MX2011004111A - Marker for marking or coding an object and method for producing such a marker and use. - Google Patents
Marker for marking or coding an object and method for producing such a marker and use.Info
- Publication number
- MX2011004111A MX2011004111A MX2011004111A MX2011004111A MX2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A MX 2011004111 A MX2011004111 A MX 2011004111A
- Authority
- MX
- Mexico
- Prior art keywords
- marker
- elements
- conductive
- code
- marker elements
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
On a marker for marking or coding an object, a plurality of marker elements (4, 5, 6) made of a conducting or conductive material are provided, the marker elements (4, 5, 6) can be applied onto and/or integrated into a partial region of the object made of an insulating material, the marker elements (4, 5, 6) are or can be connected at least partially to each other by a connecting element (7, 8) made of a conducting or conductive material for forming a code, and the marker elements (4, 5, 6) can be contacted at least partially by elements ascertaining a conducting state between individual marker elements (4, 5, 6) for capturing the code, wherein a plurality of mutually associated or associatable marker elements (4, 5, 6, 9, 10) are disposed or configured in different levels or layers of an insulating partial region of an object, particularly a planar object. In addition, a method for producing such a marker and also a use of such a marker in connection with a circuit board, particularly a multi-layer circuit board, are proposed.
Description
MARKER TO MARK OR CODE AN OBJECT AND METHOD TO PRODUCE THIS MARKER AND USE
The present invention relates to a marker for marking or coding an object, wherein multiple marker elements made of conductive or conductive material are provided, the marker elements can be applied to and / or integrated into a partial region of the object made of a insulating material, the marker elements are or can be connected at least partially to each other by a connecting element made of a conductive or conductive material to form a code and the marker elements can be contacted at least partially by elements that determine a driver state between the individual marker elements to capture the code. The present invention further relates to a method for producing a label to mark or code an object and also to the use of this marker or this method to produce a label.
In the context of quality control, a subsequent verification and / or identification capability in view of the tracking of an object manufactured for a batch of products or, in more detail, an individual mark of a product to be manufactured, for example when passes different process steps, are required to
a growing grade. This will usually be a great challenge in terms of marking individual objects, in particular, in the case of objects that are manufactured in comparatively large quantities and, if required, each substantially at the same time in large quantities or individual objects and, when necessary, in multiple steps of subsequent operation or production.
In the context of the production of printed circuit boards, it has thus become known, for example, from A-0 360 647, which provides additional coding or marking elements on a printed circuit board including integrated circuits, in where the connections of the coding elements with partial regions of the integrated circuit are used for coding. However, these connections with existing circuits involve disadvantages, in particular, in the sense that the reading of a marker or code depends on the circuits there coupled or connected.
Also, in connection with the production of a printed circuit board, DE-A 101 26 846 proposes the use of an additional and separate component provided with an encoding to identify an assembly that must be loaded with the component. This additional component, in particular, involves the disadvantage of requiring steps of
additional method to integrate this component into assemblies that usually have therefore small dimensions.
A marker of the initially defined type can, for example, be taken from US-A 2008/0149732, where it is directed to batch track an object and, in particular, a printed circuit board.
In addition, several methods are known for labeling or marking objects, wherein the objects to be marked or labeled are, for example, provided with separate label materials in which they will subsequently be written. The problem with these labels is that the maintenance or retention of these markings will not be reliably guaranteed, in particular, when production steps are carried out using high temperatures and pressures and / or solvents, if necessary.
Although the present disclosure is at least partially provided with reference to the production of printed circuits and the marking or coding thereof serves to exemplify an object to be marked or coded, it should be noted that a marker or code according to the invention can be provided. also in objects other than a circuit board. In principle, it should be provided that, regardless of the production or use of the object to be marked, any
object to which the following marker proposed by the invention can be applied or placed and / or to which the method according to the invention is applicable, can be marked or encoded by the marker according to the invention and by the method according to the invention, respectively.
