MX2019011149A - Aparato de impresion. - Google Patents

Aparato de impresion.

Info

Publication number
MX2019011149A
MX2019011149A MX2019011149A MX2019011149A MX2019011149A MX 2019011149 A MX2019011149 A MX 2019011149A MX 2019011149 A MX2019011149 A MX 2019011149A MX 2019011149 A MX2019011149 A MX 2019011149A MX 2019011149 A MX2019011149 A MX 2019011149A
Authority
MX
Mexico
Prior art keywords
printing
conveyor track
transport
substrates
pendulum
Prior art date
Application number
MX2019011149A
Other languages
English (en)
Inventor
Reinisch Hubert
Original Assignee
Ekra Automatisierungssysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Automatisierungssysteme Gmbh filed Critical Ekra Automatisierungssysteme Gmbh
Publication of MX2019011149A publication Critical patent/MX2019011149A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Screen Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)

Abstract

La invención se refiere a un aparato de impresión (1) para imprimir sustratos (20), en particular celdas solares, obleas, placas de circuito impreso o lo similar, con al menos un dispositivo de impresión (2, 3) que tiene asignada al menos una mesa de impresión móvil (8_1, 8_2, 9_1, 9_2), con una vía de transporte (4) a lo largo de la cual se pueden mover los sustratos (20), y con un mecanismo de transporte para transportar los sustratos de la vía de transporte (4) a él al menos un dispositivo de impresión (2, 3) y de regreso. Se prevé que el mecanismo de transporte comprenda, basculante o giratorio alrededor de un eje de oscilación (10, 11), al menos un péndulo de transporte (8, 9), el cual en al menos un extremo distante del eje de oscilación comprende la mesa de impresión (8_1, 8_2, 9_1, 9_2), siendo que mediante el péndulo de transporte (8, 9) la mesa de impresión (8_1, 8_2, 9_1, 9_2) puede oscilar a una primera posición asignada al dispositivo de impresión (2, 3) para un proceso de impresión y a una segunda posición que se encuentra en la vía de transporte (4), siendo que la respectiva mesa de impresión (8_1, 8_2, 9_1, 9_2) comprende un dispositivo de traslación (13) que en la segunda posición de la mesa de impresión (8_1, 8_2, 9_1, 9_2) es parte de la vía de transporte (4).
MX2019011149A 2017-03-20 2018-03-20 Aparato de impresion. MX2019011149A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017204630.9A DE102017204630A1 (de) 2017-03-20 2017-03-20 Druckvorrichtung
PCT/EP2018/056930 WO2018172305A1 (de) 2017-03-20 2018-03-20 Druckvorrichtung

Publications (1)

Publication Number Publication Date
MX2019011149A true MX2019011149A (es) 2019-10-22

Family

ID=61750121

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019011149A MX2019011149A (es) 2017-03-20 2018-03-20 Aparato de impresion.

Country Status (10)

Country Link
US (1) US11376838B2 (es)
EP (1) EP3600894B1 (es)
KR (1) KR20190124776A (es)
CN (1) CN110678333A (es)
DE (1) DE102017204630A1 (es)
MX (1) MX2019011149A (es)
RU (1) RU2019133155A (es)
SG (1) SG11201908742RA (es)
TW (1) TW201835986A (es)
WO (1) WO2018172305A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114801450B (zh) * 2022-06-07 2024-01-19 山东朱氏印务有限公司 一种具有提高印刷质量的盒体包装印刷用流水线传输固定装置
CN115923333B (zh) * 2023-02-20 2023-05-09 遂宁睿杰兴科技有限公司 一种印制电路板丝印烘干装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6595136B2 (en) * 2001-01-10 2003-07-22 International Business Machines Corporation Method for displacing an article during screening
ITUD20070156A1 (it) 2007-09-04 2009-03-05 Baccini S P A Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento
US8215473B2 (en) 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
NL2001673C2 (nl) * 2008-06-11 2009-12-14 Otb Solar Bv Transporttafel en werkwijze voor het gebruik daarvan.
FR2932717B1 (fr) 2008-06-24 2011-03-25 Dubuit Mach Machine a imprimer.
IT1392993B1 (it) 2009-02-23 2012-04-02 Applied Materials Inc Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
CN101961947B (zh) 2010-10-12 2012-12-05 东莞市科隆威自动化设备有限公司 光伏太阳能硅片印刷机
JP5553803B2 (ja) 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
DE102012205252A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
DE102012205249A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
CN204547300U (zh) * 2015-03-31 2015-08-12 仓和股份有限公司 多次印刷***
CN205631665U (zh) * 2016-04-11 2016-10-12 盐城市美豪印务有限公司 一种小型丝印机印刷的高效运料装置

Also Published As

Publication number Publication date
WO2018172305A1 (de) 2018-09-27
EP3600894A1 (de) 2020-02-05
SG11201908742RA (en) 2019-10-30
RU2019133155A (ru) 2021-04-21
KR20190124776A (ko) 2019-11-05
TW201835986A (zh) 2018-10-01
DE102017204630A1 (de) 2018-09-20
EP3600894B1 (de) 2021-05-12
CN110678333A (zh) 2020-01-10
US20200016886A1 (en) 2020-01-16
US11376838B2 (en) 2022-07-05

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