MX2018001865A - Uso de una composicion de eteres de bis-anhidrohexitol de baja viscosidad como un diluyente reactivo para composiciones reticulables de resinas, adhesivos, recubrimientos y matrices para materiales compuestos. - Google Patents

Uso de una composicion de eteres de bis-anhidrohexitol de baja viscosidad como un diluyente reactivo para composiciones reticulables de resinas, adhesivos, recubrimientos y matrices para materiales compuestos.

Info

Publication number
MX2018001865A
MX2018001865A MX2018001865A MX2018001865A MX2018001865A MX 2018001865 A MX2018001865 A MX 2018001865A MX 2018001865 A MX2018001865 A MX 2018001865A MX 2018001865 A MX2018001865 A MX 2018001865A MX 2018001865 A MX2018001865 A MX 2018001865A
Authority
MX
Mexico
Prior art keywords
composites
adhesive
coating
crosslinkable resin
composition
Prior art date
Application number
MX2018001865A
Other languages
English (en)
Inventor
Buffe Clothilde
Pierre Pascault Jean-
Roi Meizoso Loureiro
PRENDES GONZALES Pilar
Paz Abuin Senén
Original Assignee
Roquette Freres
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roquette Freres filed Critical Roquette Freres
Publication of MX2018001865A publication Critical patent/MX2018001865A/es

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/145—Compounds containing one epoxy group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

La presente invención se refiere al uso de éteres de bis-anhidrohexitol como diluyentes reactivos en una composición reticulable de resina, adhesivo, recubrimiento o matriz para materiales compuestos. Estos productos no solo posibilitan la reducción de manera conveniente de la viscosidad de las mezclas obtenidas, sino que también conllevan una reducción muy pequeña en la temperatura de transición vítrea de las mezclas reticuladas, en comparación con otros diluyentes reactivos, a la vez que mejoran de manera espectacular las propiedades mecánicas de las últimas tales como el módulo de Young, la resistencia a la tracción, la elongación a la rotura y la tenacidad.
MX2018001865A 2015-08-13 2016-08-08 Uso de una composicion de eteres de bis-anhidrohexitol de baja viscosidad como un diluyente reactivo para composiciones reticulables de resinas, adhesivos, recubrimientos y matrices para materiales compuestos. MX2018001865A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1557712A FR3040059B1 (fr) 2015-08-13 2015-08-13 Utilisation d'une composition d'ethers de bis-anhydrohexitol de faible viscosite comme diluant reactif pour compositions reticulables de resines, d'adhesifs, de revetements et de matrices pour composi
PCT/FR2016/052052 WO2017025687A1 (fr) 2015-08-13 2016-08-08 Utilisation d'une composition d'ethers de bis-anhydrohexitol de faible viscosite comme diluant reactif pour compositions reticulables de resines, d'adhesifs, de revetements et de matrices pour composites

Publications (1)

Publication Number Publication Date
MX2018001865A true MX2018001865A (es) 2018-11-09

Family

ID=54207584

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018001865A MX2018001865A (es) 2015-08-13 2016-08-08 Uso de una composicion de eteres de bis-anhidrohexitol de baja viscosidad como un diluyente reactivo para composiciones reticulables de resinas, adhesivos, recubrimientos y matrices para materiales compuestos.

Country Status (10)

Country Link
US (1) US10913817B2 (es)
EP (1) EP3334792B1 (es)
JP (1) JP2018522997A (es)
KR (1) KR102628808B1 (es)
CN (1) CN107922780B (es)
CA (1) CA2995162C (es)
ES (1) ES2861552T3 (es)
FR (1) FR3040059B1 (es)
MX (1) MX2018001865A (es)
WO (1) WO2017025687A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111491976B (zh) * 2017-12-21 2023-03-24 艾伦塔斯欧洲有限公司 异山梨醇的新用途
FR3102986B1 (fr) * 2019-11-08 2022-07-08 Roquette Freres Composition de résine d’époxyde comprenant un époxyde d’isosorbide et son utilisation pour stabiliser un matériau fibreux ou poreux
FR3102987B1 (fr) * 2019-11-08 2022-06-03 Roquette Freres Résine époxy comprenant un époxyde d’isosorbide
WO2024044505A1 (en) * 2022-08-22 2024-02-29 Zymergen Inc. Adhesive composition

