KR20150075727A - Semiconductor package - Google Patents

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Publication number
KR20150075727A
KR20150075727A KR1020130163959A KR20130163959A KR20150075727A KR 20150075727 A KR20150075727 A KR 20150075727A KR 1020130163959 A KR1020130163959 A KR 1020130163959A KR 20130163959 A KR20130163959 A KR 20130163959A KR 20150075727 A KR20150075727 A KR 20150075727A
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KR
South Korea
Prior art keywords
lead
connecting member
leads
lead connecting
coupled
Prior art date
Application number
KR1020130163959A
Other languages
Korean (ko)
Other versions
KR101983165B1 (en
Inventor
명준우
송성민
Original Assignee
삼성전기주식회사
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020130163959A priority Critical patent/KR101983165B1/en
Priority to US14/501,577 priority patent/US9281257B2/en
Publication of KR20150075727A publication Critical patent/KR20150075727A/en
Application granted granted Critical
Publication of KR101983165B1 publication Critical patent/KR101983165B1/en

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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Abstract

The present invention relates to a semiconductor package capable of preventing a lead frame from being separated from a mold part in a manufacturing process. For this, the semiconductor package according to the present invention includes at least one electronic device, a lead frame which includes a plurality of leads which are electrically connected to the electronic device, a lead connection member which is combined with at least one lead, and the mold part which encapsulates the lead connection member and the electronic device.

Description

반도체 패키지{SEMICONDUCTOR PACKAGE}[0001] SEMICONDUCTOR PACKAGE [0002]

본 발명은 반도체 패키지에 관한 것으로, 더욱 상세하게는 제조 과정에서 리드 프레임이 몰드부에서 분리되는 것을 방지할 수 있는 반도체 패키지에 관한 것이다.The present invention relates to a semiconductor package, and more particularly, to a semiconductor package capable of preventing a lead frame from being separated from a mold part in a manufacturing process.

전력 트랜지스터, 절연 게이트 바이폴라 트랜지스터(insulated-gate bipolar transistor; IGBT), 모스 트랜지스터, 실리콘 제어 정류기(silicon-controlled rectifier; SCR), 전력 정류기, 서보 드라이버, 전력 레귤레이터, 인버터, 컨버터와 같은 전력 소자를 사용하는 전력용 전자 산업이 발전함에 따라, 우수한 성능을 가지면서도 경량 및 소형화가 가능한 전력용 제품에 대한 요구가 증대되고 있다.Power devices such as power transistors, insulated-gate bipolar transistors (IGBTs), MOS transistors, silicon-controlled rectifiers (SCRs), power rectifiers, servo drivers, power regulators, inverters and converters As the power electronics industry develops, there is a growing demand for power products that have excellent performance and are lightweight and compact.

이와 같은 추세에 따라, 최근에는 다양한 전력 소자들을 하나의 패키지에 집적시킬 뿐만 아니라, 전력 소자들을 제어하기 위한 제어 소자를 전력 소자와 하나의 패키지로 제조하려는 연구가 활발하게 이루어지고 있다In accordance with this trend, in recent years, researches have been made actively to integrate various power devices into a single package, and to manufacture a control device for controlling power devices in one package with a power device

이에 따른 종래의 전력 반도체 패키지는 일반적으로 리드 프레임과, 리드 프레임 상에 실장되는 전력 소자, 제어 소자, 그리고 각 소자들의 외부를 수지 등으로 몰딩하는 몰드부를 포함하여 구성된다. 또한 효과적인 열 방출을 위해 방열 기판이 구비되고 있다. Accordingly, the conventional power semiconductor package generally comprises a lead frame, a power element mounted on the lead frame, a control element, and a mold part for molding the outside of each element with resin or the like. Further, a heat dissipation substrate is provided for effective heat dissipation.

그런데 이러한 종래의 반도체 패키지는 제조 과정에서 리드 프레임이 몰드부에 견고하게 체결되지 못하여, 외력이 가해지는 경우, 쉽게 몰드부로부터 분리되어 버리는 문제가 발생되고 있다. However, in the conventional semiconductor package, the lead frame is not firmly fastened to the mold part during the manufacturing process, and when the external force is applied, the lead frame is easily separated from the mold part.

따라서 리드 프레임을 몰드부에 보다 견고하게 체결할 수 있는 반도체 패키지와 그 제조 방법이 요구되고 있는 실정이다
Therefore, there is a demand for a semiconductor package and a manufacturing method thereof that can firmly fasten the lead frame to the molded part

한국특허공개공보 제2010-0012628호Korean Patent Laid-Open Publication No. 2010-0012628

본 발명은 리드 프레임을 몰드부에 견고하게 체결할 수 있는 반도체 패키지를 제공하는 것을 목적으로 한다. SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor package which can firmly fasten a lead frame to a mold part.

본 발명의 다른 목적은 리드 프레임들을 서로 전기적으로 연결할 수 있는 연결 부재를 구비하는 반도체 패키지를 제공하는 것을 목적으로 한다.
Another object of the present invention is to provide a semiconductor package having a connecting member capable of electrically connecting lead frames to each other.

본 발명의 실시예에 따른 반도체 패키지는, 적어도 하나의 전자 소자; 상기 전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임; 적어도 하나의 상기 리드에 결합되는 리드 연결부재; 및 상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부;를 포함할 수 있다.A semiconductor package according to an embodiment of the present invention includes at least one electronic device; A lead frame having a plurality of leads to which the electronic device is electrically connected; A lead connecting member coupled to at least one of the leads; And a mold unit for sealing the electronic device and the lead connecting member.