The present invention aims to provide an easily producible and reliable marker for marking or coding an object and the respective method for producing a marker, wherein a substantially indestructible or easily detectable or readable marker of an object should be provided in a simple manner.
To solve these objectives, a marker for marking or coding an object is essentially characterized in that multiple mutually associated or associable marker elements are arranged or configured in different levels or layers of a partial insulating region of an object, particularly a planar object.
Since it is proposed to apply or integrate multiple marker elements of a conductive or conductive material to or on the object and, in particular, its partial insulating region, a marker can be produced in a simple manner, where multiple methods are known to be provided. , or apply to an object, elements of
Conductive or conductive marker. In addition, it is proposed to define or provide a code for, for example, a verification or quality control, partially connecting the marker elements, where, just as with the formation of the marker elements of a conductive or conductive material, also the Connecting elements between at least the individual marker elements can be produced and placed on or attached to an object, in a simple and reliable manner. In addition, simple reading or capture of the code is provided by the option of a simple contact or contact capability of the individual marker elements, wherein these elements that determine a conductive state between the individual marker elements in the same way are known in a great variety. These elements or sensors can therefore be provided in a simple manner or, for example, simply adapted to the contours of the object to be verified, or the placement or configuration of the marker or code to be determined. A code can be defined in a simple manner by creating a conductive or non-conductive connection between the marker elements and can be easily read, for example during verification or quality control, so that a single object can be defined and unambiguously identified during production of numerous
objects, each in multiple steps of operation and production.
In addition to verification or quality control of a finished object after completion, or optionally during or after use, of the object to be verified by a marker which is substantially provided on an object surface that is accessible from the outside, or that is accessible from the outside by means of an external surface of the object, the embodiment proposed by the invention in the sense that multiple mutually associated or associable marker elements are placed or configured in different levels or layers of a partial insulating region of an object, particularly a planar object, has made it possible to verify an object produced, in particular, in several layers and / or several method steps. Thus, it is feasible, in a multi-layered configuration of an object to be marked, to provide or form a marker or its partial region, each at the completion or production of a layer and to attach or connect therein the conveniently formed markers therein. the preceding production steps in layers below it. Connecting respectively marker elements placed in different levels or layers as proposed by the invention and providing again elements of
Conductive or conductive connection, further conclusions can be drawn as to a multi-stage production method, if desired, of a particularly accessible marker from an external surface.
To provide a particularly easily and easily evaluable code of the marker according to the invention, it is proposed according to a preferred embodiment that the code be readable as a binary code. By providing or forming this binary code, a simple evaluation will be achieved with the elements that determine a conductive state between the individual marker elements. In the simplest configuration, for example, in this way it is possible to define and evaluate a conductive or short-circuited state between two marker elements such as "1" and a non-conductive or open state between the individual marker elements such as "0". Depending on the number of individual elements of a code, in particular binary, which is required for unambiguous and appropriate allocation, it is also possible to determine in a simple manner the number of marker elements required to provide a clear differentiability of the individual objects that will be marked. In addition, the simple determination of a binary code can be guaranteed with a simple means of evaluation consisting of elements
or sensors that determine a conductive or non-conductive state between the individual marker elements.
In order to achieve adequate reliability and also to do so with elements which consequently have small dimensions in the marking according to the invention, it is proposed according to a further preferred embodiment that the marker elements and the connecting elements are each made of a metallic material, for example copper, aluminum and the like. These materials are applied in multiple methods to produce objects, this being, for example, especially true in relation to the production of circuit boards.
