KR970002250Y1 - A solder leveler - Google Patents
A solder leveler Download PDFInfo
- Publication number
- KR970002250Y1 KR970002250Y1 KR2019900010089U KR900010089U KR970002250Y1 KR 970002250 Y1 KR970002250 Y1 KR 970002250Y1 KR 2019900010089 U KR2019900010089 U KR 2019900010089U KR 900010089 U KR900010089 U KR 900010089U KR 970002250 Y1 KR970002250 Y1 KR 970002250Y1
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- South Korea
- Prior art keywords
- left rack
- rack
- gear
- guide
- motor
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
- B65G49/04—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
- B65G49/0409—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
내용없음No content
Description
제1도는 본 고안에 따른 납땜수준측정자의 사시도.1 is a perspective view of a soldering level gauge according to the present invention.
제2a도는 납땜 수준 측정자의 지그의 분해도.Figure 2a is an exploded view of the jig of the soldering level gauge.
제2b도는 납땜 수준 측정자의 지그이 사시도.Figure 2b is a perspective view of the jig of the soldering level gauge.
제3a도는 납땜 수준 측정자의 공압로드의 사시도.3A is a perspective view of a pneumatic rod of a soldering level meter.
제3b도는 납땜 수준 측정자의 공압로드의 단면도.3b is a sectional view of a pneumatic rod of a soldering level meter.
제4도는 납땜 수준 측정자의 공압로드의 다른 단면도.4 is another cross-sectional view of the pneumatic rod of the soldering level meter.
제5도는 납땜 수준 측정자의 상승된 장치의 구조도.5 is a schematic diagram of an elevated device of a soldering level meter.
제6도는 납땜 수준 측정자의 원리도.6 is a principle diagram of the soldering level gauge.
제7도는 납땜 수준 측정자의 원리도7 is a principle diagram of the soldering level gauge
제8도는 납땜 수준 측정자의 원리도.8 is a principle diagram of a soldering level gauge.
제9도는 종래의 납땜 수준 측정자의 구조도.9 is a structural diagram of a conventional soldering level gauge.
제10도는 프린트회로 기판이 종래의 납땜 수준 측정자의 클램핑 유닛에 수동의 공급되는 것을 나타내는 공정도.10 is a process diagram showing that a printed circuit board is manually supplied to a clamping unit of a conventional solder level meter.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols on main parts of drawing
1 : 납땜 수준 측정자 조립체 2 : 공압로드1: soldering level meter assembly 2: pneumatic rod
3 : 콘베이어 벨트 4 : 지그3: conveyor belt 4: jig
5 : 상승장치 7 : 해제수단5: ascending device 7: release means
11 : 콘테이너 12 : 브로잉 수단11: container 12: blowing means
13 : 각프레임13: each frame
본 고안은 납땜 수준 측정자에 관한 것이다.The present invention relates to a solder level meter.
종래의 납땜 수준측정자는 수작업에 의해 클램프상에 프린트회로 기판을 고정해야만 했으므로, 노동력과 시간을 많이 소비하였다(제9도 및 제10도).Conventional solder levelers have had to manually fix the printed circuit board on the clamp, thus consuming much labor and time (FIGS. 9 and 10).
그러므로, 본 고안은 상술한 결점을 제거한 자동 납땜 수준 측정자를 제공하는 것으로서, 본 고안의 주목적은 납땜 작업중 프린트회로 기판의 수동작업을 요하지 않는 완전자동의 납땜 수준 측정자를 제공하는 것이다.Therefore, the present invention provides an automatic soldering level meter which eliminates the above-mentioned drawbacks. The main purpose of the present invention is to provide a fully automatic soldering level meter which does not require manual operation of a printed circuit board during soldering.
본 고안의 다른 목적은 구조가 단단한 납땜 수준 측정자를 제공하는 것이다.Another object of the present invention is to provide a soldering level gauge having a rigid structure.
본 고안의 또 다른 목적은 저렴하게 제조할 수 있는 납땜 수준 측정자를 제공하는 것이다.Yet another object of the present invention is to provide a soldering level meter which can be manufactured at low cost.
본 고안의 다른 목적 및 이점은 도면과 연관한 이하의 바람직한 실시예에 대한 설명으로부터 충분히 이해할 수 있을 것이다.Other objects and advantages of the present invention will be fully understood from the following description of the preferred embodiments in conjunction with the drawings.
