MX2008016464A - Metodo para la manufactura de tarjetas que comprende al menos un modulo electronico, montaje producido durante este metodo y productos intermedios. - Google Patents
Metodo para la manufactura de tarjetas que comprende al menos un modulo electronico, montaje producido durante este metodo y productos intermedios.Info
- Publication number
- MX2008016464A MX2008016464A MX2008016464A MX2008016464A MX2008016464A MX 2008016464 A MX2008016464 A MX 2008016464A MX 2008016464 A MX2008016464 A MX 2008016464A MX 2008016464 A MX2008016464 A MX 2008016464A MX 2008016464 A MX2008016464 A MX 2008016464A
- Authority
- MX
- Mexico
- Prior art keywords
- cards
- electronic
- apertures
- intermediate product
- assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
El montaje (22) involucrado en la fabricación de tarjetas electrónicas comprende una placa (14) que tiene una multitud de aberturas (16) en las que se alojan respectivamente una multitud de módulos (2) electrónicos. Estos módulos electrónicos se montan sobre la placa (14) mediante medios de fijación, en particular mediante puentes de fijación dejando una hendidura (26) sobre la mayor parte de la periferia del módulo electrónico. Por ejemplo, los medios de fijación son formados por partes (18) sobresalientes en la periferia de las aberturas (16), siendo que estas partes sobresalientes tienen un menor grosor que el grosor de la placa (14) y sirven como soportes para los módulos electrónicos, en particular para un sustrato (12) de estos módulos. La fijación se efectúa, por ejemplo, mediante soldadura o unión adhesiva. La invención también se refiere a un producto intermedio formado mediante un montaje de este tipo y a un material de relleno que llena al menos la mayor parte del espacio remanente en las aberturas (16). La invención también se refiere a un método para fabricar tarjetas en el cual el montaje de acuerdo a la invención finalmente se embebe en una resina para formar tarjetas sustancialmente planas.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06012550 | 2006-06-19 | ||
EP2006009663 | 2006-10-05 | ||
PCT/EP2007/055530 WO2007147729A1 (fr) | 2006-06-19 | 2007-06-05 | Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2008016464A true MX2008016464A (es) | 2009-04-02 |
Family
ID=38358055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2008016464A MX2008016464A (es) | 2006-06-19 | 2007-06-05 | Metodo para la manufactura de tarjetas que comprende al menos un modulo electronico, montaje producido durante este metodo y productos intermedios. |
Country Status (11)
Country | Link |
---|---|
US (1) | US8528824B2 (es) |
EP (1) | EP2036008B1 (es) |
JP (1) | JP5395660B2 (es) |
AU (1) | AU2007263133B2 (es) |
CA (1) | CA2656978C (es) |
ES (1) | ES2537081T3 (es) |
HK (1) | HK1133940A1 (es) |
HU (1) | HUE026251T2 (es) |
MX (1) | MX2008016464A (es) |
SG (1) | SG172719A1 (es) |
WO (1) | WO2007147729A1 (es) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5525970B2 (ja) * | 2010-08-31 | 2014-06-18 | トッパン・フォームズ株式会社 | 情報媒体およびその製造方法 |
JP5641845B2 (ja) * | 2010-09-28 | 2014-12-17 | トッパン・フォームズ株式会社 | 情報媒体 |
JP5525980B2 (ja) * | 2010-09-28 | 2014-06-18 | トッパン・フォームズ株式会社 | 情報媒体およびその製造方法 |
JP5870564B2 (ja) * | 2011-09-07 | 2016-03-01 | 大日本印刷株式会社 | 電子部品一体シートの製造方法、カードの製造方法、電子部品一体シート、カード |
EP2644376B1 (fr) | 2012-03-26 | 2015-03-04 | Nagravision S.A. | Carte incorporant un objet de valeur visible et son procédé de fabrication |
JP5556865B2 (ja) * | 2012-08-22 | 2014-07-23 | 大日本印刷株式会社 | カード、カード製造方法 |
DE102013105575A1 (de) * | 2013-05-30 | 2014-12-04 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
US20150286921A1 (en) | 2014-04-03 | 2015-10-08 | Infineon Technologies Ag | Chip card substrate and method of forming a chip card substrate |
JP2016048491A (ja) * | 2014-08-28 | 2016-04-07 | トッパン・フォームズ株式会社 | 情報媒体 |
JP2016048492A (ja) * | 2014-08-28 | 2016-04-07 | トッパン・フォームズ株式会社 | 情報媒体 |
USD868888S1 (en) | 2016-03-03 | 2019-12-03 | Fine Swiss Metals Ag | Transaction card |
DE102016109654A1 (de) | 2016-05-25 | 2017-11-30 | Ovd Kinegram Ag | Bogen für ein Sicherheitsdokument, Verfahren zur Herstellung des Bogens und daraus hergestelltes Sicherheitsdokument |