For the appropriate and simple application or formation of the marker according to the invention, it is proposed according to a further preferred embodiment that marker elements and connection elements can be produced by a modeling process known per se, particularly a process of photomodelling. These modeling processes are also known in a variety of method applications. When a circuit board is produced, these modeling processes are applied, for example, partially several times in such a way that, when applying or forming the marker according to the invention on a circuit board, these
Processes or steps to produce a marker can be directly integrated into a method to produce a circuit board. Apart from the aforementioned prior art, in this way it is not necessary to provide and integrate in a circuit board, for example, separate or additional components for marking. Also, apart from the prior art cited at the beginning, it is not required to provide a coupling or connection to circuit regions of a circuit board and therefore to influence an existing circuit, in order to evaluate a marker according to the invention, because the marker according to the invention can be contacted by an element that determines a conductive and non-conductive state to capture the code. The marker proposed by the invention can also be integrated in a circuit board in a completely independent manner from, for example, a circuit or circuit element integrated in the circuit board and the code contained in the marker, which is defined by elements Conductive connection between the individual marker elements can be captured or read in a completely independent manner from an existing circuit and independent of other circuit elements of the circuit board. The test methods or test elements that verify or
determine conductive states between the individual elements of a circuit board also expand, particularly in the context of the production of a circuit board and thus will also allow a simple verification, for example during a production process, particularly during the production of a circuit board, capturing a marker code according to the invention.
In this context, it is proposed according to a further preferred embodiment that at least one connecting element be formed to connect marker elements placed at different levels or layers by placing a conductive or conductive material in passages or through holes provided between the marker elements. The configuration of conductive or conductive regions, or the placement of conductive or conductive materials, between conductive elements placed at different levels or layers and marker elements in the current case, is also known, for example, in the context of the production of multilayer circuit boards in such a way that no additional method step has to be performed or incorporated to form a marker on a circuit board, the method steps being known to produce a circuit board applicable also to form a marker for
according to the invention.
As already mentioned above, it should be provided that, in particular to verify a finished object, optionally after its use, the marker according to the invention must and must be accessible on a surface that is accessible from the outside. To further simplify the detection or evaluation of a marker code according to the invention, it is further proposed in this context to provide a reference element located on an external surface of the object to be marked, which, similarly to the marker elements, is made of a conductive or conductive material and is connected with at least one additional marker element, wherein the elements determining the conductive state can each have contact with the reference element and an additional marker element for capture the code, as in association with a further preferred embodiment of the marker according to the invention. By providing a reference element, the evaluation or detection of the marker according to the invention, in particular, will be simplified in the sense that, in order to capture the code integrated in the marker, an element that determines a conductive state has contact with the respective reference element, while a
additional element that determines a conductive state has contact with another marker element other than the reference element, so that the marker is captured, or the code integrated in the marker according to the invention, is detected by a conductive or non-conductive state between the fixed or defined reference element and at least one additional element of multiple marker elements.
To further simplify, in particular, the detection and formation of the marker according to the invention, it is proposed according to a further preferred embodiment that the marker elements are placed in a regular pattern, particularly in a manner similar to an assembly or a matrix. These regular patterns take into account the simple assignment of individual elements of the marker and make it possible to fix or define a code by simplifying the formation of conductive connection elements between the individual marker elements. In addition, placement in a regular or standardized pattern will facilitate automatic evaluation.
As previously noted several times, the marker of the invention according to a further preferred embodiment can be easily used since the marker can be integrated into a circuit board of
multiple layers. For this purpose, the marker elements and connection elements proposed for the formation of the marker according to the invention can be configured in a simple manner by means of steps or usual production methods for the production of a circuit board in such a way that, in particular, no additional method step is required for the formation of the marker according to the invention in the context of the production, in particular, of a multilayer circuit board.
To solve the initially mentioned objects, a method for producing a marker for marking or coding an object is essentially characterized by the steps of
Provide an object that will be marked, that includes at least a partial region made of an insulating material;
Form multiple marker elements made of conductive or conductive material on or within the partial region of the object made of an insulating material, in its different levels or layers;
Form connecting elements made of conductive or conductive material between at least some of the marker elements to form a code;
Capture the code having contacting with at least
some of the marker elements by means of the elements that determine a conductive state between the individual marker elements.
In this way it is possible to do so with simple method steps in the production of a marker according to the invention for marking or coding an object, wherein, particularly when the method according to the invention is used, the method steps or processes known in the context of the production of a circuit board will suffice to produce the individual elements of the marker that will be provided, as well as to verify the conductive or nonconductive state between the individual marker elements by elements to determine this conductive state, which They are known by themselves.
