MA43370B1 - Procédé pour incorporation circuit intégré flip chip - Google Patents
Procédé pour incorporation circuit intégré flip chipInfo
- Publication number
- MA43370B1 MA43370B1 MA43370A MA43370A MA43370B1 MA 43370 B1 MA43370 B1 MA 43370B1 MA 43370 A MA43370 A MA 43370A MA 43370 A MA43370 A MA 43370A MA 43370 B1 MA43370 B1 MA 43370B1
- Authority
- MA
- Morocco
- Prior art keywords
- smart card
- vertical plane
- contact pad
- substrate
- incorporating
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 238000005538 encapsulation Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Des modes de réalisation de l'invention concernent des procédés de fabrication d'un dispositif intelligent (200), par ex. Carte à puce et configurations pour les périphériques de carte à puce avec une fiabilité et une durée de vie accrues et une finition améliorée. Dans le dispositif de carte à puce comprenant des couches de substrat stratifiées (220, 240) interposant un film flexible (230) portant un motif conducteur, au moins une puce à bascule (250) destinée à faire fonctionner le dispositif de carte à puce est intégrée à un premier substrat (220) de telle sorte que le premier substrat assure une encapsulation sur la au moins une puce retournée, dans lequel la au moins une puce retournée (250) est agencée en une position dans un premier plan vertical; et un plot de contact (260), destiné à établir une connexion électrique lorsque le dispositif de carte à puce est inséré dans un lecteur de carte à puce, est disposé en une position dans un deuxième plan vertical, le premier plan vertical ne chevauchant pas le deuxième plan vertical. . La pastille de contact (260) est projetée à travers une cavité dans un second substrat pour former un plan uniforme continu depuis une surface externe des couches de substrat stratifiées vers la pastille de contact (260).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562263105P | 2015-12-04 | 2015-12-04 | |
PCT/SG2016/050574 WO2017095329A1 (fr) | 2015-12-04 | 2016-11-22 | Procédé d'incorporation de puce retournée de circuit intégré |
EP16809206.2A EP3384434B1 (fr) | 2015-12-04 | 2016-11-22 | Procédé pour incorporation circuit intégré flip chip |
Publications (1)
Publication Number | Publication Date |
---|---|
MA43370B1 true MA43370B1 (fr) | 2019-10-31 |
Family
ID=57530791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MA43370A MA43370B1 (fr) | 2015-12-04 | 2016-11-22 | Procédé pour incorporation circuit intégré flip chip |
Country Status (19)
Country | Link |
---|---|
US (2) | US10558906B2 (fr) |
EP (1) | EP3384434B1 (fr) |
JP (1) | JP6544759B2 (fr) |
KR (1) | KR101897944B1 (fr) |
CN (1) | CN108292373B (fr) |
AU (1) | AU2016361882B2 (fr) |
BR (2) | BR122019027776B1 (fr) |
CA (1) | CA3002778C (fr) |
ES (1) | ES2747913T3 (fr) |
HU (1) | HUE045755T2 (fr) |
MA (1) | MA43370B1 (fr) |
MX (1) | MX2018005155A (fr) |
PH (1) | PH12018500683A1 (fr) |
PL (1) | PL3384434T3 (fr) |
PT (1) | PT3384434T (fr) |
RU (1) | RU2667741C1 (fr) |
UA (1) | UA118640C2 (fr) |
WO (1) | WO2017095329A1 (fr) |
ZA (1) | ZA201802189B (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3063555B1 (fr) * | 2017-03-03 | 2021-07-09 | Linxens Holding | Carte a puce et procede de fabrication d’une carte a puce |
KR102107795B1 (ko) * | 2018-11-22 | 2020-05-28 | 주식회사 엔에이블 | 플렉시블 기판을 이용한 스마트 카드 제조방법 |
DE102019202718B4 (de) | 2019-02-28 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben |
DE102019202721B4 (de) | 2019-02-28 | 2021-03-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 3d-flexfolien-package |
DE102019202716B4 (de) * | 2019-02-28 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages |
DE102019202715A1 (de) | 2019-02-28 | 2020-09-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Folienbasiertes package mit distanzausgleich |
EP4042329B1 (fr) * | 2020-08-05 | 2023-06-07 | Smartflex Technology Pte Ltd | Carte à puce à del et ses procédés de fabrication |
DE102021001579A1 (de) | 2021-03-25 | 2022-09-29 | Giesecke+Devrient Mobile Security Gmbh | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
CN117616422A (zh) * | 2021-07-16 | 2024-02-27 | 爱创达身份智能卡有限公司 | 芯片模块及其形成方法 |
