MX2020006919A - Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura. - Google Patents

Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura.

Info

Publication number
MX2020006919A
MX2020006919A MX2020006919A MX2020006919A MX2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A
Authority
MX
Mexico
Prior art keywords
solder
alloy
paste
joint
ball
Prior art date
Application number
MX2020006919A
Other languages
English (en)
Inventor
Shunsaku Yoshikawa
Hikaru NOMURA
Takahiro Yokoyama
Takahiro MATSUFUJI
Kanta DEI
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2020006919A publication Critical patent/MX2020006919A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Se describe: una aleación de soldadura que tiene un bajo punto de fusión y por consiguiente, no sufre la presencia de fusión, tiene excelentes propiedades mecánicas y resistencia al impacto y también tiene excelente resistencia al ciclo térmico; una pasta de soldadura; una bola de soldadura; una soldadura con núcleo de resina y una junta de soldadura. La aleación de soldadura tiene una composición de aleación que comprende, en % en masa, 35 a 68% de Bi, 0.5% a 3.0% de In, 0.01 a 0.10% de Pd, el resto consiste en Sn, por el propósito de afinar la textura de aleación de la misma. La composición de aleación puede contener, en % en masa, 1.0 a 2.0% de In, también puede contener, en % en masa, 0.01 a 0.03% de Pd y también puede contener por lo menos uno de Co, Ti, Al y Mn en la cantidad total de, en % en masa, 0.1% o menos. La aleación de soldadura se puede usar apropiadamente en una pasta de soldadura, una bola de soldadura, una soldadura con núcleo de resina y una junta de soldadura.
MX2020006919A 2018-03-08 2018-12-21 Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura. MX2020006919A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018042040 2018-03-08
JP2018138511A JP6418349B1 (ja) 2018-03-08 2018-07-24 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
PCT/JP2018/047180 WO2019171710A1 (ja) 2018-03-08 2018-12-21 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手

Publications (1)

Publication Number Publication Date
MX2020006919A true MX2020006919A (es) 2021-09-14

Family

ID=64098779

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020006919A MX2020006919A (es) 2018-03-08 2018-12-21 Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura.

Country Status (19)

Country Link
US (1) US20210001431A1 (es)
EP (1) EP3715040B1 (es)
JP (1) JP6418349B1 (es)
KR (1) KR102194027B1 (es)
CN (1) CN111683785B (es)
BR (1) BR112020013321B1 (es)
CA (1) CA3093091C (es)
ES (1) ES2893576T3 (es)
HR (1) HRP20211729T1 (es)
HU (1) HUE056461T2 (es)
MX (1) MX2020006919A (es)
MY (1) MY194476A (es)
PH (1) PH12020551403A1 (es)
PL (1) PL3715040T3 (es)
PT (1) PT3715040T (es)
SG (1) SG11202008635PA (es)
TW (1) TWI677581B (es)
UA (1) UA126095C2 (es)
WO (1) WO2019171710A1 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018134673A1 (ja) * 2017-01-20 2018-07-26 レノボ・シンガポール・プライベート・リミテッド はんだ接合方法、およびはんだ継手
JP6795778B1 (ja) * 2020-03-30 2020-12-02 千住金属工業株式会社 フラックス、フラックスを用いたやに入りはんだ、フラックスを用いたフラックスコートはんだ、およびはんだ付け方法
KR20220012743A (ko) 2020-07-23 2022-02-04 현대모비스 주식회사 모터용 버스바 유닛
CN112620649B (zh) * 2020-11-30 2022-04-12 华中科技大学 一种铝合金材料及基于该材料的激光3d打印铝合金构件
CN113798722B (zh) * 2021-09-30 2022-09-27 大连理工大学 一种复合焊膏及应用其制备组织为细晶β-Sn晶粒的BGA焊锡球/焊点的方法
KR20230050125A (ko) 2021-10-07 2023-04-14 엠케이전자 주식회사 무연 솔더 합금 및 이를 이용한 전자 장치 제조 방법
WO2024042663A1 (ja) * 2022-08-24 2024-02-29 株式会社タムラ製作所 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810451B2 (ja) * 1975-03-20 1983-02-25 株式会社東芝 Ｂｉ−ｓｎ−ｉｎ ケイゴウキン
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
JP3224185B2 (ja) * 1994-09-29 2001-10-29 富士通株式会社 はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP4230194B2 (ja) * 2002-10-30 2009-02-25 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用線材
CN101051535B (zh) * 2006-04-06 2012-09-19 日立电线株式会社 配线用导体及其制造方法、终端连接部、无铅焊锡合金
JP4789198B2 (ja) * 2006-06-07 2011-10-12 有限会社ナプラ 無鉛ハンダ合金
TWI464031B (zh) * 2011-12-14 2014-12-11 Univ Yuan Ze 抑制柯肯達爾孔洞形成於銲料與銅銲墊之間的方法
JP2013163207A (ja) * 2012-02-10 2013-08-22 Nihon Superior Co Ltd Ｓｎ−Ｂｉ系はんだ合金

Also Published As

Publication number Publication date
US20210001431A1 (en) 2021-01-07
EP3715040B1 (en) 2021-08-18
PH12020551403A1 (en) 2021-05-31
WO2019171710A1 (ja) 2019-09-12
JP2019155469A (ja) 2019-09-19
SG11202008635PA (en) 2020-10-29
UA126095C2 (uk) 2022-08-10
BR112020013321B1 (pt) 2021-01-12
CA3093091A1 (en) 2019-09-12
CN111683785B (zh) 2021-07-30
KR20200091932A (ko) 2020-07-31
PL3715040T3 (pl) 2022-01-17
JP6418349B1 (ja) 2018-11-07
ES2893576T3 (es) 2022-02-09
TWI677581B (zh) 2019-11-21
MY194476A (en) 2022-11-30
CN111683785A (zh) 2020-09-18
CA3093091C (en) 2021-11-02
HUE056461T2 (hu) 2022-02-28
HRP20211729T1 (hr) 2022-02-18
EP3715040A4 (en) 2020-09-30
BR112020013321A2 (pt) 2020-08-18
TW201938809A (zh) 2019-10-01
KR102194027B1 (ko) 2020-12-22
PT3715040T (pt) 2021-09-08
EP3715040A1 (en) 2020-09-30

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