MX2020006919A - Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura. - Google Patents
Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura.Info
- Publication number
- MX2020006919A MX2020006919A MX2020006919A MX2020006919A MX2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A MX 2020006919 A MX2020006919 A MX 2020006919A
- Authority
- MX
- Mexico
- Prior art keywords
- solder
- alloy
- paste
- joint
- ball
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Se describe: una aleación de soldadura que tiene un bajo punto de fusión y por consiguiente, no sufre la presencia de fusión, tiene excelentes propiedades mecánicas y resistencia al impacto y también tiene excelente resistencia al ciclo térmico; una pasta de soldadura; una bola de soldadura; una soldadura con núcleo de resina y una junta de soldadura. La aleación de soldadura tiene una composición de aleación que comprende, en % en masa, 35 a 68% de Bi, 0.5% a 3.0% de In, 0.01 a 0.10% de Pd, el resto consiste en Sn, por el propósito de afinar la textura de aleación de la misma. La composición de aleación puede contener, en % en masa, 1.0 a 2.0% de In, también puede contener, en % en masa, 0.01 a 0.03% de Pd y también puede contener por lo menos uno de Co, Ti, Al y Mn en la cantidad total de, en % en masa, 0.1% o menos. La aleación de soldadura se puede usar apropiadamente en una pasta de soldadura, una bola de soldadura, una soldadura con núcleo de resina y una junta de soldadura.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018042040 | 2018-03-08 | ||
JP2018138511A JP6418349B1 (ja) | 2018-03-08 | 2018-07-24 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
PCT/JP2018/047180 WO2019171710A1 (ja) | 2018-03-08 | 2018-12-21 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2020006919A true MX2020006919A (es) | 2021-09-14 |
Family
ID=64098779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2020006919A MX2020006919A (es) | 2018-03-08 | 2018-12-21 | Aleación de soldadura, pasta de soldadura, bola de soldadura, soldadura con núcleo de fundente de resina y junta de soldadura. |
Country Status (19)
Country | Link |
---|---|
US (1) | US20210001431A1 (es) |
EP (1) | EP3715040B1 (es) |
JP (1) | JP6418349B1 (es) |
KR (1) | KR102194027B1 (es) |
CN (1) | CN111683785B (es) |
BR (1) | BR112020013321B1 (es) |
CA (1) | CA3093091C (es) |
ES (1) | ES2893576T3 (es) |
HR (1) | HRP20211729T1 (es) |
HU (1) | HUE056461T2 (es) |
MX (1) | MX2020006919A (es) |
MY (1) | MY194476A (es) |
PH (1) | PH12020551403A1 (es) |
PL (1) | PL3715040T3 (es) |
PT (1) | PT3715040T (es) |
SG (1) | SG11202008635PA (es) |
TW (1) | TWI677581B (es) |
UA (1) | UA126095C2 (es) |
WO (1) | WO2019171710A1 (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018134673A1 (ja) * | 2017-01-20 | 2018-07-26 | レノボ・シンガポール・プライベート・リミテッド | はんだ接合方法、およびはんだ継手 |
JP6795778B1 (ja) * | 2020-03-30 | 2020-12-02 | 千住金属工業株式会社 | フラックス、フラックスを用いたやに入りはんだ、フラックスを用いたフラックスコートはんだ、およびはんだ付け方法 |
KR20220012743A (ko) | 2020-07-23 | 2022-02-04 | 현대모비스 주식회사 | 모터용 버스바 유닛 |
CN112620649B (zh) * | 2020-11-30 | 2022-04-12 | 华中科技大学 | 一种铝合金材料及基于该材料的激光3d打印铝合金构件 |
CN113798722B (zh) * | 2021-09-30 | 2022-09-27 | 大连理工大学 | 一种复合焊膏及应用其制备组织为细晶β-Sn晶粒的BGA焊锡球/焊点的方法 |
KR20230050125A (ko) | 2021-10-07 | 2023-04-14 | 엠케이전자 주식회사 | 무연 솔더 합금 및 이를 이용한 전자 장치 제조 방법 |
