KR970075396A - 유체 제어 장치 - Google Patents

유체 제어 장치 Download PDF

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Publication number
KR970075396A
KR970075396A KR1019970017375A KR19970017375A KR970075396A KR 970075396 A KR970075396 A KR 970075396A KR 1019970017375 A KR1019970017375 A KR 1019970017375A KR 19970017375 A KR19970017375 A KR 19970017375A KR 970075396 A KR970075396 A KR 970075396A
Authority
KR
South Korea
Prior art keywords
passage
fluid
control device
high purity
fluid control
Prior art date
Application number
KR1019970017375A
Other languages
English (en)
Inventor
다다히로 오미
게이지 히라오
유키오 미나미
미치오 야마지
다카시 히로세
노부카즈 이케다
Original Assignee
다다히로 오미
오가와 슈헤이
가부시키가이샤 후지킨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다다히로 오미, 오가와 슈헤이, 가부시키가이샤 후지킨 filed Critical 다다히로 오미
Publication of KR970075396A publication Critical patent/KR970075396A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y10T137/4259—With separate material addition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/87571—Multiple inlet with single outlet
    • Y10T137/87676—With flow control
    • Y10T137/87684—Valve in each inlet

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
  • Fluid-Pressure Circuits (AREA)
  • Lift Valve (AREA)
  • Flow Control (AREA)

Abstract

유체 제어 장치의 밸브 본체내에, 매스 플로우 컨트롤러내의 통로의 입구로 연결되는 주통로와, 주통로와 접속되어 있는 상대적으로 긴 부통로 및 상대적으로 짧은 부통로가 형성되어 있고, 고순도를 확보해야 할 공정가스는 상대적으로 긴 부통로로 흐르고 있다.

Description

유체 제어 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 유체 제어 장치의 제1실시예를 나타내는 정면도, 제2도는 종래의 유체 제어 장치를 나타내는 정면도, 제3도는 본 발명에 따른 유체 제어 장치에 있어서의 공정 가스의 순도 변화를 나타내기 위한 그래프, 제4도는 종래의 유체 제어 장치에 있어서의 공정 가스의 순도 변화를 나타내기 위한 그래프, 제5도는 본 발명에 따른 유체 제어 장치의 제2실시예를 나타내는 정면도, 제6도는 본 발명이 대상으로 하는 유체 제어 장치의 사용예를 나타내는 도면.

Claims (3)

  1. 밸브 본체내에, 유체 압력 또는 유량을 조정하는 조정기내의 통로의 입구 또는 출구로 연결되는 주통로와, 주통로와 접속되어 있는 상대적으로 긴 부통로 및 상대적으로 짧은 부통로가 형성되어 있고, 어느 한쪽 부통로가 고순도를 확보해야 할 유체용이 되는 유체 제어 장치에 있어서, 고순도를 확보해야 할 유체가 흐르는 부통로가 상대적으로 긴 부통로로 되어 있는 것을 특징으로 하는 유체 제어 장치.
  2. 제1항에 있어서, 부통로가 3개 있고, 가장 긴 부통로가 고순도를 확보해야 할 유체용이 되는 동시에, 2번째로 긴 부통로가 다음에 순도를 확보해야 할 유체용으로 되어 있는 것을 특징으로 하는 유체 제어 장치.
  3. 제2항에 있어서, 고순도를 확보해야 할 유체가 반도체 제조용 공정 가스가 되는 동시에, 다음에 순도를 확보해야 할 유체가 퍼지 가스로 되어 있는 것을 특징으로 하는 유체 제어 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970017375A 1996-05-10 1997-05-07 유체 제어 장치 KR970075396A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-116204 1996-05-10
JP11620496A JP3726168B2 (ja) 1996-05-10 1996-05-10 流体制御装置

Publications (1)

Publication Number Publication Date
KR970075396A true KR970075396A (ko) 1997-12-10

Family

ID=14681423

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970017375A KR970075396A (ko) 1996-05-10 1997-05-07 유체 제어 장치

Country Status (9)

Country Link
US (2) US5975112A (ko)
EP (2) EP1276030A3 (ko)
JP (1) JP3726168B2 (ko)
KR (1) KR970075396A (ko)
CA (1) CA2204939A1 (ko)
DE (1) DE69727419T2 (ko)
IL (1) IL120804A (ko)
SG (1) SG50019A1 (ko)
TW (1) TW377387B (ko)

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Also Published As

Publication number Publication date
US6257270B1 (en) 2001-07-10
CA2204939A1 (en) 1997-11-10
IL120804A0 (en) 1997-09-30
EP0806573A3 (en) 1999-07-07
US5975112A (en) 1999-11-02
DE69727419T2 (de) 2004-12-16
IL120804A (en) 2000-07-26
TW377387B (en) 1999-12-21
SG50019A1 (en) 1998-06-15
EP1276030A2 (en) 2003-01-15
JP3726168B2 (ja) 2005-12-14
EP0806573B1 (en) 2004-02-04
EP1276030A3 (en) 2003-02-05
DE69727419D1 (de) 2004-03-11
EP0806573A2 (en) 1997-11-12
JPH09303308A (ja) 1997-11-25

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