EP3651068A1 (fr) | 2018-11-12 | 2020-05-13 | Thales Dis France SA | Procédé de réalisation d'un insert électronique pour support portable multi-composants et insert obtenu |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6123283A (ja) * | 1984-07-11 | 1986-01-31 | Toppan Printing Co Ltd | Icカ−ドの製造方法 |
FR2625000B1 (fr) | 1987-12-22 | 1991-08-16 | Sgs Thomson Microelectronics | Structure de carte a puce |
JP2560895B2 (ja) * | 1990-07-25 | 1996-12-04 | 三菱電機株式会社 | Icカードの製造方法およびicカード |
US6817532B2 (en) | 1992-02-12 | 2004-11-16 | Lenscard U.S., Llc | Wallet card with built-in light |
FR2691563B1 (fr) * | 1992-05-19 | 1996-05-31 | Francois Droz | Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte. |
FR2727542B1 (fr) * | 1994-11-25 | 1997-01-03 | Droz Francois | Carte incorporant au moins un element electronique |
JPH08230367A (ja) * | 1994-12-27 | 1996-09-10 | Mitsubishi Electric Corp | 非接触型icカードならびにその製造方法および装置 |
GB2309933B (en) | 1996-02-12 | 2000-02-23 | Plessey Telecomm | Contact card |
JPH10166771A (ja) * | 1996-12-17 | 1998-06-23 | Dainippon Printing Co Ltd | 非接触型icカードとその製造方法 |
DE19703990A1 (de) | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
US6239976B1 (en) | 1998-11-24 | 2001-05-29 | Comsense Technologies, Ltd. | Reinforced micromodule |
US7093767B2 (en) | 1999-09-07 | 2006-08-22 | American Express Travel Related Services Company, Inc. | System and method for manufacturing a punch-out RFID transaction device |
JP2002279384A (ja) * | 2001-03-19 | 2002-09-27 | Toshiba Corp | 携帯可能電子媒体及びその製造方法 |
ES2649545T3 (es) * | 2001-09-18 | 2018-01-12 | Nagravision S.A. | Procedimiento de fabricación de una etiqueta electrónica fina |
RU2004117773A (ru) | 2001-11-23 | 2005-06-10 | Награид Са (Ch) | Способ изготовления модуля, содержащего, по меньшей мере, один электронный компонент |
CA2652104C (en) | 2001-12-24 | 2012-02-14 | Digimarc Id Systems, Llc | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
EP1459239B1 (en) | 2001-12-24 | 2012-04-04 | L-1 Secure Credentialing, Inc. | Covert variable information on id documents and methods of making same |
US6851617B2 (en) | 2002-04-19 | 2005-02-08 | Avery Dennison Corporation | Laser imageable RFID label/tag |
JP4109039B2 (ja) | 2002-08-28 | 2008-06-25 | 株式会社ルネサステクノロジ | 電子タグ用インレットおよびその製造方法 |
US20040144472A1 (en) | 2003-01-24 | 2004-07-29 | G & D Cardtech, Inc. | Process for manufacturing laminated plastic products |
NL1022766C2 (nl) | 2003-02-24 | 2004-09-21 | Enschede Sdu Bv | Identiteitskaart alsmede reisdocument. |
MY148205A (en) | 2003-05-13 | 2013-03-15 | Nagraid Sa | Process for assembling an electronic component on a substrate |
CN1894803B (zh) | 2003-12-19 | 2010-12-22 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
JP4829529B2 (ja) | 2005-04-28 | 2011-12-07 | 株式会社小森コーポレーション | 印刷機 |
-
2007
- 2007-06-05 ES ES07765323.6T patent/ES2537081T3/es active Active
- 2007-06-05 WO PCT/EP2007/055530 patent/WO2007147729A1/fr active Application Filing
- 2007-06-05 SG SG2011044971A patent/SG172719A1/en unknown
- 2007-06-05 MX MX2008016464A patent/MX2008016464A/es active IP Right Grant
- 2007-06-05 EP EP07765323.6A patent/EP2036008B1/fr active Active
- 2007-06-05 CA CA2656978A patent/CA2656978C/en active Active
- 2007-06-05 AU AU2007263133A patent/AU2007263133B2/en active Active
- 2007-06-05 US US12/305,577 patent/US8528824B2/en active Active
- 2007-06-05 JP JP2009515814A patent/JP5395660B2/ja active Active
- 2007-06-05 HU HUE07765323A patent/HUE026251T2/hu unknown
-
2009
- 2009-12-29 HK HK09112266.3A patent/HK1133940A1/xx active IP Right Revival
Also Published As
Publication number | Publication date |
---|---|
AU2007263133A2 (en) | 2009-02-05 |
HK1133940A1 (en) | 2010-04-09 |
SG172719A1 (en) | 2011-07-28 |
HUE026251T2 (hu) | 2016-06-28 |
WO2007147729A1 (fr) | 2007-12-27 |
CA2656978C (en) | 2014-11-04 |
ES2537081T3 (es) | 2015-06-02 |
US8528824B2 (en) | 2013-09-10 |
JP2010508169A (ja) | 2010-03-18 |
CA2656978A1 (en) | 2007-12-27 |
JP5395660B2 (ja) | 2014-01-22 |
EP2036008A1 (fr) | 2009-03-18 |
AU2007263133A1 (en) | 2007-12-27 |
AU2007263133B2 (en) | 2012-04-05 |
EP2036008B1 (fr) | 2015-04-01 |
US20100090009A1 (en) | 2010-04-15 |
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Legal Events
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FG | Grant or registration |