For a particularly simple and reliable configuration of the marker elements and the connecting elements, it is proposed according to a further preferred embodiment that the marker elements and the connecting elements are each made of a metallic material, particularly copper, aluminum or similar.
As already mentioned before, production methods known per se can be employed when these materials are used to form the marker elements and
connecting elements, wherein it is proposed according to a further preferred embodiment that the marker elements and connecting elements are produced by a modeling process known per se, particularly a photoforming process.
To form markers, in particular, at different levels or layers, particularly when forming a marker during the production of a multilayer object to be marked, it is proposed according to a further preferred embodiment that through-holes be produced with a method of drilling, particularly laser drilling, between the marker elements placed at different levels or layers of the object and at least one connecting element is formed in a through hole between the marker elements by introducing a conductive or conductive material.
In order to simplify the evaluation or detection of the code to be defined in the marking, it is further proposed that a reference element be made of conductive or conductive material and the detection of the code be made between the reference element and at least an additional marker element as in association with a further preferred embodiment of the method according to the invention.
In order to simplify more the marker that is
will produce and to facilitate detection or reading of the code defined by the marker, it is proposed according to a further preferred embodiment that the marker elements be placed in a regular pattern, particularly in a manner similar to a set or to a matrix.
As already mentioned several times before, the marker according to the invention, as well as the method according to the invention for producing a marker can, in a particularly preferred way, be used to mark or code a circuit board, particularly a board of multilayer circuit. The use in the context of the production of a, in particular, multilayer circuit board produces advantages, in particular, in the sense that the known method steps for the production of a circuit board can also be used to directly verify the same through the formation or production of the marker, as well as to verify and capture it optionally already during the production of the circuit board and during a subsequent verification.
In the following, the invention will be explained in more detail by way of exemplary embodiments schematically illustrated in the attached drawing. Where :
Figure 1 is a schematic top view of an embodiment of a marker for marking or coding an object according to the prior art that was produced by the method according to the invention;
Figure 2 is a schematic view of a first embodiment of a marker of the invention that was produced by the method according to the invention, wherein the marker elements are placed in two different levels or layers;
Figure 3 is an illustration similar to that of the
Fig. 2, describes a schematic view of a modified embodiment of a marker according to the invention, with marker elements being placed in four levels or layers; Y
Figure 4, in an illustration similar to that of the
Fig. 3, describes an additional modified embodiment of a marker according to the invention, with marker elements that are placed or formed in four different levels or layers.
With respect to the Figures described in detail below, it is generally noted that for purposes of simplicity and clarity, only a comparatively small amount of individual marker elements is illustrated. When markers are formed on objects that are produced in extremely large quantities
large, thus requiring extended codes or codes containing several elements for the unequivocal assignment or differentiability of individual objects to be marked, therefore a greater number of marker elements will have to be provided.
Furthermore, later in the Figures only a partial region of an object to be marked, or only the marker itself, is illustrated, without describing in detail, or even without indicating, an object or the object to be marked.
In the embodiment according to Fig. 1, a partial region made of an insulating material, of an object to be coded is designated 1, with multiples, in particular, circular marker elements 2 being indicated in the insulating material. Some of these marker elements are interconnected by connecting elements 3 also made of conductive or conductive material.
When two adjacent marker elements 2 made of conductive or conductive material are explored through contact by elements determining a conductive state between individual marker elements 2, which are not illustrated in detail and, for example, are formed by sensors of current or voltage measuring devices
provided with tips, a code can be determined in binary form by determining a conductive or non-conductive state, as indicated below region 1.
In this case, an open state or state without a conductive connection between two mutually adjacent marker elements 2 is, for example, defined as "0", while a state connected or short-circuited by a connecting element 3, between two elements of adjacent marker 2 is defined as "1".