본 실시예에 있어서 상기 리드 연결부재는, ㄷ 형상으로 형성될 수 있다.In this embodiment, the lead connecting member may be formed in a C shape.

본 실시예에 있어서 상기 리드 연결부재는, 상기 리드들에 결합되는 다수의 결합부; 및 상기 다수의 결합부들을 상호 연결하는 연결부;를 포함할 수 있다.In the present embodiment, the lead connecting member includes: a plurality of engaging portions coupled to the leads; And a connection part interconnecting the plurality of coupling parts.

본 실시예에 있어서 상기 리드 연결부재의 상기 결합부는, 상기 리드에 형성된 관통 구멍에 삽입되는 삽입부; 및 상기 관통 구멍의 외부에 배치되며 상기 삽입부보다 단면적이 크게 형성되는 는 확장부;를 포함할 수 있다.In this embodiment, the engaging portion of the lead connecting member includes: an inserting portion inserted into the through hole formed in the lead; And an extension portion disposed outside the through hole and having a larger cross-sectional area than the insertion portion.

본 실시예에 있어서, 하나의 상기 리드 연결부재는 하나의 상기 리드에 결합될 수 있다.In this embodiment, one of the lead connecting members may be coupled to one of the leads.

본 실시예에 있어서 하나의 상기 리드 연결부재는, 다수의 상기 리드에 결합될 수 있다.In this embodiment, one of the lead connecting members may be coupled to a plurality of the leads.

본 실시예에 있어서 상기 리드 연결부재는, 도전성의 금속 재질로 형성될 수 있다.In the present embodiment, the lead connecting member may be formed of a conductive metal.

본 실시예에 있어서 상기 리드는, 상기 리드 연결부재가 결합되는 적어도 하나의 관통 구멍을 구비할 수 있다.In the present embodiment, the lead may include at least one through hole to which the lead connecting member is coupled.

본 실시예에 있어서 상기 관통 구멍은, 원통 형태로 형성될 수 있다.In this embodiment, the through-hole may be formed in a cylindrical shape.

본 실시예에 있어서 상기 관통 구멍은, 슬릿 형태로 형성될 수 있다.In this embodiment, the through holes may be formed in a slit shape.

본 실시예에 있어서 상기 리드 프레임은, 상기 몰드부 내에 배치되는 내부 리드와, 상기 몰드부의 외부에 배치되는 외부 리드를 포함하며, 상기 리드 연결부재는 상기 내부 리드에 결합될 수 있다.In the present embodiment, the lead frame includes an inner lead disposed in the mold portion and an outer lead disposed outside the mold portion, and the lead connecting member can be coupled to the inner lead.

또한 본 발명의 실시예에 따른 반도체 패키지는, 전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임; 적어도 하나의 상기 리드에 결합되어 상기 리드의 돌기를 형성하는 리드 연결부재; 및 상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부;를 포함할 수 있다.According to another aspect of the present invention, there is provided a semiconductor package including: a lead frame having a plurality of leads electrically connected to electronic devices; A lead connecting member coupled to at least one of the leads to form a protrusion of the lead; And a mold unit for sealing the electronic device and the lead connecting member.

또한 본 발명의 실시예에 따른 반도체 패키지는, 전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임; 다수의 상기 리드에 결합되어 상기 리드들을 전기적으로 연결하는 리드 연결부재; 및 상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부;를 포함할 수 있다.
According to another aspect of the present invention, there is provided a semiconductor package including: a lead frame having a plurality of leads electrically connected to electronic devices; A lead connecting member coupled to the plurality of leads to electrically connect the leads; And a mold unit for sealing the electronic device and the lead connecting member.

본 발명에 따른 반도체 패키지는 리드 연결부재에 의해 서로 이격된 리드들이 서로 전기적으로 연결될 수 있다. 즉, 전기적으로 연결되어야 하는 두 개의 리드가 서로 이격되어 배치되고 그 사이에 다른 리드들이 배치된 경우, 리드 연결부재를 이용하여 용이하게 해당 리드들을 전기적으로 연결할 수 있다.In the semiconductor package according to the present invention, the leads separated from each other by the lead connecting member can be electrically connected to each other. That is, when two leads to be electrically connected are disposed apart from each other and other leads are disposed therebetween, the leads can be electrically connected easily using the lead connecting member.

또한 본 발명에 따른 리드 연결부재는 적어도 일부가 리드들에서 외부로 돌출되는 형태로 리드에 결합된다. 따라서 리드 연결부재는 리드로부터 돌출되는 돌기의 역할도 함께 수행한다. Further, the lead connecting member according to the present invention is coupled to the lead in such a manner that at least a part thereof protrudes outward from the leads. Therefore, the lead connecting member also functions as a protrusion protruding from the lead.

이러한 돌출된 부분은 몰드부 내에서 돌기의 역할을 수행하여 몰드부 내에 매립된 리드들이 몰드부로부터 분리되는 것을 억제한다. 따라서 리드 연결부재는 리드가 몰드부에서 분리되는 것을 방지하는 기능도 갖는다.
These protruding portions serve as protrusions in the mold portion, so that the buried leads in the mold portion are prevented from being separated from the mold portion. Therefore, the lead connecting member also has a function of preventing the lead from being separated from the mold part.

