MX169037B - Procedimiento para preparar revestimientos fotocurados - Google Patents

Procedimiento para preparar revestimientos fotocurados

Info

Publication number
MX169037B
MX169037B MX015294A MX1529489A MX169037B MX 169037 B MX169037 B MX 169037B MX 015294 A MX015294 A MX 015294A MX 1529489 A MX1529489 A MX 1529489A MX 169037 B MX169037 B MX 169037B
Authority
MX
Mexico
Prior art keywords
reactive system
actinic radiation
cured coatings
procedure
composition
Prior art date
Application number
MX015294A
Other languages
English (en)
Inventor
Charles Edward Warburton Jr
Nicholas Andrew Rounds
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of MX169037B publication Critical patent/MX169037B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

La presente invención se refiere a un procedimiento para producir revestimientos fotocurados en una exposición de dos etapas, que comprende: a) depositar, como revestimiento sobre un substrato, una composición que contiene: un primer sistema reactivo, que incluye un material polimerizable radical libre y un fotoiniciador de la polimerización de radical libre y un segundo sistema reactivo, que incluye una resina epoxi catiónica, polimerizable, y un fotiniciador de polimerización catiónica; b) esponer la composición a una primera radicación actínica, en una cantidad efectiva para iniciar el nivel deseado de reacción en un sistema reactivo; y c) exponer subsiguientemente la composición a una segunde radicación actínica, diferente a la primera radicación actínica, en una cantidad efectiva para iniciar el nivel deseado de reacción en otro sistema reactivo.
MX015294A 1988-03-29 1989-03-16 Procedimiento para preparar revestimientos fotocurados MX169037B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17457988A 1988-03-29 1988-03-29

Publications (1)

Publication Number Publication Date
MX169037B true MX169037B (es) 1993-06-17

Family

ID=22636685

Family Applications (1)

Application Number Title Priority Date Filing Date
MX015294A MX169037B (es) 1988-03-29 1989-03-16 Procedimiento para preparar revestimientos fotocurados

Country Status (14)

Country Link
EP (1) EP0335629A3 (es)
JP (1) JPH029480A (es)
KR (1) KR890014180A (es)
CN (1) CN1037041A (es)
AU (1) AU607318B2 (es)
BR (1) BR8901395A (es)
DK (1) DK149489A (es)
FI (1) FI891480A (es)
IL (1) IL89775A0 (es)
MX (1) MX169037B (es)
MY (1) MY103987A (es)
NO (1) NO891226L (es)
PH (1) PH26033A (es)
ZA (1) ZA892266B (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2604438B2 (ja) * 1988-09-19 1997-04-30 旭電化工業株式会社 樹脂の光学的造形方法
JP2632961B2 (ja) * 1988-09-13 1997-07-23 旭電化工業株式会社 樹脂の光学的造形方法
AU655580B2 (en) * 1990-04-23 1995-01-05 Minnesota Mining And Manufacturing Company Energy curable cationically and free-radically polymerizable pressure-sensitive compositions
US5238744A (en) * 1990-08-16 1993-08-24 Minnesota Mining And Manufacturing Company Tough polymeric mixtures
US5102924A (en) * 1990-08-16 1992-04-07 Minnesota Mining And Manufacturing Company Polymeric mixtures and process therefor
CA2048232A1 (en) * 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
EP0487086B2 (en) * 1990-11-22 2008-08-13 Canon Kabushiki Kaisha Method of preparing volume type phase hologram member using a photosensitive recording medium
JP2849021B2 (ja) * 1993-04-12 1999-01-20 日本ペイント株式会社 体積ホログラム記録用感光性組成物
JPH0732696U (ja) * 1993-11-25 1995-06-16 防衛庁技術研究本部長 水中吸音材ユニット
IT1274039B (it) * 1994-09-02 1997-07-14 Atohaas C V Ora Atohaas Holdin Processo per la preparazione di articoli formati a base di polimeri acrilici rivestiti con un film antigraffio e antiabrasione
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
WO2001021326A1 (en) * 1999-09-22 2001-03-29 Surmodics, Inc. Water-soluble coating agents bearing initiator groups and coating process
WO2005123803A1 (ja) * 2004-06-17 2005-12-29 Three Bond Co., Ltd. 光カチオン重合性組成物及びそれを用いたオプトエレクトロニクス部品
CN100399138C (zh) * 2006-06-26 2008-07-02 友达光电股份有限公司 液晶面板及其制造方法
JP5163602B2 (ja) * 2009-07-06 2013-03-13 大日本印刷株式会社 高低パターン層形成体の製造方法
JP5726912B2 (ja) * 2010-02-13 2015-06-03 マクアリスター テクノロジーズ エルエルシー 再放射面を有する化学反応器ならびにその関連システムおよび方法
JP5607486B2 (ja) * 2010-10-08 2014-10-15 サーモディクス，インコーポレイティド 開始剤基を有する水溶性コーティング剤およびコーティング方法
CN102566285B (zh) * 2010-12-09 2014-05-28 远东新世纪股份有限公司 制造微结构的方法及该微结构
DE102011077612A1 (de) * 2011-06-16 2012-12-20 Evonik Röhm Gmbh Verfahren zur kontinuierlichen inline Herstellung von beschichteten polymeren Substraten oder Laminaten
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Ｄｃ−ｄｃコンバータ及び電力変換装置
CN108473822B (zh) * 2015-12-30 2021-11-12 3M创新有限公司 双阶段结构粘结粘合剂
US10858541B2 (en) 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN109467385B (zh) * 2018-01-15 2021-09-03 杭州创屹机电科技有限公司 一种抗菌环保3d打印陶瓷材料及其制备方法
CN109467387A (zh) * 2018-01-15 2019-03-15 杭州创屹机电科技有限公司 一种低孔隙率3d打印陶瓷制品及其制备方法
CN109485436A (zh) * 2018-01-15 2019-03-19 杭州创屹机电科技有限公司 一种3d打印陶瓷材料两步光固化成型方法
JP2019137721A (ja) * 2018-02-06 2019-08-22 スリーエム イノベイティブ プロパティズ カンパニー 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法
CN114641145A (zh) * 2020-12-16 2022-06-17 深南电路股份有限公司 一种线路板及其线路板阻焊层的制作方法
CN114721229B (zh) * 2022-03-18 2023-07-28 浙江鑫柔科技有限公司 一种新型非对称性紫外曝光方法
CN117255495A (zh) * 2022-06-09 2023-12-19 庆鼎精密电子（淮安）有限公司 降低防焊层表面离子含量的方法、背光模组及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4849320A (en) * 1986-05-10 1989-07-18 Ciba-Geigy Corporation Method of forming images
GB8715435D0 (en) * 1987-07-01 1987-08-05 Ciba Geigy Ag Forming images

Also Published As

Publication number Publication date
IL89775A0 (en) 1989-09-28
AU3174889A (en) 1989-10-05
DK149489A (da) 1989-09-30
NO891226L (no) 1989-10-02
MY103987A (en) 1993-10-30
JPH029480A (ja) 1990-01-12
AU607318B2 (en) 1991-02-28
EP0335629A2 (en) 1989-10-04
PH26033A (en) 1992-01-29
EP0335629A3 (en) 1991-10-09
FI891480A (fi) 1989-09-30
NO891226D0 (no) 1989-03-21
KR890014180A (ko) 1989-10-23
BR8901395A (pt) 1989-11-07
CN1037041A (zh) 1989-11-08
DK149489D0 (da) 1989-03-28
FI891480A0 (fi) 1989-03-28
ZA892266B (en) 1989-11-29

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