According to a placement or formation of the connecting elements 3 each between adjacent marker elements 2, the unequivocal assignment of an object that will be equipped with the marker according to Fig. 1, for example to a specific lot or a The specific production method of the produced object can thus be achieved as a function of the desired scope or degree of a code to be defined.
The formation of the marker elements 2 and the connecting elements 3 in a simple manner is made of a suitable metallic material such as copper, aluminum or the like.
A marker as illustrated in Fig. 1 can, in particular, be used to mark or identify circuit boards, wherein the formation of marker elements 2, as well as the connecting elements 3 is realized
by modeling processes known per se in the production of circuit boards, for example a photoforming process. In this way, when the marker is formed, it is avoided that additional process steps have to be included in the context of the production of an object to be marked.
In a similar manner, it is known, for example, in the context of the production and verification of circuit boards to determine a conductive or non-conductive state between test points or individual regions to be verified, so that known elements are made themselves to determine a conductive state between the individual marker elements 2, as well as evaluation devices known per se, for the detection of the code to be defined or determined by placing individual connection elements 3 between the marker elements 2 individual
In the following Figs. 2 to 4, it should be provided that, for a simplified illustration, a partial insulating region or insulating layer that will be provided between the marker elements placed in different layers or levels has been omitted.
From the configuration according to Fig. 2, the formation or placement of multiple marker elements
4 again made of conductive or conductive material such as copper, aluminum or the like at a higher or further level is apparent, where, in addition to multiple marker elements 4 placed at the highest level, which are again designed from In a substantially circular manner, a reference element 5 also made of a conductive or conductive material is further provided at the upper left edge in the illustration according to Fig. 2.
In addition to the marker elements 4 placed on a higher layer or on an outer surface, which are not interconnected in the illustration according to Fig. 2, multiple additional marker elements 6 are placed on a level or layer below hence, which are associated spatially and locally with the superimposed marker 4 elements. The elements of label 6 placed in the lower layer are respectively were interconnected by connecting members referred to 7 wherein the elements of marker 6 produced or placed on the layer or lower level, and the connecting elements 7 are, for example, produced by a similar method used to form the marker according to Fig. 1, for example, a photo-modeling process.
After the production of the elements of
marker 4 placed on the upper or higher level, as well as the reference element 5, a conductive connection 8 is also formed between the reference element 5 and an associated marker element 6 located below it, by placing or inserting a conductive or conductive material in a through hole formed by an insulating material and separating the marker elements 4, 5 and 6, respectively, which is not illustrated in detail.
For the marker described in FIG. 2, a conductive connection 8 in the context of the production of a, in particular, multilayer circuit board, can be configured as a substantially vertical electrical connection between the marker elements 4, 5 and 6 located at different levels or layers making a laser hole and forming a suitable passage or access.
From Fig. 2, it is further apparent that the connecting elements 8 are also formed between additional marker elements 4 located in the upper layer or level, as well as locally associated marker elements 6 located below thereon.
To evaluate the code defined by the marker illustrated in Fig. 2, the embodiment according to Fig. 2 is provided to proceed in such a way that an element that determines a conductive state, which another
once it is not illustrated in detail, it has contact with the reference element 5, while the additional marker elements 4 located on the outer surface each contact alternately with other elements or sensors that determine a conductive state. Depending on whether a conductive connection 8 is or is not provided between an additional marker element 4 and the respective marker element 6 located below it in addition to the conductive connection 8 between the reference element 5 and the marker element 6 located underneath there, a binary code, in particular, 0 or 1 will again result respectively as a determined code or evaluated as a function of whether a conductive connection or connection element 8 is provided or not between the marker elements 4 and 6 respectively placed in different levels and layers.
Instead of referring to a conductive connection 8 between the reference element 5 and a marker element 4 in the same way placed at the upper level, in particular to evaluate or simply capture the code, an evaluation can be made between the marker elements 4 adjacent individual ones located at the highest level as in the embodiment according to Fig. 1, so that the detection of a code
depend on whether both marker elements 4 placed in the upper layer are coupled or not coupled by the connecting elements 8 to the marker elements 6 located below therein in the embodiment illustrated in Fig. 2.
