KR970065676A - 접착 테이프, 접착 테이프용 베이스 재료 및 그의 제조 방법 - Google Patents

접착 테이프, 접착 테이프용 베이스 재료 및 그의 제조 방법 Download PDF

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KR970065676A
KR970065676A KR1019970008875A KR19970008875A KR970065676A KR 970065676 A KR970065676 A KR 970065676A KR 1019970008875 A KR1019970008875 A KR 1019970008875A KR 19970008875 A KR19970008875 A KR 19970008875A KR 970065676 A KR970065676 A KR 970065676A
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acrylate
base material
adhesive tape
meth
urethane acrylate
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KR100489844B1 (ko
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고우이찌 나가모또
미끼오 고미야마
가즈요시 에베
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쇼지 고메이
린텍 가부시끼가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer
    • Y10T428/31576—Ester monomer type [polyvinylacetate, etc.]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Jigs For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

베이스 재료는 우레탄 아크릴레이트 올리고머 및 반응성 희석 단량체의 혼합물을 경화시켜 제조된 방사선 경화 재료를 가지며, 또한 10% 이상, 바람직하게 100% 이상의 파단 신장도를 나타낸다. 베이스 재료는 베이스 시트 상에 형성된 접착층을 갖는 접착 테이프의 베이스 시트로서 사용된다. 따라서, 신규한 베이스 재료 및 상기 베이스 재료를 갖는 접착 테이프에 더하여 그의 제조 방법이 제공된다. 또한, 접착 테이프는 반도체 웨이퍼의 배면 연마(back grinding) 및 다이싱(dicing)단계에서 균열, 칩-스캐터링 등의 문제를 야기하는 임의 피쉬 아이(fish eye)가 없는 편평한 표면을 가지며, 또한 접착 테이프는 통상의 테이프에 비하여 소정의 두께를 갖도록 매우 정밀하게 가공할 수 있다.

Description

접착 테이프, 접착 테이프용 베이스 재료 및 그의 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (18)

10%이상, 바람직하게 100% 이상의 파단 신장도를 갖는, 우레탄 아크릴레이트 올리고머 및 반응성 희석 단량체의 혼합물을 경화시켜 제조된 방사선 경화 재료로 이루어진, 베이스 시트 상에 형성된 접착층을 갖는 접착 테이프의 베이스 시트로서 사용되는 베이스 재료.
제1항에 있어서, 상기 방사선 경화 재료의 초기 탄성율이 100 내지 100,000㎏/㎠, 바람직하게 500 내지 50,000㎏/㎠인 베이스 재료.
제1항에 있어서, 상기 우레탄 아크릴레이트 올리고머가 500 내지 100,000, 바람직하게 1,000 내지 30,000의 분자량을 가지며, 주 골격으로서 에스테르 디올을 갖는 2착용성 우레탄 아크릴레이트인 베이스 재료.