도 1은 본 발명의 실시예에 따른 반도체 패키지를 개략적으로 나타내는 평면도.
도 2는 도 1의 A-A에 따른 단면도.
도 3은 도 2의 내부 리드와 리드 연결부재를 개략적으로 도시한 사시도.
도 4는 도 3의 분해 사시도.
도 5는 도 2의 B 방향에 따른 부분 평면도.
도 6은 본 발명의 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도.
도 7은 도 6의 분해 사시도.
도 8은 본 발명의 또 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도.
도 9는 도 8의 분해 사시도.
도 10은 본 발명의 또 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도.
도 11은 도 10의 분해 사시도.1 is a plan view schematically showing a semiconductor package according to an embodiment of the present invention.
2 is a cross-sectional view taken along line AA in Fig.
Fig. 3 is a perspective view schematically showing the inner lead and the lead connecting member of Fig. 2; Fig.
FIG. 4 is an exploded perspective view of FIG. 3; FIG.
Fig. 5 is a partial plan view along the direction B in Fig. 2; Fig.
6 is a perspective view schematically illustrating a lead connecting member and a lead connecting member according to another embodiment of the present invention.
7 is an exploded perspective view of Fig.
8 is a perspective view schematically illustrating a lead connecting member and a lead connecting member according to another embodiment of the present invention.
Fig. 9 is an exploded perspective view of Fig. 8; Fig.
10 is a perspective view schematically showing a lead connecting member and a lead frame according to still another embodiment of the present invention.
11 is an exploded perspective view of Fig.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시 형태들을 설명한다. 그러나, 본 발명의 실시형태는 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 이하 설명하는 실시 형태로 한정되는 것은 아니다. 또한, 본 발명의 실시형태는 당해 기술분야에서 평균적인 지식을 가진 자에게 본 발명을 더욱 완전하게 설명하기 위해서 제공되는 것이다. 더하여 도면에서 요소들의 형상 및 크기 등은 보다 명확한 설명을 위해 과장될 수 있다.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Further, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. In addition, the shape and size of elements in the figures may be exaggerated for clarity.

도 1은 본 발명의 실시예에 따른 반도체 패키지를 개략적으로 나타내는 평면도이고, 도 2는 도 1의 A-A에 따른 단면도이며, 도 3은 도 2의 내부 리드와 리드 연결부재를 개략적으로 도시한 사시도이다. 또한 도 4는 도 3의 분해 사시도이고 도 5는 도 2의 B 방향에 따른 부분 평면도이다. 여기서 도 5는 설명의 편의를 위해 몰드부를 생략하고 도시하였다. FIG. 1 is a plan view schematically showing a semiconductor package according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a perspective view schematically showing the internal lead and the lead connecting member of FIG. 2 . Fig. 4 is an exploded perspective view of Fig. 3, and Fig. 5 is a partial plan view along the direction B of Fig. 5, the mold part is omitted for convenience of explanation.

도 1 내지 도 5를 참조하면, 본 실시예에 따른 반도체 패키지(100)는 전자 소자(10), 리드 프레임(20), 및 몰드부(80)를 포함하여 구성될 수 있다. Referring to FIGS. 1 to 5, the semiconductor package 100 according to the present embodiment may include an electronic device 10, a lead frame 20, and a mold unit 80.

전자 소자(10)는 수동 소자와 능동 소자 등과 같은 다양한 소자들을 포함할 수 있다. 특히 본 실시예에 따른 전자 소자(10)는 적어도 하나의 제1 전자 소자(12, 예컨대 전력 소자)와 적어도 하나의 제2 전자 소자(14, 예컨대 제어 소자)를 포함할 수 있다. The electronic device 10 may include various devices such as passive and active devices. In particular, the electronic device 10 according to the present embodiment may include at least one first electronic device 12 (e.g., a power device) and at least one second electronic device 14 (e.g., a control device).

여기서 제1 전자 소자(12)인 전력 소자(12)는 서보 드라이버, 인버터, 전력 레귤레이터 및 컨버터 등과 같은 전력 제어를 위한 전력변환 또는 전력제어를 위한 전력 회로 소자일 수 있다. Here, the power device 12, which is the first electronic device 12, may be a power circuit device for power conversion or power control for power control such as a servo driver, an inverter, a power regulator, and a converter.

예를 들어, 전력 소자(12)는 전력 모스펫(power MOSFET), 바이폴라 졍션 트랜지스터(bipolar junction transistor, BJT), 절연 게이트 바이폴라 트랜지스터(insulated-gate bipolar transistor; IGBT), 다이오드(diode) 이거나 이들의 조합을 포함할 수 있다. 즉, 본 실시예에 있어서 전력 소자(12)는 상술한 소자들을 모두 포함하거나 또는 그 일부를 포함할 수 있다.For example, the power device 12 may be a power MOSFET, a bipolar junction transistor (BJT), an insulated-gate bipolar transistor (IGBT), a diode, . ≪ / RTI > That is, in this embodiment, the power device 12 may include all or a part of the above-described elements.

또한 도시된 두 개의 전력 소자들(12)은 각각 절연 게이트 바이폴라 트랜지스터(IGBT)와 다이오드(diode)일 수 있다. 또한, 절연 게이트 바이폴라 트랜지스터(IGBT)와 다이오드(diode)를 한 쌍으로 하여, 총 여섯 쌍을 포함하는 전력 소자 패키지를 구현할 수 있다. 그러나 이는 하나의 예시일 뿐, 본 발명은 반드시 이에 한정되는 것은 아니다.Also, the two power devices 12 shown may be an insulated gate bipolar transistor (IGBT) and a diode, respectively. In addition, a pair of the insulated gate bipolar transistor (IGBT) and the diode can be used as a pair to realize a power device package including a total of six pairs. However, this is only an example, and the present invention is not necessarily limited thereto.

