KR970030744A - Package with leadframe with internal leads extending across the diepad - Google Patents
Package with leadframe with internal leads extending across the diepad Download PDFInfo
- Publication number
- KR970030744A KR970030744A KR1019950043181A KR19950043181A KR970030744A KR 970030744 A KR970030744 A KR 970030744A KR 1019950043181 A KR1019950043181 A KR 1019950043181A KR 19950043181 A KR19950043181 A KR 19950043181A KR 970030744 A KR970030744 A KR 970030744A
- Authority
- KR
- South Korea
- Prior art keywords
- die pad
- chip
- package
- bonding
- electrically connected
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
본 발명은 반도체 칩 패키지에 관한 것으로, 리드프레임의 다이패드를 분할하고, 그 분할된 다이패드를 가로질러 내부리드들을 연장하여 전기적 연결될 칩의 원하는 본딩 패드들에 각기 대응되어 전기적 연결될 수 있도록 할 수 있게 함으로써, 칩의 본딩 패드들의 배치에 무관하게 리드프레임이 설계될 수 있기 때문에 칩의 본딩 패드 설계에 있어서 자유도를 보장할 수 있고, 본딩 패드들과 그들에 각기 대응되는 내부리드들을 본딩 와이어에 의해 각기 전기적 연결할 경우에 발생되는 상기 본딩 와이어의 새깅(sagging) 또는 스위핑(sweeping)으로 인한 패키지의 전기적 단락을 방지할 수 있어서 신뢰성이 보장된 패키지를 구현할 수 있는 특징을 갖는다.The present invention relates to a semiconductor chip package, which divides a die pad of a leadframe and extends inner leads across the divided die pad so as to be electrically connected to the desired bonding pads of the chip to be electrically connected. By doing so, the lead frame can be designed independently of the placement of the bonding pads of the chip, thereby ensuring the degree of freedom in the bonding pad design of the chip, and the bonding pads and the respective inner leads corresponding thereto by the bonding wires. It is possible to prevent electrical short-circuit of the package due to sagging or sweeping of the bonding wires generated in the case of electrical connection, respectively.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 1도는 본 발명의 다이패드를 가로질러 연장·형성된 내부리드를 갖는 리드프레임을 적용한 패키지의 성형 부분을 일부 절개하여 나타내는 평면도.1 is a plan view showing a part of the molded part of a package to which a lead frame having an inner lead extending and formed across the die pad of the present invention is partially cut away;
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950043181A KR970030744A (en) | 1995-11-23 | 1995-11-23 | Package with leadframe with internal leads extending across the diepad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950043181A KR970030744A (en) | 1995-11-23 | 1995-11-23 | Package with leadframe with internal leads extending across the diepad |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970030744A true KR970030744A (en) | 1997-06-26 |
Family
ID=66588149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950043181A KR970030744A (en) | 1995-11-23 | 1995-11-23 | Package with leadframe with internal leads extending across the diepad |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970030744A (en) |
-
1995
- 1995-11-23 KR KR1019950043181A patent/KR970030744A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |