KR900014552A - 에폭시-아크릴레이트 블랜드 압감 열경화성 접착제 - Google Patents

에폭시-아크릴레이트 블랜드 압감 열경화성 접착제 Download PDF

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Publication number
KR900014552A
KR900014552A KR1019900003181A KR900003181A KR900014552A KR 900014552 A KR900014552 A KR 900014552A KR 1019900003181 A KR1019900003181 A KR 1019900003181A KR 900003181 A KR900003181 A KR 900003181A KR 900014552 A KR900014552 A KR 900014552A
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KR
South Korea
Prior art keywords
acrylate
thermosetting adhesive
epoxy resin
parts
sensitive thermosetting
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KR1019900003181A
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English (en)
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KR0136861B1 (ko
Inventor
시노부 사토
슈이치 키타노
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR900014552A publication Critical patent/KR900014552A/ko
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Publication of KR0136861B1 publication Critical patent/KR0136861B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음

Description

에폭시-아크릴레이트 블랜드 압감 열경화성 접착제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. (a) 비3급 알콜의 아크릴산 에스테트 및 적당한 극성의 공중합성 단량체를 함유하는 30중량%내지80중량%의 광중합성 단량체 시럽, (b)광중합기를 함유하지 않는 20중량%내지 60중량%의 에폭시 수지 또는 에폭시 수지 혼합물, (c)에폭시 수지용의 0.5중량%내지10중량%의 열활성 경화제, (d)0.01%내지 5%의 광개시제, (e)0내지 5%의 광가교제로 구성되는 압감 열결화성 접착제.
  2. 제1항에 있어서, 상기 에폭시 수지가 페놀 에폭시 수지, 비스페놀 에폭시 수지 및 할로겐화 비스페놀 에폭시 수지로 구성되는 그룹으로부터 선택되는 것을 특징으로 하는 압감 열경화성 접착제.
  3. 제1항에 있어서, 상기 단량체 시럽이 a)이소옥틸 아크릴레이트, 이소노닐, 아크릴레이트, 데실아크릴레이트, 도데실 아크릴레이트, 부틸 아크릴레이트, 에틸-헥실 아크릴레이트 및 헥실 아크릴레이트로부터 구성된 50부 내지 95부의 알킬 아크릴레이트 에스테르와 b)아크릴산, N-비닐피롤리돈 히드록시에틸 아크릴레이트 및 그 혼합물로 구성되는 그룹으로부터 선택된 50부 내지5부의 모노 에틸렌성 불포화 극성 공중합성 단량체로 구성되는 것을 특징으로 하는 압감 열경화성 접착제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900003181A 1989-03-09 1990-03-08 에폭시-아크릴레이트 블랜드 압감성 열경화성 접착제 KR0136861B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32157189A 1989-03-09 1989-03-09
US321,571 1989-03-09

Publications (2)

Publication Number Publication Date
KR900014552A true KR900014552A (ko) 1990-10-24
KR0136861B1 KR0136861B1 (ko) 1998-04-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900003181A KR0136861B1 (ko) 1989-03-09 1990-03-08 에폭시-아크릴레이트 블랜드 압감성 열경화성 접착제

Country Status (8)

Country Link
EP (1) EP0386909B1 (ko)
JP (1) JPH0715090B2 (ko)
KR (1) KR0136861B1 (ko)
AU (1) AU615136B2 (ko)
CA (1) CA2009566A1 (ko)
DE (1) DE69024678T2 (ko)
ES (1) ES2081926T3 (ko)
MX (1) MX170402B (ko)