Accordingly, a further modification of the code can also be chosen by a selected positioning of the connection elements 7 between the marker elements 6 located at the lower level. When marker elements 4, 5, 6 are formed or placed in at least two different levels or layers, a first verification of the marker can already be performed, if required, at the lower level or layer, while an additional or final verification it may be complemented or terminated in a further or higher layer by additional formation of marker elements 4, 5 and connection elements 8 of a marker.
Figs. 3 and 4 describe modified embodiments of a placement or configuration of marker elements in a larger number of levels or layers than in Fig. 2, wherein, as in association with the reference numbers of Fig. 2, the elements Markers placed in the farthest or highest layer again are referred to as 4. In addition, a reference element named 5 is also provided in the embodiments according to Figs. 3 and 4, again in the most layer
high .
Also, in association with the illustration according to Fig. 2, the marker elements placed at a first or lower level or layer are again referred to as 6, while the associated connecting elements are designated 7.
The embodiments according to Figs. 3 and 4 further comprise substantially circular marker elements 9 and 10 placed in two additional layers or intermediate layers.
Similarly as in the embodiment according to Fig. 2, a contact or step is again indicated between different levels between the individual marker elements 4, 5, 6, 9, 10 placed at different levels and mutually associated in terms of space due to the placement of vertical conductor connections 8.
In the embodiments shown in Figs. 3 and 4, a step or connecting element 8 is again provided between the reference element 5 with respect to the associated marker element 6 at the lowest level or layer for evaluation, while the additional marker elements 4 placed at the highest level or layer they are connected by connection elements 8 substantially vertical in different regions and in a
different number of levels.
Since also in the embodiments according to Figs. 3 and 4, all marker elements 6 in the lowest layer or level are connected by the conductive connecting elements 7, the indicated binary codes will result when the code having contact with the respective reference element 5 is captured, as well as the individual marker elements 4 at the highest level as a function of whether a step or a connecting element 8 is provided or not between all the marker elements 4, 6, 9 and 10 at all levels.
From a comparison of the embodiments described in Figs. 3 and, it is further apparent that a step is made for the marker element 4 placed on the upper right edge of the pattern similar to a set or to a matrix in the embodiment according to Fig. 3 with respect to the associated marker element 6 located at the lowest level, so that the code that will be determined for this marker element 4 while simultaneously in contact with the reference element 5, is "1" as in association with the above definition, considering that in the illustration according to Fig. 4 no contact is made between the marker element 4 again placed in the
upper right corner with respect to the marker element 6 located in the lower layer.
In the embodiment described in Fig. 4, however the result will again be a binary code "1" in a detection or evaluation having contact with the reference element 5 and the marker element 4, despite the missing step 8 between the marker element 4 placed in the upper right corner and the marker element 6 located in the lower layer or level, since an additional connecting element 11 is, for example, produced between marker elements 10 in a superimposed layer , again by a photomodelling process. In this way, the conductive state is not established by means of the marker elements 6 located in the lower layer and the connecting elements 7 providing a complete step 8, as is the case with other marker elements 4 in accordance with the Fig. 4, but the conductive state is established or formed by a connecting element 11 which is furthermore placed in an additional method step.
Thus it is apparent from the example according to Fig. 4 that, for example, a change of a code relative to codes formed in preceding method steps, can therefore be made in different or special method steps by also placing elements
connection 11, for example, also including connection elements 11.
From the illustration according to Figs. 2 to 4, it is further apparent that the respectively desired codes or markers can, in particular, be embedded within an object to be marked and in the embodiment according to Fig. 4, even modified in additional method steps.
As already mentioned several times before, a marker as illustrated in one of the embodiments according to Figs. 1 to 4, can, for example, be integrated into a circuit board in a particularly simple manner, since the steps of method or production to form a marker can be produced by common and known method steps in the context of the production of a printed circuit board. In the context of the production of a printed circuit board, it is also known that it determines, in particular at different stages of production, a verification or testing of at least a partial region of the produced circuit board, particularly determining a conductive or non-conductive between the partial regions of a circuit board.