제1항에 있어서, 상기 반응성 희석 단량체는 모르폴린 아크릴레이트, 이소보르닐 (메트)아크릴레이트, 디시클로펜타닐 (메트)아크릴레이트, 디시클로펜테닐 (메트)아크릴레이트 및 메톡실레이트 시클로데카트리엔 아크릴레이트의 군으로부터 선택되는 1종 이상인 베이스 재료.
제1항에 있어서, 상기 우레탄 아크릴레이트 올리고머 및 상기 반응성 희석 단량체 사이의 혼합비가 95 내지 5:5 내지 95, 바람직하게 50 내지 70:50 내지 30인 베이스 재료.
제1항에 있어서, 상기 접착층이 제거가능한 접착제로 구성되는 베이스 재료.
우레탄 아크릴레이트 올리고머 및 반응성 희석제 단량체 혼합물을 제조하는 단계, 및 혼합물을 방사선 조사하여 베이스 재료로서 10% 이상, 바람직하게 100% 이상의 파단 신장도를 갖는 방사선 경화 재료를 얻는 단계로 이루어진, 베이스 시트 상에 형성된 접착층을 갖는 접착 테이프의 베이스 시트로서 사용되는 베이스 재료의 제조 방법.
제7항에 있어서, 상기 방사선 경화 재료의 초기 탄성율이 100 내지 100,000㎏/㎠, 바람직하게 500 내지 50,000㎏/㎠인 방법.
제7항에 있어서, 상기 우레탄 아크릴레이트 올리고머가 500 내지 100,000, 바람직하게 1,000 내지 30,000의 분자량을 가지며, 주 골격으로서 에스테르 디올을 갖는 2작용성 우레탄 아크릴레이트인 방법.
제7항에 있어서, 상기 반응성 희석 단량체는 모르폴린 아크릴레이트, 이소보르닐 (메트)아크릴레이트, 디시클로펜타닐 (메트)아크릴레이트, 디시클로펜테닐 (메트)아크릴레이트 및 메톡실레이트 시클로데카트리엔 아크릴레이트의 군으로부터 선택되는 1종 이상인 방법.
제7항에 있어서, 상기 우레탄 아크릴레이트 올리고머 및 상기 반응성 희석 단량체 사이의 혼합비가 95 내지 5:5 내지 95, 바람직하게 50 내지 70:50 내지 30인 방법.
제7항에 있어서, 상기 접착층이 제거가능한 접착제로 구성되는 방법.
10%이상, 바람직하게 100% 이상의 파단 신장도를 갖는, 우레탄 아크릴레이트 올리고머 및 반응성 희석 단량체의 혼합물을 경화시켜 제조된 방사선 경화 재료로 이루어진, 베이스 시트의 적어도 1개의 표면 상에 형성된 접착층을 갖는 접착 테이프.
제13항에 있어서, 상기 방사선 경화 재료의 초기 탄성율이 100 내지 100,000㎏/㎠, 바람직하게는 500 내지 50,000㎏/㎠인 접착 테이프.
제13항에 있어서, 상기 우레탄 아크릴레이트 올리고머가 500 내지 100,000, 바람직하게 1,000 내지 30,000의 분자량을 가지며, 주 골격으로서 에스테르 디올을 갖는 2착용성 우레탄 아크릴레이트인 접착 테이프.
제13항에 있어서, 상기 반응성 희석 단량체는 모르폴린 아크릴레이트, 이소보르닐 (메트)아크릴레이트, 디시클로펜타닐 (메트)아크릴레이트, 디시클로펜테닐 (메트)아크릴레이트 및 메톡실레이트 시클로데카트리엔 아크릴레이트의 군으로부터 선택되는 것인 접착 테이프.
제13항에 있어서, 상기 우레탄 아크릴레이트 올리고머 및 상기 반응성 희석 단량체 사이의 혼합비가 95 내지 5:5 내지 95, 바람직하게 50 내지 70:50 내지 30인 접착 테이프.
제13항에 있어서, 상기 접착층이 제거가능한 접착제로 구성되는 접착 테이프.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970008875A 1996-03-15 1997-03-15 접착테이프,접착테이프용베이스재료및그의제조방법 KR100489844B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP96-059651 1996-03-15
JP5965196A JP3177149B2 (ja) 1996-03-15 1996-03-15 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
JP96-059,651 1996-03-15