전력 소자들(12)은 접착부재(미도시)를 매개로 후술되는 리드 프레임(20)의 다이패드(22)에 부착될 수 있다. 여기서 접착부재는 도전성이거나 비도전성일 수 있다. 예를 들어, 접착부재로 솔더(solder), 금속 에폭시, 금속 페이스트, 수지계 에폭시(resin-based epoxy) 등의 페이스트를 경화시켜 이용할 수 있다.
The power elements 12 can be attached to the die pad 22 of the lead frame 20, which will be described later, via an adhesive member (not shown). Here, the bonding member may be conductive or non-conductive. For example, a paste such as a solder, a metal epoxy, a metal paste, and a resin-based epoxy may be used as an adhesive member.

제어 소자(14)는 본딩 와이어(90)를 통해 전력 소자(12)와 전기적으로 연결되고, 이에 따라 전력 소자(12)의 동작을 제어할 수 있다. 제어 소자(14)는 예를 들어, 마이크로 프로세서(microprocessor)일 수 있으나, 이에 더하여 저항, 인버터, 또는 콘덴서와 같은 수동 소자, 또는 트랜지스터와 같은 능동 소자들이 더 부가될 수 있다.The control element 14 is electrically connected to the power element 12 via the bonding wire 90 and thus can control the operation of the power element 12. [ The control element 14 may be, for example, a microprocessor, but in addition a passive element such as a resistor, an inverter, or a capacitor, or an active element such as a transistor may be further added.

한편, 제어 소자(14)는 하나의 전력 소자(12)에 대하여 하나 또는 다수개가 배치될 수 있다. 즉, 제어 소자(14)의 종류 및 개수는 전력 소자(12)의 종류와 개수에 따라서 적절하게 선택될 수 있다.
On the other hand, one or a plurality of control elements 14 may be disposed for one power element 12. That is, the types and the number of the control elements 14 can be appropriately selected depending on the type and the number of the power devices 12. [

이처럼 본 실시예에 따른 반도체 패키지(100)는 전력 소자(12)와, 전력 소자(12)를 제어하는 제어 소자(14)를 포함하는 전력 모듈(Power module)일 수 있다. As such, the semiconductor package 100 according to the present embodiment may be a power module including a power device 12 and a control device 14 for controlling the power device 12.

또한 본 실시예에 있어서 전력 소자(12)와 제어 소자(14)는 수직하게 적층되는 형태로 배치되지 않고 수평적으로 배치된다. 이에 따라 반도체 패키지(100)는 수직 길이(즉 두께)보다는 수평 길이(즉 폭)이 긴 형상으로 형성된다.Also, in this embodiment, the power device 12 and the control device 14 are arranged horizontally rather than vertically stacked. Accordingly, the semiconductor package 100 is formed in a shape having a longer horizontal length (i.e., width) than a vertical length (i.e., thickness).

이러한 전력 소자(12)와 제어 소자(14)는 본딩 와이어(90)를 통해 리드 프레임과 전기적으로 연결될 수 있다. The power element 12 and the control element 14 can be electrically connected to the lead frame via the bonding wire 90.

본 실시예에 따른 본딩 와이어(90)는 금속 재질일 수 있으며, 예를 들어 알루미늄(Al), 금(Au), 또는 이들의 합금이 이용될 수 있다. 한편, 본 실시예에서는 본딩 와이어(90)를 통해 전자 소자(10)들이 리드 프레임(20)과 전기적으로 연결되는 경우를 예로 들고 있으나, 본 발명의 구성이 이에 한정되는 것은 아니다.The bonding wire 90 according to the present embodiment may be made of a metal, for example, aluminum (Al), gold (Au), or an alloy thereof. In this embodiment, the electronic devices 10 are electrically connected to the lead frame 20 through the bonding wires 90. However, the present invention is not limited thereto.

즉, 플립 칩 본딩(Flip chip bonding) 방식으로 전자 소자(10)와 리드 프레임(20)을 전기적으로 연결하거나, 솔더볼을 이용하여 연결하는 등 다양한 응용이 가능하다.
That is, various applications such as electrically connecting the electronic element 10 and the lead frame 20 by a flip chip bonding method, or connecting by using a solder ball are possible.

리드 프레임(20)은 다수의 리드들을 포함하여 구성되는데, 여기서 각 리드들은 외부 기판(예컨대 마더 보드, 도시되지 않음)과 연결되기 위한 다수개의 외부 리드(20b)와, 전자 소자(10)와 연결되는 다수의 내부 리드(20a)로 구분될 수 있다. 즉, 외부 리드(20b)는 몰드부(80)의 외부로 노출되는 부분을 의미하며, 내부 리드(20a)는 몰드부(80)의 내부에 위치하는 부분을 의미할 수 있다.The lead frame 20 is configured to include a plurality of leads each having a plurality of external leads 20b for connection with an external substrate (e.g., a motherboard, not shown) And a plurality of internal leads 20a. That is, the outer lead 20b refers to a portion exposed to the outside of the mold 80, and the inner lead 20a can refer to a portion located inside the mold 80.