However, in addition to the integration of this marker, in particular, on a circuit board
In the printed form, it is also possible, independently of this, to provide virtually any object with these markers, wherein the marker elements and the connecting elements made of a conductive or conductive material can be substantially applied or integrated into a partial region made of an insulating material , of the object that will be marked in a manner corresponding to the code that will be formed or produced. By doing so, it is possible to capture and verify codes by means of simple elements or sensors known per se to determine conductive or non-conductive states between the mutually associated or associable marker elements.
In this way it will also be possible to optionally verify or subsequently track different production steps or methods in an object other than a circuit board, if the options presented in Figs. 3 and 4 to complement or modify a marker.
Claims (15)
1. A marker for marking or coding an object, wherein multiple marker elements made of conductive or conductive material are provided, the marker elements can be applied to and / or integrated into a partial region of the object made of an insulating material, the elements of Markers are or may be connected at least partially to each other by a connecting element made of a conductive or conductive material to form a code and the marker elements may be contacted at least partially by elements that determine a conductive state between the elements of individual marker to capture the code, characterized in that multiple mutually associated or associable marker elements are located or configured at different levels or layers of a partial insulating region of an object, particularly a planar object.
2. A marker according to claim 1, characterized in that the code is readable as a binary code.
3. A marker according to claim 1 or 2, characterized in that the marker elements and the connecting elements are each made of a metallic material, for example copper, aluminum and similar.
4. A marker according to claims 1, 2 or 3, characterized in that the marker elements and the connection elements can be produced by a modeling process known per se, particularly a photoforming process.
5. A marker according to any of claims 1 to 4, characterized in that at least one connection element for connecting marker elements placed in different levels or layers is formed by the placement of a conductive or conductive material in passages or holes of step provided between the marker elements.
6. A marker according to any of claims 1 to 5, characterized in that there is provided a reference element located on an external surface of the object to be marked, which, similarly to the marker elements, is made of a material conductive and conductive and connected with at least one additional marker element, wherein the elements determining the conductive state can each have contact with the reference element and an additional marker element for capturing the code.
7. A marker according to any of the claims 1 to 6, characterized in that the marker elements are placed in a regular pattern, particularly in a manner similar to an assembly or a matrix.
8. A marker according to any of claims 1 to 7, characterized in that the marker elements are integrated in several layers of a multilayer circuit board.
9. A method for producing a marker for marking or coding an object, characterized by the steps of Provide an object that will be marked, that includes at least a partial region made of an insulating material; Form multiple marker elements made of conductive or conductive material on or within the partial region of the object made of an insulating material, in its different levels or layers; Form connecting elements made of conductive or conductive material between at least some of the marker elements to form a code; Capture the code by having contact with at least some of the marker elements by means of the elements that determine a conductive state between the individual marker elements.
10. A method according to claim 9, characterized in that the marker elements and the connecting elements are made of a metallic material, for example copper, aluminum or the like.
11. A method according to claim 9 or 10, characterized in that the marker elements and the connecting elements are produced by a modeling process known per se, particularly a photoforming process.
12. A method according to any of claims 9 to 11, characterized in that the through holes are produced by a drilling method, particularly laser drilling, between the marker elements placed at different levels or layers of the object and at least one Connection element is formed in a through hole between the marker elements by introducing a conductive or conductive material.
13. A method according to any of claims 9 to 12, characterized in that a reference element is made of a conductive or conductive material and the detection of the code is made between the reference element and at least one additional marker element.
14. A method according to any of claims 9 to 13, characterized in that the Marker elements are placed in a regular pattern, particularly in a manner similar to a set or a matrix.
15. The use of a marker according to any one of claims 1 to 8 and of a method for producing a marker according to any of claims 9 to 14 for marking or coding a circuit board, particularly a multilayer circuit board. .