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KR970065676A true KR970065676A (ko) 1997-10-13
KR100489844B1 KR100489844B1 (ko) 2005-12-27

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US (1) US6139953A (ko)
EP (1) EP0798355B1 (ko)
JP (1) JP3177149B2 (ko)
KR (1) KR100489844B1 (ko)
DE (1) DE69722498T2 (ko)
SG (1) SG70000A1 (ko)
TW (1) TW360904B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655036B1 (ko) * 1998-08-26 2006-12-07 린텍 가부시키가이샤 양면점착시트 및 그 사용 방법

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10337823A (ja) * 1997-04-11 1998-12-22 Lintec Corp 基材および該基材を用いた粘着テープ
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
JP3739570B2 (ja) * 1998-06-02 2006-01-25 リンテック株式会社 粘着シートおよびその利用方法
JP3383227B2 (ja) * 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP2002141306A (ja) * 2000-11-02 2002-05-17 Lintec Corp ダイシングシート
JP2003096140A (ja) * 2001-09-20 2003-04-03 Nitto Denko Corp 複合フィルムおよび粘着シート
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US20050153129A1 (en) * 2002-07-26 2005-07-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
US20080193728A1 (en) * 2002-07-26 2008-08-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
KR101067519B1 (ko) * 2003-03-17 2011-09-27 린텍 가부시키가이샤 표면보호용 점착시트 및 그 제조방법
JP4592535B2 (ja) 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP4879702B2 (ja) * 2006-10-20 2012-02-22 リンテック株式会社 ダイソート用シートおよび接着剤層を有するチップの移送方法
JP5059559B2 (ja) * 2006-12-05 2012-10-24 リンテック株式会社 レーザーダイシングシートおよびチップ体の製造方法
US8114520B2 (en) * 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
EP2998987B1 (en) * 2006-12-05 2017-03-01 Lintec Corporation Laser dicing sheet and method for manufacturing chip body
DE102007034877A1 (de) * 2007-07-24 2009-01-29 Schmid Rhyner Ag Verfahren und Vorrichtung zum Auftrag von Kunststoffbeschichtungen
US20110201717A1 (en) * 2007-12-28 2011-08-18 E. I. Du Pont De Nemours And Company Actinically curable adhesive composition
TW200934662A (en) * 2007-12-28 2009-08-16 Du Pont Method for reworking adhesively bonded liquid crystal displays
JP2011508814A (ja) * 2007-12-28 2011-03-17 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 熱および化学線硬化型接着剤組成物
JP5383069B2 (ja) * 2008-03-25 2014-01-08 グンゼ株式会社 バックグラインドフィルム及びその製造方法
JP5388466B2 (ja) * 2008-03-25 2014-01-15 グンゼ株式会社 バックグラインド用基体フィルム及びその製造方法
JP5383070B2 (ja) * 2008-03-25 2014-01-08 グンゼ株式会社 バックグラインドフィルム及びその製造方法
JP5388465B2 (ja) * 2008-03-25 2014-01-15 グンゼ株式会社 バックグラインド用基体フィルム及びその製造方法
JP6176432B2 (ja) * 2008-04-21 2017-08-09 エルジー・ケム・リミテッド 粘着フィルム及びこれを使用したバックグラインディング方法
US8419896B2 (en) * 2008-11-20 2013-04-16 E. I. Du Pont De Nemours And Company Semi-automated reworkability process for de-bonding a display
CN102217034A (zh) * 2008-11-20 2011-10-12 E.I.内穆尔杜邦公司 用于脱粘显示器的半自动化再加工性设备
CN102421830A (zh) * 2009-05-13 2012-04-18 日东电工株式会社 复合薄膜及其制造方法
JP5743110B2 (ja) 2009-06-15 2015-07-01 エルジー・ケム・リミテッド ウェーハ加工用シート
JPWO2011024925A1 (ja) * 2009-08-28 2013-01-31 日東電工株式会社 粘着テープまたはシート用基材、および、粘着テープまたはシート
JP5068793B2 (ja) * 2009-09-24 2012-11-07 リンテック株式会社 粘着シート
KR101375888B1 (ko) * 2011-01-27 2014-03-19 주식회사 엘지화학 간극 충전용 스웰링 테이프
CN104508069B (zh) * 2012-08-02 2017-03-29 琳得科株式会社 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法
WO2014028024A1 (en) 2012-08-16 2014-02-20 E. I. Du Pont De Nemours And Company Actinically curable adhesive composition and bonding method using same
WO2014033932A1 (ja) * 2012-08-31 2014-03-06 株式会社ダイセル 光学シート
GB2525848B (en) * 2014-04-09 2020-12-09 Huawei Tech Co Ltd Base station deployment
DE102014218117A1 (de) * 2014-09-10 2016-03-10 Krones Aktiengesellschaft Gebinde mit wenigstens zwei klebend aneinander haftenden Artikeln und beidseitig klebendes Haftelement zur Verwendung hierfür
JP6944758B2 (ja) * 2015-01-16 2021-10-06 日東電工株式会社 両面粘着シート

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5391942A (en) * 1977-01-22 1978-08-12 Koyo Sangyo Co Adhesive tape
JPS62153376A (ja) * 1985-12-27 1987-07-08 F S K Kk ウェハダイシング用粘着シート
JPS63153814A (ja) * 1986-07-09 1988-06-27 F S K Kk ウエハ貼着用粘着シ−ト
GB8621835D0 (en) * 1986-09-10 1986-10-15 Courtaulds Plc Urethane polymer films
JPH01240243A (ja) * 1988-03-18 1989-09-25 Tokuda Seisakusho Ltd 電極およびその製造方法
JP2572422B2 (ja) * 1988-04-18 1997-01-16 帝人株式会社 耐熱粘着テープ用フィルム
DE4121702A1 (de) * 1991-07-01 1993-01-07 Huels Chemische Werke Ag Teilkristalliner film und dessen verwendung
JPH05135405A (ja) * 1991-11-13 1993-06-01 Dainippon Ink & Chem Inc 光デイスク用紫外線硬化型樹脂組成物
JPH0616721A (ja) * 1992-07-02 1994-01-25 Nippon Kayaku Co Ltd 樹脂組成物、透過型スクリーン用紫外線硬化型樹脂組成物及びその硬化物
JP2862453B2 (ja) * 1993-03-17 1999-03-03 積水化学工業株式会社 両面粘着テープ及びその製造方法
JPH0744913A (ja) * 1993-07-26 1995-02-14 Canon Inc 光記録媒体用保護粘着シートおよびそれを用いた光記録媒体
JPH0740755U (ja) * 1993-12-27 1995-07-21 積水化学工業株式会社 粘着テープ
JP2851808B2 (ja) * 1995-01-30 1999-01-27 ロデール・ニッタ株式会社 研磨用ウエハ保持部材及びそのウエハ保持部材の定盤への装着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655036B1 (ko) * 1998-08-26 2006-12-07 린텍 가부시키가이샤 양면점착시트 및 그 사용 방법

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DE69722498T2 (de) 2004-05-06
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