제1도에 있어서, 본 고안에 따른 아연도금 홈통의 납땜 수준 측정자 조립체(1), 두 개의 공압로드(2), 두 개의 콘베이어벨트(3), 지그(4), 두 개의 상승장치(5) 및 두 개의 해제수단(7)으로 이루어진다. 납땜 수준 측정자 조립체(1)는 콘테이너(11), 두 개의 브로잉 수단(12) 및 두 개의 각 프레임(13)으로 구성된다. 콘테이너(11)는 직사각형 케이스로서, 내열재로 만들며 상부가 개방되어, 고열의 용융 납땜을 수용한다.In FIG. 1, a soldering level gauge assembly 1, two pneumatic rods 2, two conveyor belts 3, a jig 4, two lifting devices 5 of a galvanized trough according to the present invention And two release means (7). The solder level meter assembly 1 consists of a container 11, two blowing means 12 and two respective frames 13. The container 11 is a rectangular case, which is made of a heat resistant material and has an open upper portion to accommodate high heat fusion soldering.
두 개의 브로잉 수단(12)은 콘테이너(11)의 상부위의 반대쪽으로 배열되어, 브로잉수단(12)은, 콘테이너(11)에서 상승된 경우 트린트회로기판(6)에 부착된 초과주석을 불어버린다.The two blowing means 12 are arranged on the opposite side of the top of the container 11 so that the blowing means 12 are overtin attached to the printed circuit board 6 when raised from the container 11. Blows out.
두 개의 각 프레임(13)은 공압로드(2)를 지지하기 위해 콘테이너(11)의 한쪽에서 각각 장착된다.Two respective frames 13 are each mounted on one side of the container 11 to support the pneumatic rod 2.
공압로드(2)는 각 프레임(13)상에 견고히 부착된 세장케이스를 포함하고, 그 케이스 내부에는 수평 공압실린더(22), 수평공압실린더(22)와 결합된 슬라이딩 부재(25), 조화해서 움직이도록 슬라이딩 부재(25)에 장착된 4개의 하방이동 공압실린더(23) 및 고정위치된 4개의 상방이동 공압 실린더(24)를 장착한다.The pneumatic rod 2 includes an elongated case firmly attached to each frame 13, in which the horizontal pneumatic cylinder 22, the sliding member 25 coupled with the horizontal pneumatic cylinder 22, in harmony Four downwardly moving pneumatic cylinders 23 mounted to the sliding member 25 and four upwardly moving pneumatic cylinders 24 fixedly mounted are mounted.
지그(4)는 축(41) 및 4개의 아암(42)을 각각 가지는 4개의 클램핑유닛, 4개의 저단클램프(43) 및 4개의 상단 클램프(44)로 구성된다. 축(44)은 횡단면이 장방형이고, 체인이동블록(410)과 해제수단(7)을 결합하기 위해 양단에서 둥글게 되어 있다. 4개의 아암(42)을 축(41)의 일면에서 일체로 또는 기하의 형태로 형성되고, 양단의 중간에 돌기(421)가 제공되고, 핀(423)을 접속하기 위한 외단엣지 근처에서 구멍(422)이 제공된다. 저단클램프(43)는 아암(42)의 돌기(421)를 수용하기에 적합한 리세스부(431)가 제공된 세장판으로 볼트(432)가 상부에 수직으로 장착되고, 위치핀(433)이 상부에 수직으로 장착되고, 돌출부(434)는 하방이동 공압 실린더(23)의 슬롯(230)과 결합된다. 또한 상단 클램프(44)는 저단 클램프(43)와 유사한 세광부재로서, 아암(42)의 돌기(421), 저단 클램프(43)의 제1볼트(432)의 통로를 위한 제1구멍(442), 위치핀(433)의 통로를 위한 제2구멍(443) 및 상방이동 공압 실린더(24)위에 위치된 돌출부(444)를 수용하기에 적합한 리세스부(441)가 제공된다. 저단 클램프(43)의 제1볼트(432)는 상단 클램프(44)의 상단면과 너트(446)사이의 스프링과 너트(446)를 결합하여, 지그(4)가 클램핑기능을 하게 한다. 위치된(443)은 프린트회로기판(6)이 지나치게 지그(4)로 치우치는 것을 방지하도록 고안된다.The jig 4 is composed of four clamping units, four low end clamps 43 and four top clamps 44 each having a shaft 41 and four arms 42. The shaft 44 is rectangular in cross section and is rounded at both ends to engage the chain moving block 410 and the release means 7. Four arms 42 are formed integrally or geometrically on one side of the shaft 41, and projections 421 are provided in the middle of both ends, and a hole (near the outer