또한, 리드 프레임(20)은 적어도 하나의 다이 패드(22)를 포함할 수 있다. 다이 패드는 전자 소자들(10)이 탑재되는 영역으로, 본 실시예에서는 내부 리드(20a)에서 단차지게 절곡되는 다운셋(down set) 형태로 다이 패드(22)가 형성되는 경우를 예를 들고 있다. 그러나 본 발명의 구성이 이에 한정되는 것은 아니다.
In addition, the lead frame 20 may include at least one die pad 22. The die pad is an area on which the electronic elements 10 are mounted. In this embodiment, the die pad 22 is formed in a down set shape that is steppedly bent at the internal lead 20a have. However, the present invention is not limited thereto.

또한 본 실시예에 따른 리드 프레임(20)은 적어도 하나의 리드 연결부재(30)를 포함할 수 있다. Also, the lead frame 20 according to the present embodiment may include at least one lead connecting member 30.

도 3 및 도 4에 도시된 바와 같이, 본 실시예에 따른 리드 연결부재(30)는 적어도 2 개의 내부 리드(20a, 이하 리드)을 연결하기 위해 구비될 수 있다. 또한 리드 프레임(20)이 몰드부(80)에서 분리되는 것을 방지하기 위해 구비될 수 있다. 3 and 4, the lead connecting member 30 according to the present embodiment may be provided to connect at least two internal leads 20a (hereinafter referred to as leads). And may be provided to prevent the lead frame 20 from being separated from the mold part 80.

리드 연결부재(30)는 적어도 두 개의 리드(20a)에 결합되어 상호 간을 전기적으로 연결한다. 본 실시예에 따른 리드 연결부재(30)는 ㄷ 형상으로 형성될 수 있다. 보다 구체적으로, 리드 연결부재(30)는 리드(20a)에 결합되는 다수의 결합부(32)와, 결합부(32)를 연결하는 연결부(35)를 포함하여 구성될 수 있다. The lead connecting member 30 is coupled to at least two leads 20a to electrically connect each other. The lead connecting member 30 according to the present embodiment may be formed in a C shape. More specifically, the lead connecting member 30 may include a plurality of engaging portions 32 coupled to the leads 20a and a connecting portion 35 connecting the engaging portions 32. [

결합부(32)는 리드 프레임(20)의 내부 리드(20a)를 관통하며 리드 프레임(20)에 결합된다. 따라서 리드(20a)의 수직 두께보다 길거나 대략 유사한 길이로 형성될 수 있다. The engaging portion 32 penetrates the inner lead 20a of the lead frame 20 and is coupled to the lead frame 20. [ And therefore may be formed to have a length substantially equal to or longer than the vertical thickness of the lead 20a.

또한 연결부(35)는 결합부(32)와 동일한 두께로 형성될 수 있다. 그러나 이에 한정되지 않으며 결합부(32)보다 얇거나 두껍게 형성될 수도 있다.The connection portion 35 may be formed to have the same thickness as the coupling portion 32. However, it is not limited thereto and may be formed thinner or thicker than the engaging portion 32.

리드 프레임(20)의 리드(20a)에는 결합부(32)가 삽입되기 위한 적어도 하나의 관통 구멍(21)이 형성될 수 있다. 관통 구멍(21)은 결합부(32)가 용이하게 삽입될 수 있도록 결합부(32)의 단면에 대응하는 형상으로 형성될 수 있다. 본 실시예의 경우 결합부(32)의 형상에 대응하여 관통 구멍(21)이 원통 형상으로 형성되는 경우를 예로 들고 있다. 그러나 이에 한정되지 않으며 다각 형상이나 타원 형상 등 필요에 따라 다양한 형상으로 형성될 수 있다. At least one through hole 21 may be formed in the lead 20a of the lead frame 20 so that the engaging portion 32 is inserted into the lead 20a. The through hole 21 may be formed in a shape corresponding to the end surface of the engaging portion 32 so that the engaging portion 32 can be easily inserted. In this embodiment, the through hole 21 is formed in a cylindrical shape corresponding to the shape of the engaging portion 32. [ However, the present invention is not limited to this, and may be formed in various shapes according to need, such as a polygonal shape or an elliptical shape.

또한 본 실시예에서는 관통 구멍(21)이 리드(20a)의 중심에 형성되는 경우를 예로 들고 있다. 그러나, 리드(20a)의 중심이 아닌 일측으로 치우친 위치에 관통 구멍(21)을 형성하는 것도 가능하며 리드(20a)의 측면을 통해 관통 구멍(21)의 일부가 개방되도록 형성하는 등 다양한 응용이 가능하다.In this embodiment, the through hole 21 is formed at the center of the lead 20a. However, it is also possible to form the through hole 21 at a position deviated to one side rather than the center of the lead 20a and to form a part of the through hole 21 to be opened through the side surface of the lead 20a, It is possible.

이러한 리드 연결부재(30)는 리드들(20a)의 상부에서 리드들(20a)에 형성된 관통 구멍(21)에 삽입되며 리드(20a)에 결합될 수 있다. 또한 리드들(20a)의 하부에서 결합되는 것도 가능하다. The lead connecting member 30 is inserted into the through hole 21 formed in the leads 20a at the top of the leads 20a and can be coupled to the lead 20a. It is also possible to be coupled at the bottom of the leads 20a.

한편 본 실시예서는 관통 구멍(21)들이 리드들(20a)을 수직하게 관통하는 형태로 형성되는 경우를 예로 들고 있다. 그러나 본 발명이 이에 한정되는 것은 아니며, 비스듬하게 관통 구멍(21)을 형성하는 등 필요에 따라 다양한 응용이 가능하다.
In this embodiment, the through holes 21 are formed to penetrate the leads 20a vertically. However, the present invention is not limited thereto, and various applications can be made as needed, such as forming the through hole 21 obliquely.

