MX170402B - Adhesivos de epoxi-acrilato termofraguables sensibles a la presion - Google Patents

Adhesivos de epoxi-acrilato termofraguables sensibles a la presion

Info

Publication number
MX170402B
MX170402B MX019617A MX1961790A MX170402B MX 170402 B MX170402 B MX 170402B MX 019617 A MX019617 A MX 019617A MX 1961790 A MX1961790 A MX 1961790A MX 170402 B MX170402 B MX 170402B
Authority
MX
Mexico
Prior art keywords
percent
pressure sensitive
epoxy
weight
thermofraguable
Prior art date
Application number
MX019617A
Other languages
English (en)
Inventor
Shinobu Sato
Shuichi Kitano
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of MX170402B publication Critical patent/MX170402B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

La presente invención se refiere a un adhesivo termofraguable o termoestable, sensible a la presión, caracterizado porque comprende: a) de 30 hasta 80 por ciento por peso de un jarabe de monómero fotopolimerizable que contiene un ester de ácido acrílico de un alcohol no terciario, y un monómero copolimerizable moderadamente polar, b) de 20 hasta 60 por ciento por peso de una resina de epoxi o una mezcla de resinas de epoxi que no contienen grupos fotopolimerizables, c) de 0.5 hasta 10 por ciento por peso de un endurecedor termicamente activable para la resina de epoxi, d) de 0.01 a 5 por ciento de un fotoiniciador, y e) de 0 a 5 por ciento de un agente de fotoentrelazamiento o agnete fotoreticulante.
MX019617A 1989-03-09 1990-02-22 Adhesivos de epoxi-acrilato termofraguables sensibles a la presion MX170402B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32157189A 1989-03-09 1989-03-09

Publications (1)

Publication Number Publication Date
MX170402B true MX170402B (es) 1993-08-19

Family

ID=23251147

Family Applications (1)

Application Number Title Priority Date Filing Date
MX019617A MX170402B (es) 1989-03-09 1990-02-22 Adhesivos de epoxi-acrilato termofraguables sensibles a la presion

Country Status (8)

Country Link
EP (1) EP0386909B1 (es)
JP (1) JPH0715090B2 (es)
KR (1) KR0136861B1 (es)
AU (1) AU615136B2 (es)
CA (1) CA2009566A1 (es)
DE (1) DE69024678T2 (es)
ES (1) ES2081926T3 (es)
MX (1) MX170402B (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU641580B2 (en) * 1991-02-28 1993-09-23 National Starch And Chemical Investment Holding Corporation Water vapor permeable pressure sensitive adhesive composition
DE69430453T2 (de) * 1993-11-10 2002-11-07 Minnesota Mining & Mfg Klebendes Laminat
CA2174523A1 (en) * 1993-11-10 1995-05-18 Greggory S. Bennett Pressure sensitive thermosetting adhesives
ES2146667T3 (es) * 1993-11-10 2000-08-16 Minnesota Mining & Mfg Metodo topografico.
CN1098905C (zh) * 1995-04-24 2003-01-15 美国3M公司 用于聚烯烃表面的压敏粘合剂
WO1997043352A1 (en) * 1996-05-16 1997-11-20 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
WO1997003143A1 (en) 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JP4636513B2 (ja) * 1996-05-30 2011-02-23 日東電工株式会社 熱硬化型感圧性接着剤とその接着シ―ト類
DE69727714T2 (de) 1996-07-15 2004-11-25 Sekisui Kagaku Kogyo K.K. Verfahren zum Verbinden von Teilen
EP0823312A1 (en) 1996-08-07 1998-02-11 Minnesota Mining And Manufacturing Company Hand-held device for adhering an object having a thermosettable layer, to a substrate
AU1123097A (en) * 1996-11-12 1998-06-03 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
JP3730787B2 (ja) 2000-02-14 2006-01-05 積水化学工業株式会社 光硬化性組成物、光硬化性組成物の製造方法、光硬化型粘接着シート、光硬化型粘接着シートの製造方法及び接合方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
US6908318B2 (en) 2001-08-08 2005-06-21 3M Innovative Properties Company Batch electrically connecting sheet
EP1858069A1 (en) * 2005-02-21 2007-11-21 Nitto Denko Corporation Semiconductor device manufacturing method
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
DE102006048464A1 (de) * 2006-10-11 2008-04-17 Bundesdruckerei Gmbh Haftvermittlerschicht für die Verbindung eines holographischen Datenträgers mit einem Substrat
US7787256B2 (en) * 2007-08-10 2010-08-31 Gore Enterprise Holdings, Inc. Tamper respondent system
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
KR101072371B1 (ko) * 2010-09-20 2011-10-11 주식회사 엘지화학 편광판용 접착제 및 이를 포함하는 편광판
US10472545B2 (en) * 2012-12-26 2019-11-12 Nitto Denko Corporation Sealing sheet
DE102013216782A1 (de) 2013-08-23 2015-02-26 Tesa Se Stanzling insbesondere zum dauerhaften Verschließen von Löchern
JP6331367B2 (ja) * 2013-12-05 2018-05-30 東洋インキＳｃホールディングス株式会社 樹脂組成物、活性エネルギー線重合性接着剤、及び積層体
JP6310731B2 (ja) * 2014-03-07 2018-04-11 スリーエム イノベイティブ プロパティズ カンパニー 熱硬化性感圧接着剤
ES2732488T3 (es) * 2014-10-20 2019-11-22 Sekisui Plastics Lámina de gel pegajosa que tiene aplicaciones adhesivas, método para producir la misma, método para fijar un par de objetos y material compuesto
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
EP3091059B1 (de) 2015-05-05 2020-09-09 tesa SE Klebeband mit klebemasse mit kontinuierlicher polymerphase
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1552046A (en) * 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
US4239077A (en) * 1978-12-01 1980-12-16 Westinghouse Electric Corp. Method of making heat curable adhesive coated insulation for transformers
SU892405A1 (ru) * 1979-12-19 1981-12-23 Украинский Научно-Исследовательский Институт Полиграфической Промышленности Адгезивна композици дл изготовлени металлической подложки фотополимерных печатных форм
JPS58149971A (ja) * 1982-03-01 1983-09-06 Semedain Kk 二液反応型接着剤
US4612209A (en) * 1983-12-27 1986-09-16 Ciba-Geigy Corporation Process for the preparation of heat-curable adhesive films
JPS60199025A (ja) * 1984-03-22 1985-10-08 Toshiba Corp 光硬化性樹脂組成物
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法

Also Published As

Publication number Publication date
ES2081926T3 (es) 1996-03-16
KR0136861B1 (ko) 1998-04-25
AU4989590A (en) 1990-09-13
EP0386909B1 (en) 1996-01-10
AU615136B2 (en) 1991-09-19
KR900014552A (ko) 1990-10-24
JPH02272076A (ja) 1990-11-06
EP0386909A3 (en) 1992-03-18
JPH0715090B2 (ja) 1995-02-22
CA2009566A1 (en) 1990-09-09
DE69024678D1 (de) 1996-02-22
DE69024678T2 (de) 1996-08-08
EP0386909A2 (en) 1990-09-12

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