Saudi Arabian Oil Company | Water detection for geosteering in directional drilling |
US11999619B2 (en) | 2020-06-18 | 2024-06-04 | Saudi Arabian Oil Company | Hydrogen production with membrane reactor |
US11492254B2 (en) | 2020-06-18 | 2022-11-08 | Saudi Arabian Oil Company | Hydrogen production with membrane reformer |
US11583824B2 (en) | 2020-06-18 | 2023-02-21 | Saudi Arabian Oil Company | Hydrogen production with membrane reformer |
US20220236128A1 (en) * | 2021-01-27 | 2022-07-28 | Honeywell International Inc. | Pressure sensor components having microfluidic channels |
US11718575B2 (en) | 2021-08-12 | 2023-08-08 | Saudi Arabian Oil Company | Methanol production via dry reforming and methanol synthesis in a vessel |
US11578016B1 (en) | 2021-08-12 | 2023-02-14 | Saudi Arabian Oil Company | Olefin production via dry reforming and olefin synthesis in a vessel |
US11787759B2 (en) | 2021-08-12 | 2023-10-17 | Saudi Arabian Oil Company | Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel |
US20230175905A1 (en) * | 2021-12-02 | 2023-06-08 | Goodrich Corporation | Pressure monitoring systems and methods for pressure bottle |
US11617981B1 (en) | 2022-01-03 | 2023-04-04 | Saudi Arabian Oil Company | Method for capturing CO2 with assisted vapor compression |
CN115290246B (zh) * | 2022-03-25 | 2024-07-19 | 西人马联合测控(泉州)科技有限公司 | 一种交叉耦合的双芯片压力传感器 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010001550A1 (en) * | 1998-11-12 | 2001-05-24 | Janusz Bryzek | Integral stress isolation apparatus and technique for semiconductor devices |
US6120458A (en) * | 1999-01-07 | 2000-09-19 | Welch Allyn, Inc. | Low profile pressure measure device |
FR2792070B1 (fr) * | 1999-04-06 | 2001-06-08 | Suez Lyonnaise Des Eaux | Appareil pour la mesure et l'enregistrement de la pression d'un reseau de distribution d'eau |
US6601452B2 (en) | 2000-06-05 | 2003-08-05 | Denso Corporation | Semiconductor pressure sensor having rounded corner portion of diaphragm |
US6928879B2 (en) | 2003-02-26 | 2005-08-16 | Robert Bosch Gmbh | Episeal pressure sensor and method for making an episeal pressure sensor |
US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
US7334484B2 (en) * | 2005-05-27 | 2008-02-26 | Rosemount Inc. | Line pressure measurement using differential pressure sensor |
JP4291394B1 (ja) * | 2008-03-12 | 2009-07-08 | ファナック株式会社 | 接触式計測装置 |
AT511330B1 (de) * | 2011-06-03 | 2012-11-15 | Piezocryst Advanced Sensorics | Sensor für die messung von druck und/oder kraft |
SG188777A1 (en) * | 2011-09-28 | 2013-04-30 | Agency Science Tech & Res | A sensor device |
-
2011
- 2011-12-09 FR FR1161376A patent/FR2983955B1/fr not_active Expired - Fee Related
-
2012
- 2012-12-07 CA CA2858146A patent/CA2858146C/en active Active
- 2012-12-07 MX MX2014006922A patent/MX336698B/es unknown
- 2012-12-07 AU AU2012350278A patent/AU2012350278B2/en active Active
- 2012-12-07 CN CN201280067062.3A patent/CN104040315B/zh not_active Expired - Fee Related
- 2012-12-07 US US13/707,802 patent/US8931347B2/en active Active
- 2012-12-07 BR BR112014013857-5A patent/BR112014013857B1/pt active IP Right Grant
- 2012-12-07 WO PCT/EP2012/074873 patent/WO2013083821A1/en active Application Filing
- 2012-12-07 EP EP12806393.0A patent/EP2788732B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
AU2012350278A1 (en) | 2014-06-26 |
FR2983955A1 (fr) | 2013-06-14 |
FR2983955B1 (fr) | 2014-10-03 |
US8931347B2 (en) | 2015-01-13 |
CN104040315B (zh) | 2016-03-09 |
US20130145853A1 (en) | 2013-06-13 |
MX2014006922A (es) | 2015-01-22 |
BR112014013857A2 (pt) | 2017-06-13 |
AU2012350278B2 (en) | 2015-11-26 |
EP2788732B1 (en) | 2021-02-24 |
WO2013083821A1 (en) | 2013-06-13 |
EP2788732A1 (en) | 2014-10-15 |
CN104040315A (zh) | 2014-09-10 |
CA2858146A1 (en) | 2013-06-13 |
CA2858146C (en) | 2019-02-12 |
BR112014013857B1 (pt) | 2020-09-29 |
BR112014013857A8 (pt) | 2017-06-13 |
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