이상과 같이 구성되는 본 실시예에 따른 반도체 패키지(100)는 리드 연결부재(30)에 의해 서로 이격된 리드들(20a)이 전기적으로 연결될 수 있다. 즉, 도 5에 도시된 바와 같이, 전기적으로 연결되어야 하는 두 개의 리드(201a, 202a)가 서로 이격되어 배치되고 그 사이에 다른 리드들(203a)이 배치된 경우, 리드 연결부재(30)를 이용하여 용이하게 해당 리드들(201a, 202a)을 전기적으로 연결할 수 있다.In the semiconductor package 100 according to the present embodiment configured as described above, the leads 20a spaced apart from each other by the lead connecting member 30 can be electrically connected. That is, as shown in FIG. 5, when two leads 201a and 202a to be electrically connected are disposed apart from each other and other leads 203a are disposed therebetween, the lead connecting member 30 The corresponding leads 201a and 202a can be electrically connected to each other easily.

특히 본 실시예에 따른 리드 연결부재(30)가 없는 경우, 도 5에서 본딩 와이어(90a)를 특정 리드(201a)에 연결하기 위해서는, 해당 본딩 와이어(90a)가 다른 리드(203a)에 연결된 본딩 와이어(90b)와 교차 배치되어야 한다. 5, in order to connect the bonding wire 90a to the specific lead 201a, the bonding wire 90a is bonded to the other lead 203a, And should be disposed in an intersecting relation with the wire 90b.

그러나 본 실시예에 따른 리드 연결부재(30)를 구비하는 경우, 도 5에 도시된 바와 같이 다른 리드(202a)로 본딩 와이어(90a)를 연결하고, 리드 연결부재(30)를이용하여 해당 리드(201a)와 전기적으로 연결한다. 따라서 본딩 와이어들(90a, 90b)이 교차 배치되고, 이에 따라 상호 간에 단락이 발생하거나 패키지의 전체적인 부피가 커지는 것을 방지할 수 있다. However, when the lead connecting member 30 according to the present embodiment is provided, the bonding wire 90a is connected to another lead 202a as shown in Fig. 5, and the lead connecting member 30 is used to connect the lead (Not shown). Thus, the bonding wires 90a and 90b are arranged in an alternating manner, thereby preventing short-circuiting between the bonding wires 90a and 90b or increasing the overall volume of the package.

또한 본 실시예에 따른 리드 연결부재(30)는 일부분이 리드들(20a)에서 외부로 돌출되는 형태로 리드(20a)에 결합된다. 따라서 리드 연결부재(30)는 리드(20a)로부터 돌출되는 돌기의 역할도 함께 수행한다. Also, the lead connecting member 30 according to the present embodiment is coupled to the lead 20a in such a manner that a part thereof protrudes outward from the leads 20a. Therefore, the lead connecting member 30 also functions as a protrusion protruding from the lead 20a.

이처럼 돌출된 부분은 몰드부(80) 내에서 돌기의 역할을 수행하여 몰드부(80)내에 매립된 리드들(20a)이 몰드부(80)로부터 분리되는 것을 억제한다. 따라서 리드 연결부재(30)는 리드(20a)가 몰드부(80)에서 분리되는 것을 방지하는 기능도 제공할 수 있다.The protruding portion serves as a protrusion in the mold portion 80 to prevent the leads 20a embedded in the mold portion 80 from being separated from the mold portion 80. [ Therefore, the lead connecting member 30 can also provide a function of preventing the lead 20a from being separated from the mold portion 80. [

한편 본 발명에 따른 반도체 패키지는 전술한 실시예에 한정되지 않으며 다양한 응용이 가능하다. Meanwhile, the semiconductor package according to the present invention is not limited to the above-described embodiments, and various applications are possible.

도 6은 본 발명의 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도이고, 도 7은 도 6의 분해 사시도이다. FIG. 6 is a perspective view schematically showing a lead connecting member and a lead connecting member according to another embodiment of the present invention, and FIG. 7 is an exploded perspective view of FIG.

도 6 및 도 7을 참조하면, 본 실시예에 따른 리드 연결부재(30)의 결합부(32)는 리드(20a)의 관통 구멍(21)에 삽입되는 삽입부(32a)와, 관통 구멍(21)의 외부에 배치되는 확장부(32b)를 포함할 수 있다. 6 and 7, the engaging portion 32 of the lead connecting member 30 according to the present embodiment includes an insertion portion 32a to be inserted into the through hole 21 of the lead 20a, And an extension portion 32b disposed outside of the base portion 21a.

삽입부(32a)와 확장부(32b)는 서로 다른 단면적을 갖는다. 구체적으로, 확장부(32b)는 삽입부(32a)에 비해 단면적이 확장되는 형태로 형성될 수 있다. 또한 관통 구멍(21)은 삽입부(32a)의 단면적에 대응하는 크기와 형상으로 형성될 수 있다.The insertion portion 32a and the extension portion 32b have different cross-sectional areas. Specifically, the extension 32b may be formed to have a cross-sectional area that is larger than that of the insertion portion 32a. The through hole 21 may be formed in a size and shape corresponding to the cross-sectional area of the insertion portion 32a.

