KR970077468A - Ic 착탈장치 및 그 착탈헤드 - Google Patents

Ic 착탈장치 및 그 착탈헤드 Download PDF

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Publication number
KR970077468A
KR970077468A KR1019970000386A KR19970000386A KR970077468A KR 970077468 A KR970077468 A KR 970077468A KR 1019970000386 A KR1019970000386 A KR 1019970000386A KR 19970000386 A KR19970000386 A KR 19970000386A KR 970077468 A KR970077468 A KR 970077468A
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KR
South Korea
Prior art keywords
socket
supply unit
tray
substrate
unit
Prior art date
Application number
KR1019970000386A
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English (en)
Other versions
KR100250352B1 (ko
Inventor
이사오 아라가와
요시노리 히라타
료이치 미야모토
Original Assignee
기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 기다오까 다까시, 미쓰비시 뎅끼 가부시끼가이샤 filed Critical 기다오까 다까시
Publication of KR970077468A publication Critical patent/KR970077468A/ko
Application granted granted Critical
Publication of KR100250352B1 publication Critical patent/KR100250352B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0253—Gripping heads and other end effectors servo-actuated comprising parallel grippers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)

Abstract

본 발명은 IC이 품종의 변경에 따른 착탈헤드의 교환을 필요로 하지 않고, 작업효율을 향상시키는 것을 목적으로 하는 것이다.
로봇본체24에 지지되고 IC 소켓 1A에 대해서 IC 13을 착탈하는 착탈헤드 25이 소켓프레스의 간격을 IC 소켓1A의 사이즈에 따라서 조정이 가능하도록 했다.

Description

IC 착탈장치 및 그 착탈헤드
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시의 형태1에 의한 IC 착탈장치를 나타내는 사사도.

Claims (3)

  1. IC가 적재되어 있는 트레이를 공급하는 트레이공급부와, 가동부를 눌러 변위시킴으로써 상기 IC가 착탈되는 IC 소켓을 가진 기판을 공급하는 기판공급부와, 상기 트레이공급부에 공급된 트레이와 상기 기판공급부에 공급된 기판과의 사이에서 상기 IC를 이송하기 이한 로봇본체와, 상기 IC 소켓의 사이즈에 따라서 간격의 조정이 가능하게 되어 있고, 상기 IC 소켓의 가동부를 누르는 복수의 소켓프레스를 가지고, 상기 로붓본체에 지지되어 상기 IC를 흡착유지하는 착탈헤드와, 상기 로봇본체의 동작을 제어하는 제어부를 구비하는 것을 특징으로 하는 IC 착탈장치.
  2. 제1항에서 IC 및 IC 소켓의 적어도 어느 한쪽의 정보를 제어부에 입력하는 것에 의해 소켓프레스의 간격이 자동적으로 조정되는 것을 특징으로 하는 IC 착탈장치.
  3. 로봇본체 지지되어 IC를 흡착하는 흡착부와, 이 흡착부의 외측에 설치됨과 동시에 서로의 간격을 조정할 수 있게 되어 있고, IC 소켓에서의 상기 IC의 착탈시에 상기 IC 소켓의 가동부를 누르는 한쌍의 소켓프레스를 구비하는 것을 특징으로 하는 IC 착탈장치의 착탈헤드.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970000386A 1996-05-29 1997-01-09 Ic착탈장치 KR100250352B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP135495 1996-05-29
JP13549596A JP3711301B2 (ja) 1996-05-29 1996-05-29 Ｉｃ着脱装置及びその着脱ヘッド

Publications (2)

Publication Number Publication Date
KR970077468A true KR970077468A (ko) 1997-12-12
KR100250352B1 KR100250352B1 (ko) 2000-04-01

Family

ID=15153082

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970000386A KR100250352B1 (ko) 1996-05-29 1997-01-09 Ic착탈장치

Country Status (7)

Country Link
US (1) US5822847A (ko)
JP (1) JP3711301B2 (ko)
KR (1) KR100250352B1 (ko)
CN (1) CN1085888C (ko)
DE (1) DE19711683C2 (ko)
MY (1) MY129724A (ko)
TW (1) TW312809B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998058401A1 (en) * 1997-06-16 1998-12-23 Matsushita Electric Industrial Co., Ltd. Tray storing and feeding apparatus
JP4541601B2 (ja) * 2001-07-19 2010-09-08 富士機械製造株式会社 電動チャックを用いた電気部品装着システム
US7735216B2 (en) * 2004-01-15 2010-06-15 International Business Machines Corporation Micro-electromechanical sub-assembly having an on-chip transfer mechanism
JP4516354B2 (ja) * 2004-05-17 2010-08-04 パナソニック株式会社 部品供給方法
JP5781222B2 (ja) * 2011-05-26 2015-09-16 イスメカ セミコンダクター ホールディング エス アーＩｓｍｅｃａ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｈｏｌｄｉｎｇ Ｓａ クランプ
IN2014KN03122A (ko) * 2012-09-05 2015-05-08 Kyosan Electric Mfg
CN104627663B (zh) * 2015-01-29 2017-02-22 广东金弘达自动化科技股份有限公司 一种镜头自动上料机
JP6487373B2 (ja) * 2016-05-25 2019-03-20 ファナック株式会社 ワーク固定装置
CN108650878B (zh) * 2018-08-21 2020-11-06 安徽广晟德自动化设备有限公司 一种适用于贴片机的运动控制装置和方法
KR20210017173A (ko) * 2019-08-07 2021-02-17 엘지전자 주식회사 툴체인저 및 이를 포함하는 툴 체인지 시스템

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JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
WO1985003405A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Pick-up head for handling electrical components
JPS6218088A (ja) * 1985-07-17 1987-01-27 富士通株式会社 電子部品***装置における電子部品***機構
JPS6310473A (ja) * 1986-07-01 1988-01-18 Mitsubishi Electric Corp 燃料電池発電システム
JPH0191500A (ja) * 1987-01-20 1989-04-11 Ikegami Tsushinki Co Ltd チップ部品の自動装着装置
GB2201941A (en) * 1987-03-13 1988-09-14 Philips Nv Gripping device
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
JP2646800B2 (ja) * 1990-04-16 1997-08-27 三菱電機株式会社 吸着位置決め機構
DE4338852A1 (de) * 1993-11-13 1995-05-18 Kvh Verbautechnik Gmbh Transportgreifer mit Blockiervorrichtung
DE4406771C2 (de) * 1994-03-02 1997-02-06 Fraunhofer Ges Forschung Greifer für einen Industrieroboter
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Also Published As

Publication number Publication date
MY129724A (en) 2007-04-30
JPH09321183A (ja) 1997-12-12
DE19711683A1 (de) 1997-12-04
CN1168004A (zh) 1997-12-17
DE19711683C2 (de) 2002-08-29
KR100250352B1 (ko) 2000-04-01
CN1085888C (zh) 2002-05-29
JP3711301B2 (ja) 2005-11-02
US5822847A (en) 1998-10-20
TW312809B (en) 1997-08-11

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