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0059608U AT11108U1 (en) | 2008-10-17 | 2008-10-17 | MARKING TO MARK BZW. CODING OF AN OBJECT AND METHOD FOR PRODUCING SUCH A MARK AND USE |
PCT/AT2009/000400 WO2010042965A1 (en) | 2008-10-17 | 2009-10-14 | Marker for marking or coding an object and method for producing such a marker and use |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2011004111A true MX2011004111A (en) | 2011-06-22 |
Family
ID=41381806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2011004111A MX2011004111A (en) | 2008-10-17 | 2009-10-14 | Marker for marking or coding an object and method for producing such a marker and use. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2345313A1 (en) |
CN (2) | CN201522810U (en) |
AT (1) | AT11108U1 (en) |
DE (1) | DE202009018996U1 (en) |
MX (1) | MX2011004111A (en) |
WO (1) | WO2010042965A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106652768B (en) * | 2017-01-24 | 2023-01-03 | 中信戴卡股份有限公司 | Marking part for aluminum alloy product |
CN110321749B (en) | 2018-03-28 | 2022-05-13 | 奥特斯(中国)有限公司 | Dual code traceable system for a component carrier |
CN109287066B (en) * | 2018-09-03 | 2024-08-06 | 赣州金顺科技有限公司 | Printed circuit board product coding device and method |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1174727A (en) | 1967-08-17 | 1969-12-17 | Ibm | A Method of Fabricating a Memory Device |
GB2196184A (en) | 1986-10-10 | 1988-04-20 | Crystalate Electronics | Process for production of multilayer electrical device |
FR2636175B1 (en) | 1988-09-02 | 1990-11-23 | Apr Composants | CODING DEVICE, IN PARTICULAR FOR A CARD WITH INTEGRATED CIRCUITS |
WO1996035155A1 (en) | 1995-05-04 | 1996-11-07 | Intel Corporation | Printed circuit board with selectable routing configuration |
EP0986289A3 (en) | 1998-09-09 | 2000-06-07 | Siemens Aktiengesellschaft | Layout and method of marking circuit substrates |
DE10126846A1 (en) | 2001-06-01 | 2002-12-05 | Siemens Ag | Component used in vehicle air bag and ABS control systems comprises a metal base body, and a code for characterizing the component |
US6937508B1 (en) | 2002-10-08 | 2005-08-30 | J. Mikko Hakkarainen | Non-volatile, high-density integrated circuit memory |
FR2869731B1 (en) | 2004-05-03 | 2006-07-28 | Labinal Sa | PERMUTATION BREWING USING CONFIGURABLE PRINTED CIRCUITS |
TWI246375B (en) | 2004-05-06 | 2005-12-21 | Siliconware Precision Industries Co Ltd | Circuit board with quality-identified mark and method for identifying the quality of circuit board |
TWI322645B (en) | 2006-12-20 | 2010-03-21 | Nan Ya Printed Circuit Board Corp | Lot traceable printed circuit board |
-
2008
- 2008-10-17 AT AT0059608U patent/AT11108U1/en not_active IP Right Cessation
- 2008-12-15 CN CN2008201817325U patent/CN201522810U/en not_active Expired - Lifetime
-
2009
- 2009-10-14 EP EP09748932A patent/EP2345313A1/en not_active Withdrawn
- 2009-10-14 WO PCT/AT2009/000400 patent/WO2010042965A1/en active Application Filing
- 2009-10-14 CN CN2009801408424A patent/CN102187744B/en active Active
- 2009-10-14 MX MX2011004111A patent/MX2011004111A/en active IP Right Grant
- 2009-10-14 DE DE200920018996 patent/DE202009018996U1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AT11108U1 (en) | 2010-04-15 |
EP2345313A1 (en) | 2011-07-20 |
CN201522810U (en) | 2010-07-07 |
CN102187744A (en) | 2011-09-14 |
CN102187744B (en) | 2013-10-02 |
WO2010042965A1 (en) | 2010-04-22 |
DE202009018996U1 (en) | 2015-04-01 |
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