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AU641580B2 (en) * 1991-02-28 1993-09-23 National Starch And Chemical Investment Holding Corporation Water vapor permeable pressure sensitive adhesive composition
WO1995013327A1 (en) * 1993-11-10 1995-05-18 Minnesota Mining And Manufacturing Company Topographical method
CA2174523A1 (en) * 1993-11-10 1995-05-18 Greggory S. Bennett Pressure sensitive thermosetting adhesives
EP1123957B1 (en) * 1993-11-10 2007-12-19 Minnesota Mining And Manufacturing Company The use of melt-flowable materials for sealing surfaces or applying design elements
CN1098905C (zh) * 1995-04-24 2003-01-15 美国3M公司 用于聚烯烃表面的压敏粘合剂
AU6487996A (en) 1995-07-10 1997-02-10 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JP4154513B2 (ja) * 1996-05-16 2008-09-24 スリーエム カンパニー 接着剤組成物と使用方法
JP4636513B2 (ja) * 1996-05-30 2011-02-23 日東電工株式会社 熱硬化型感圧性接着剤とその接着シ―ト類
EP1249479B1 (en) * 1996-07-15 2004-02-18 Sekisui Kagaku Kogyo Kabushiki Kaisha Method for joining members
EP0823312A1 (en) 1996-08-07 1998-02-11 Minnesota Mining And Manufacturing Company Hand-held device for adhering an object having a thermosettable layer, to a substrate
EP0938526B1 (en) * 1996-11-12 2003-04-23 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
JP3730787B2 (ja) 2000-02-14 2006-01-05 積水化学工業株式会社 光硬化性組成物、光硬化性組成物の製造方法、光硬化型粘接着シート、光硬化型粘接着シートの製造方法及び接合方法
JP3542080B2 (ja) * 2001-03-30 2004-07-14 リンテック株式会社 半導体チップ担持用接着テープ・シート、半導体チップ担持体、半導体チップマウント方法および半導体チップ包装体
US6908318B2 (en) 2001-08-08 2005-06-21 3M Innovative Properties Company Batch electrically connecting sheet
EP1858069A1 (en) * 2005-02-21 2007-11-21 Nitto Denko Corporation Semiconductor device manufacturing method
US7772040B2 (en) 2006-09-12 2010-08-10 Nitto Denko Corporation Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
DE102006048464A1 (de) * 2006-10-11 2008-04-17 Bundesdruckerei Gmbh Haftvermittlerschicht für die Verbindung eines holographischen Datenträgers mit einem Substrat
US7787256B2 (en) * 2007-08-10 2010-08-31 Gore Enterprise Holdings, Inc. Tamper respondent system
US8592260B2 (en) 2009-06-26 2013-11-26 Nitto Denko Corporation Process for producing a semiconductor device
KR101072371B1 (ko) 2010-09-20 2011-10-11 주식회사 엘지화학 편광판용 접착제 및 이를 포함하는 편광판
US10472545B2 (en) 2012-12-26 2019-11-12 Nitto Denko Corporation Sealing sheet
DE102013216782A1 (de) 2013-08-23 2015-02-26 Tesa Se Stanzling insbesondere zum dauerhaften Verschließen von Löchern
JP6331367B2 (ja) * 2013-12-05 2018-05-30 東洋インキＳｃホールディングス株式会社 樹脂組成物、活性エネルギー線重合性接着剤、及び積層体
JP6310731B2 (ja) * 2014-03-07 2018-04-11 スリーエム イノベイティブ プロパティズ カンパニー 熱硬化性感圧接着剤
CN107109144A (zh) * 2014-10-20 2017-08-29 积水化成品工业株式会社 具有粘接用途的粘合性凝胶片、其制造方法、一对被粘物的固定方法及复合材料
EP3091059B1 (de) 2015-05-05 2020-09-09 tesa SE Klebeband mit klebemasse mit kontinuierlicher polymerphase
DE102015217860A1 (de) 2015-05-05 2016-11-10 Tesa Se Klebeband mit Klebemasse mit kontinuierlicher Polymerphase
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder

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Also Published As

Publication number Publication date
MX170402B (es) 1993-08-19
AU4989590A (en) 1990-09-13
JPH02272076A (ja) 1990-11-06
CA2009566A1 (en) 1990-09-09
JPH0715090B2 (ja) 1995-02-22
EP0386909A3 (en) 1992-03-18
KR0136861B1 (ko) 1998-04-25
AU615136B2 (en) 1991-09-19
EP0386909B1 (en) 1996-01-10
DE69024678T2 (de) 1996-08-08
DE69024678D1 (de) 1996-02-22
EP0386909A2 (en) 1990-09-12
ES2081926T3 (es) 1996-03-16

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