이에 따라, 리드 연결부재(30)가 리드(20a)에 결합되면, 도 7에 도시된 바와 같이 관통 구멍(21)에는 삽입부(32a)만이 삽입되며 확장부(32b)는 관통 구멍(21)의 입구에 걸리는 형태로 결합된다. 7, only the inserting portion 32a is inserted into the through hole 21 and the extending portion 32b is inserted into the through hole 21 when the lead connecting member 30 is coupled to the lead 20a. As shown in FIG.

이처럼 결합부(32)가 확장부(32b)를 구비하는 경우, 리드 연결부재(30)의 연결부(35)와 리드들(20a) 사이의 간격을 용이하게 이격시킬 수 있다. 따라서 연결부(35)와 다른 리드들(20a) 간에 접촉이 발생하는 것을 방지할 수 있다. When the engaging portion 32 includes the extended portion 32b, the distance between the connecting portion 35 of the lead connecting member 30 and the leads 20a can be easily separated. Therefore, it is possible to prevent the contact between the connection portion 35 and the other leads 20a from occurring.

또한, 본 실시예에 따른 리드 연결부재(30)는 삽입부(32a)가 판 형상으로 형성된다. 따라서 관통 구멍(21)은 판 형상의 삽입부(32a)가 삽입될 수 있도록 슬릿 형상으로 형성된다.In addition, the lead connecting member 30 according to the present embodiment has the insertion portion 32a formed in a plate shape. Therefore, the through hole 21 is formed in a slit shape so that the plate-like insertion portion 32a can be inserted.

이러한 경우, 리드(20a) 내에 형성되는 관통 구멍(21)의 폭을 최소화할 수 있으므로, 리드(20a)의 폭 또한 최소화할 수 있다는 이점이 있다.
In this case, since the width of the through hole 21 formed in the lead 20a can be minimized, the width of the lead 20a can be minimized.

도 8은 본 발명의 또 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도이고, 도 9는 도 8의 분해 사시도이다.FIG. 8 is a perspective view schematically showing a lead connecting member and a lead connecting member according to still another embodiment of the present invention, and FIG. 9 is an exploded perspective view of FIG.

도 8 및 도 9를 참조하면, 본 실시예에 따른 리드 연결부재(30)는 하나의 리드(20a)에 결합된다. Referring to Figs. 8 and 9, the lead connecting member 30 according to the present embodiment is coupled to one lead 20a.

따라서 하나의 리드(20a)에는 리드 연결부재(30)의 결합부(32)가 결합되기 위한 관통 구멍(21)이 다수 개 형성될 수 있다. 본 실시예에서 리드 연결부재(30)는 전술한 리드 연결부재(30)들과 동일하게 구성될 수 있다. Therefore, a plurality of through holes 21 may be formed in one lead 20a for coupling the engaging portion 32 of the lead connecting member 30 to each other. In this embodiment, the lead connecting member 30 may be configured the same as the lead connecting members 30 described above.

이처럼 하나의 리드 연결부재(30)를 하나의 리드(20a)에만 결합하는 경우, 리드들(20a)을 서로 전기적으로 연결하는 기능은 수행할 수 없으나, 리드 연결부재(30)에 의해, 리드(20a)가 몰드부에서 분리되는 것을 억제한다.When the one lead connecting member 30 is coupled to only one lead 20a, the function of electrically connecting the leads 20a to each other can not be performed. However, 20a from separating from the mold part.

즉 본 실시예의 경우, 리드들(20a) 상호간에 전기적으로 연결할 필요가 없는 반도체 패키지(100)에서 리드들(20a)이 몰드부에서 분리되는 것을 방지하기 위해 적용될 수 있다.  That is, in the case of this embodiment, it can be applied to prevent the leads 20a from being separated from the mold part in the semiconductor package 100 which need not be electrically connected to each other.

이러한 경우, 리드 연결부재(30)가 도전성 재질로 한정될 필요는 없다. 즉, 수지 등 절연성 재질로 형성되는 것도 가능하다.
In this case, the lead connecting member 30 need not be limited to a conductive material. That is, it may be formed of an insulating material such as a resin.

도 10은 본 발명의 또 다른 실시예에 따른 리드 연결부재와 리드 프레임을 개략적으로 도시한 사시도이고, 도 11은 도 10의 분해 사시도이다.FIG. 10 is a perspective view schematically illustrating a lead connecting member and a lead connecting member according to still another embodiment of the present invention, and FIG. 11 is an exploded perspective view of FIG.

도 10 및 도 11을 참조하면, 본 실시예에 따른 리드 연결부재(30)는 네 개의 결합부(32)를 포함한다. Referring to Figs. 10 and 11, the lead connecting member 30 according to the present embodiment includes four engaging portions 32. As shown in Fig.

이처럼 리드(20a) 연결 부재가 다수의 결합부(32)를 갖는 경우, 리드 연결부재(30)는 세 개 이상의 리드들(20a)을 동시에 전기적으로 연결할 수 있다. When the lead 20a connecting member has a plurality of engaging portions 32, the lead connecting member 30 can electrically connect three or more leads 20a at the same time.

또한 이러한 경우, 필요에 따라 다수의 결합부(32)가 하나의 리드(20a)에 결합되거나, 각각 다른 리드들(20a)에 결합될 수 있다. 그러나 본 발명의 구성이 이에 한정되는 것은 아니며, 필요에 따라 다양한 형태로 변형될 수 있다.
Also, in this case, a plurality of coupling portions 32 may be coupled to one lead 20a or may be coupled to another lead 20a, respectively, if necessary. However, the present invention is not limited thereto, and may be modified into various forms as needed.