Family Cites Families (22)

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US3041300A (en) 1959-10-06 1962-06-26 Martin Marietta Corp Polyglycidyl ethers of ether anhydro hexitols, method of production, and aqueous solutions thereof
BE614238A (es) * 1961-05-31
US3272845A (en) 1963-03-21 1966-09-13 Atlas Chem Ind Bisglycidyl ethers of isohexides
FR1445942A (fr) * 1964-09-01 1966-07-15 Dynamit Nobel Ag Procédé pour la stabilisation des éthers diglycidiques du 2, 2-bis-(4-oxyphényl)-propane
US4770871A (en) 1987-11-06 1988-09-13 Ici Americas Inc. Process for the preparation of dianhydrosorbitol ethers
JPH01307935A (ja) * 1988-06-07 1989-12-12 Seiko Epson Corp 光円盤
JP4535214B2 (ja) 1999-10-08 2010-09-01 新日鐵化学株式会社 難燃性液状エポキシ樹脂組成物
US20080021209A1 (en) 2006-06-01 2008-01-24 New Jersey Institute Of Technology Ethers of bisanhydrohexitols
WO2008147473A1 (en) * 2007-05-31 2008-12-04 New Jersey Institute Of Technology Thermoset epoxy polymers from renewable resources
JP2011213716A (ja) * 2010-03-15 2011-10-27 Mitsubishi Chemicals Corp ポリアリルオキシ化合物の製造方法及びポリグリシジルオキシ化合物の製造方法
CN107759771A (zh) * 2010-09-30 2018-03-06 索尔维公司 天然来源的环氧氯丙烷的衍生物
KR101272840B1 (ko) * 2011-05-19 2013-06-10 한국생산기술연구원 광경화성 디안히드로헥산헥솔 유도체, 이의 제조방법 및 이를 포함하는 광경화성 조성물
JP2013054531A (ja) 2011-09-02 2013-03-21 Nomura Research Institute Ltd インシデント管理システム
US9932438B2 (en) 2011-12-16 2018-04-03 3M Innovative Properties Company Oxirane-containing bisanhydrohexitol derivatives and uses thereof
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DE102012202161A1 (de) * 2012-02-14 2013-08-14 Elantas Gmbh Elektroisolierharz auf Basis von Isohexiddioldiglycidethern
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JP6571318B2 (ja) * 2014-07-10 2019-09-04 サムスン エスディアイ カンパニー，リミテッドＳａｍｓｕｎｇ Ｓｄｉ Ｃｏ．，Ｌｔｄ． 偏光板用接着剤およびこれを用いた表示装置
KR101660237B1 (ko) * 2014-07-18 2016-09-27 국도화학 주식회사 고기능성 천연원료 유래 에폭시 수지 및 그의 제조방법과 이를 이용한 에폭시수지 경화 조성물.

Also Published As

Publication number Publication date
US20200123308A1 (en) 2020-04-23
EP3334792A1 (fr) 2018-06-20
WO2017025687A1 (fr) 2017-02-16
KR102628808B1 (ko) 2024-01-25
CN107922780A (zh) 2018-04-17
ES2861552T3 (es) 2021-10-06
EP3334792B1 (fr) 2020-12-16
CA2995162C (fr) 2023-12-12
CA2995162A1 (fr) 2017-02-16
US10913817B2 (en) 2021-02-09
KR20180041126A (ko) 2018-04-23
FR3040059A1 (fr) 2017-02-17
FR3040059B1 (fr) 2019-05-17
CN107922780B (zh) 2020-08-14
JP2018522997A (ja) 2018-08-16

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