WO2024042663A1 (ja) * | 2022-08-24 | 2024-02-29 | 株式会社タムラ製作所 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5810451B2 (ja) * | 1975-03-20 | 1983-02-25 | 株式会社東芝 | Bi−sn−in ケイゴウキン |
US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
JP3224185B2 (ja) * | 1994-09-29 | 2001-10-29 | 富士通株式会社 | はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置 |
DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
US5755896A (en) * | 1996-11-26 | 1998-05-26 | Ford Motor Company | Low temperature lead-free solder compositions |
US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
JP4230194B2 (ja) * | 2002-10-30 | 2009-02-25 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用線材 |
CN101051535B (zh) * | 2006-04-06 | 2012-09-19 | 日立电线株式会社 | 配线用导体及其制造方法、终端连接部、无铅焊锡合金 |
JP4789198B2 (ja) * | 2006-06-07 | 2011-10-12 | 有限会社ナプラ | 無鉛ハンダ合金 |
TWI464031B (zh) * | 2011-12-14 | 2014-12-11 | Univ Yuan Ze | 抑制柯肯達爾孔洞形成於銲料與銅銲墊之間的方法 |
JP2013163207A (ja) * | 2012-02-10 | 2013-08-22 | Nihon Superior Co Ltd | Sn−Bi系はんだ合金 |
-
2018
- 2018-07-24 JP JP2018138511A patent/JP6418349B1/ja active Active
- 2018-12-21 KR KR1020207020922A patent/KR102194027B1/ko active IP Right Grant
- 2018-12-21 BR BR112020013321-3A patent/BR112020013321B1/pt active IP Right Grant
- 2018-12-21 PL PL18908704T patent/PL3715040T3/pl unknown
- 2018-12-21 CN CN201880088604.2A patent/CN111683785B/zh active Active
- 2018-12-21 HR HRP20211729TT patent/HRP20211729T1/hr unknown
- 2018-12-21 WO PCT/JP2018/047180 patent/WO2019171710A1/ja unknown
- 2018-12-21 US US16/967,717 patent/US20210001431A1/en active Pending
- 2018-12-21 UA UAA202004873A patent/UA126095C2/uk unknown
- 2018-12-21 ES ES18908704T patent/ES2893576T3/es active Active
- 2018-12-21 EP EP18908704.2A patent/EP3715040B1/en active Active
- 2018-12-21 HU HUE18908704A patent/HUE056461T2/hu unknown
- 2018-12-21 CA CA3093091A patent/CA3093091C/en active Active
- 2018-12-21 PT PT189087042T patent/PT3715040T/pt unknown
- 2018-12-21 MY MYPI2020003278A patent/MY194476A/en unknown
- 2018-12-21 MX MX2020006919A patent/MX2020006919A/es unknown
- 2018-12-21 SG SG11202008635PA patent/SG11202008635PA/en unknown
-
2019
- 2019-01-04 TW TW108100308A patent/TWI677581B/zh active
-
2020
- 2020-09-08 PH PH12020551403A patent/PH12020551403A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20210001431A1 (en) | 2021-01-07 |
EP3715040B1 (en) | 2021-08-18 |
PH12020551403A1 (en) | 2021-05-31 |
WO2019171710A1 (ja) | 2019-09-12 |
JP2019155469A (ja) | 2019-09-19 |
SG11202008635PA (en) | 2020-10-29 |
UA126095C2 (uk) | 2022-08-10 |
BR112020013321B1 (pt) | 2021-01-12 |
CA3093091A1 (en) | 2019-09-12 |
CN111683785B (zh) | 2021-07-30 |
KR20200091932A (ko) | 2020-07-31 |
PL3715040T3 (pl) | 2022-01-17 |
JP6418349B1 (ja) | 2018-11-07 |
ES2893576T3 (es) | 2022-02-09 |
TWI677581B (zh) | 2019-11-21 |
MY194476A (en) | 2022-11-30 |
CN111683785A (zh) | 2020-09-18 |
CA3093091C (en) | 2021-11-02 |
HUE056461T2 (hu) | 2022-02-28 |
HRP20211729T1 (hr) | 2022-02-18 |
EP3715040A4 (en) | 2020-09-30 |
BR112020013321A2 (pt) | 2020-08-18 |
TW201938809A (zh) | 2019-10-01 |
KR102194027B1 (ko) | 2020-12-22 |
PT3715040T (pt) | 2021-09-08 |
EP3715040A1 (en) | 2020-09-30 |
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