한편, 이상에서 본 발명의 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고, 청구범위에 기재된 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 다양한 수정 및 변형이 가능하다는 것은 당 기술분야의 통상의 지식을 가진 자에게는 자명할 것이다.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims. And will be apparent to those skilled in the art.

100: 반도체 패키지
10: 전자 소자
12: 전력 소자 14: 제어 소자
20: 리드 프레임
20a: 내부 리드 20b: 외부 리드
21: 관통 구멍
22: 다이 패드
30: 리드 연결부재
32: 결합부
35a: 삽입부 32b: 확장부
35: 연결부
80: 몰드부
90: 본딩 와이어100: semiconductor package
10: Electronic device
12: Power device 14: Control device
20: Lead frame
20a: inner lead 20b: outer lead
21: Through hole
22: die pad
30: lead connecting member
32:
35a: Insertion part 32b: Extension part
35: Connection
80: Mold part
90: Bonding wire

Claims (13)

적어도 하나의 전자 소자;
상기 전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임;
적어도 하나의 상기 리드에 결합되는 리드 연결부재; 및
상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부;
를 포함하는 반도체 패키지.
At least one electronic device;
A lead frame having a plurality of leads to which the electronic device is electrically connected;
A lead connecting member coupled to at least one of the leads; And
A mold part for sealing the electronic element and the lead connecting member;
≪ / RTI >
제1항에 있어서, 상기 리드 연결부재는,
ㄷ 형상으로 형성되는 반도체 패키지.
The connector according to claim 1, wherein the lead connecting member comprises:
Shaped semiconductor package.
제1항에 있어서, 상기 리드 연결부재는,
상기 리드들에 결합되는 다수의 결합부; 및
상기 다수의 결합부들을 상호 연결하는 연결부;
를 포함하는 반도체 패키지.
The connector according to claim 1, wherein the lead connecting member comprises:
A plurality of engaging portions coupled to the leads; And
A connecting portion interconnecting the plurality of engaging portions;
≪ / RTI >
제3항에 있어서, 상기 리드 연결부재의 상기 결합부는,
상기 리드에 형성된 관통 구멍에 삽입되는 삽입부; 및
상기 관통 구멍의 외부에 배치되며 상기 삽입부보다 단면적이 크게 형성되는 는 확장부;
를 포함하는 반도체 패키지.
The connector according to claim 3, wherein the engaging portion of the lead connecting member comprises:
An insertion portion inserted into the through hole formed in the lead; And
An extension disposed outside the through-hole and having a cross-sectional area larger than that of the insertion portion;
≪ / RTI >
제1항에 있어서,
하나의 상기 리드 연결부재는 하나의 상기 리드에 결합되는 반도체 패키지.
The method according to claim 1,
And one of the lead connecting members is coupled to one of the leads.
제1항에 있어서,
하나의 상기 리드 연결부재는, 다수의 상기 리드에 결합되는 반도체 패키지.
The method according to claim 1,
And one of said lead connecting members is coupled to a plurality of said leads.
제1항에 있어서, 상기 리드 연결부재는,
도전성의 금속 재질로 형성되는 반도체 패키지.
The connector according to claim 1, wherein the lead connecting member comprises:
A semiconductor package formed of a conductive metal material.
제1항에 있어서, 상기 리드는,
상기 리드 연결부재가 결합되는 적어도 하나의 관통 구멍을 구비하는 반도체 패키지.
2. The apparatus of claim 1,
And at least one through hole through which the lead connecting member is coupled.
제8항에 있어서, 상기 관통 구멍은,
원통 형태로 형성되는 반도체 패키지.
9. The connector according to claim 8, wherein the through-
A semiconductor package formed in a cylindrical shape.
제8항에 있어서, 상기 관통 구멍은,
슬릿 형태로 형성되는 반도체 패키지.
9. The connector according to claim 8, wherein the through-
And is formed in a slit shape.
제1항에 있어서, 상기 리드 프레임은,
상기 몰드부 내에 배치되는 내부 리드와, 상기 몰드부의 외부에 배치되는 외부 리드를 포함하며,
상기 리드 연결부재는 상기 내부 리드에 결합되는 반도체 패키지.
The light emitting device according to claim 1,
An inner lead disposed in the mold portion, and an outer lead disposed outside the mold portion,
And the lead connecting member is coupled to the inner lead.
전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임;
적어도 하나의 상기 리드에 결합되어 상기 리드의 돌기를 형성하는 리드 연결부재; 및
상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부; 및
를 포함하는 반도체 패키지.
.A lead frame having a plurality of leads to which electronic elements are electrically connected;
A lead connecting member coupled to at least one of the leads to form a protrusion of the lead; And
A mold part for sealing the electronic element and the lead connecting member; And
≪ / RTI >
. 전자 소자가 전기적으로 연결되는 다수의 리드를 구비하는 리드 프레임;
다수의 상기 리드에 결합되어 상기 리드들을 전기적으로 연결하는 리드 연결부재; 및
상기 전자 소자와 상기 리드 연결부재를 봉지하는 몰드부; 및
를 포함하는 반도체 패키지.A lead frame having a plurality of leads to which electronic elements are electrically connected;
A lead connecting member coupled to the plurality of leads to electrically connect the leads; And
A mold part for sealing the electronic element and the lead connecting member; And
≪ / RTI >
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