US11960951B1 (en) * | 2022-09-23 | 2024-04-16 | Capital One Services, Llc | Transaction card with multiple orientations |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837153A (en) * | 1997-01-15 | 1998-11-17 | Kawan; Joseph C. | Method and system for creating and using a logotype contact module with a smart card |
US6832730B2 (en) * | 2001-07-27 | 2004-12-21 | Storcard, Inc. | Smart card with rotating storage |
DE10303740B4 (de) * | 2003-01-30 | 2006-09-14 | Infineon Technologies Flash Gmbh & Co. Kg | Sicherheitsspeicherkarte und Herstellungsverfahren |
US9430732B2 (en) * | 2014-05-08 | 2016-08-30 | Tego, Inc. | Three-dimension RFID tag with opening through structure |
US20070290048A1 (en) * | 2006-06-20 | 2007-12-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
CN102231193B (zh) * | 2011-07-06 | 2013-05-08 | 黄艳 | 一种双界面智能卡 |
US9390364B2 (en) * | 2011-08-08 | 2016-07-12 | Féinics Amatech Teoranta | Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags |
JP5482746B2 (ja) | 2011-08-25 | 2014-05-07 | 大日本印刷株式会社 | カード、カードの製造方法 |
FR2980015B1 (fr) * | 2011-09-08 | 2013-11-22 | Sansystems | Dispositif electronique a puce et procede de fabrication par bobines |
US20140042230A1 (en) * | 2012-08-09 | 2014-02-13 | Infineon Technologies Ag | Chip card module with separate antenna and chip card inlay using same |
WO2014082401A1 (fr) * | 2012-11-30 | 2014-06-05 | Xue Yuan | Carte à puce bi-interface et procédé de fabrication de celle-ci |
FR2999753B1 (fr) * | 2012-12-13 | 2015-02-13 | Oberthur Technologies | Procede de fabrication par lamination en continu de cartes a microcircuit du type a contact |
EP2784724A3 (fr) * | 2013-03-27 | 2015-04-22 | Féinics AmaTech Teoranta | Dépôt sélectif de particules magnétiques et utilisation de matériau magnétique comme support pour déposer d'autres particules |
-
2016
- 2016-11-22 MX MX2018005155A patent/MX2018005155A/es unknown
- 2016-11-22 CN CN201680070576.2A patent/CN108292373B/zh active Active
- 2016-11-22 WO PCT/SG2016/050574 patent/WO2017095329A1/fr active Application Filing
- 2016-11-22 BR BR122019027776-1A patent/BR122019027776B1/pt active IP Right Grant
- 2016-11-22 CA CA3002778A patent/CA3002778C/fr active Active
- 2016-11-22 UA UAA201803354A patent/UA118640C2/uk unknown
- 2016-11-22 US US15/767,043 patent/US10558906B2/en active Active
- 2016-11-22 MA MA43370A patent/MA43370B1/fr unknown
- 2016-11-22 PL PL16809206T patent/PL3384434T3/pl unknown
- 2016-11-22 ES ES16809206T patent/ES2747913T3/es active Active
- 2016-11-22 HU HUE16809206A patent/HUE045755T2/hu unknown
- 2016-11-22 BR BR112018011000-0A patent/BR112018011000B1/pt active IP Right Grant
- 2016-11-22 AU AU2016361882A patent/AU2016361882B2/en active Active
- 2016-11-22 JP JP2018529179A patent/JP6544759B2/ja active Active
- 2016-11-22 EP EP16809206.2A patent/EP3384434B1/fr active Active
- 2016-11-22 RU RU2018111711A patent/RU2667741C1/ru active
- 2016-11-22 KR KR1020187012554A patent/KR101897944B1/ko active IP Right Grant
- 2016-11-22 PT PT168092062T patent/PT3384434T/pt unknown
-
2018
- 2018-03-27 PH PH12018500683A patent/PH12018500683A1/en unknown
- 2018-04-04 ZA ZA2018/02189A patent/ZA201802189B/en unknown
-
2019
- 2019-12-27 US US16/728,949 patent/US10685275B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101897944B1 (ko) | 2018-09-12 |
UA118640C2 (uk) | 2019-02-11 |
PH12018500683B1 (en) | 2018-10-15 |
JP6544759B2 (ja) | 2019-07-17 |
JP2019500749A (ja) | 2019-01-10 |
PT3384434T (pt) | 2019-10-28 |
RU2667741C1 (ru) | 2018-09-24 |
US10685275B2 (en) | 2020-06-16 |
CN108292373B (zh) | 2019-07-23 |
US20180300597A1 (en) | 2018-10-18 |
US10558906B2 (en) | 2020-02-11 |
WO2017095329A1 (fr) | 2017-06-08 |
EP3384434B1 (fr) | 2019-08-21 |
HUE045755T2 (hu) | 2020-01-28 |
CA3002778C (fr) | 2018-09-18 |
BR112018011000A2 (pt) | 2018-12-04 |
ES2747913T3 (es) | 2020-03-12 |
CN108292373A (zh) | 2018-07-17 |
ZA201802189B (en) | 2019-08-28 |
BR122019027776B1 (pt) | 2020-10-20 |
AU2016361882B2 (en) | 2018-11-01 |
MX2018005155A (es) | 2018-08-15 |
CA3002778A1 (fr) | 2017-06-08 |
PH12018500683A1 (en) | 2018-10-15 |
BR112018011000B1 (pt) | 2020-10-20 |
AU2016361882A1 (en) | 2018-04-19 |
PL3384434T3 (pl) | 2020-01-31 |
KR20180069000A (ko) | 2018-06-22 |
EP3384434A1 (fr) | 2018-10-10 |
US20200134413A1 (en) | 2020-04-30 |
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