edge for connecting the pin 423) 422 is provided. The low end clamp 43 is an elongated plate provided with a recess 431 suitable for accommodating the protrusion 421 of the arm 42. The bolt 432 is vertically mounted on the upper portion thereof, and the positioning pin 433 is disposed on the upper portion thereof. Mounted perpendicularly to the projection 434 is coupled to the slot 230 of the downwardly moving pneumatic cylinder (23). In addition, the upper clamp 44 is a light-lighting member similar to the lower clamp 43, the first hole 442 for the passage of the protrusion 421 of the arm 42, the first bolt 432 of the lower clamp 43 There is provided a recess 441 suitable for receiving a second hole 443 for the passage of the positioning pin 433 and a projection 444 positioned over the upwardly moving pneumatic cylinder 24. The first bolt 432 of the lower clamp 43 is coupled to the spring and the nut 446 between the upper surface of the upper clamp 44 and the nut 446, so that the jig 4 has a clamping function. The positioned 443 is designed to prevent the printed circuit board 6 from excessively biasing the jig 4.
상승장치(5)는 주로 좌측랙(51), 우측랙(52) 및 전달수단(53)으로 구성된다. 좌측랙(51)은 아연도금홈통조립체(11)의 좌측에 수직으로 장착되고, 상부에 종방향홈(511)을 가지며, 그 내면에 두 개의 가이드(512)를 가진다. 지그(4)의 체인 이동블록(410)은 가이드(512)상에 장착된다. 슬라이딩가이드(513)는 좌측랙(51)의 양쪽에 배열되어, 브래킷(514)은 그것을 따라 이동한다. 모우터(515)는 지그(4)의 축(41)과 접속된 그 굴대를 구비한 브래킷(514)에 장착된다.The lifting device 5 mainly consists of a left rack 51, a right rack 52 and a transmission means 53. The left rack 51 is mounted vertically on the left side of the galvanized gutter assembly 11, has a longitudinal groove 511 on the top, and has two guides 512 on its inner surface. The chain moving block 410 of the jig 4 is mounted on the guide 512. Sliding guide 513 is arranged on both sides of the left rack 51, the bracket 514 moves along it. The motor 515 is mounted to a bracket 514 with its mandrel connected to the shaft 41 of the jig 4.
제2브래킷(516)은 제2모우터(517)를 고정하는 좌측랙(51)의 상부에 끼워진다. 우측랙(52)은 지그(4)의 체인이동블록(410)을 결합하기위한 두 개의 가이드(520)가 제공된다. 전달 메카니즘(53)은 좌측랙(52)과 우측랙(53)의 상부에 두 개의 상단기어(532)를 접속하는 축(531)을 포함한다. 저단기어(533)는 좌측 및 우측랙(52)의 저단부에 배치된다. 체인(534)은 상단 및 저단기어(532),(533)와 결합해서, 지그(4)는 상하로 움직인다.The second bracket 516 is fitted to an upper portion of the left rack 51 that fixes the second motor 517. The right rack 52 is provided with two guides 520 for coupling the chain moving block 410 of the jig (4). The transmission mechanism 53 includes a shaft 531 which connects two upper gears 532 to the upper side of the left rack 52 and the right rack 53. The low gear 533 is disposed at the lower ends of the left and right racks 52. The chain 534 is engaged with the upper and lower gears 532 and 533 so that the jig 4 moves up and down.
작동시, 우선 수평 공압실린더(22)는 하방이동 공압실린더(23)를 움직여서, 후라의 리세스부(230)와 지그(4)의 저단클램프의 돌출부(434)와 결합한다. 그후, 상방이동 공압실린더(24)는 상단 클램프(44)를 올리도록 작용하는 반면, 하방이동 공압실린더(23)는 저단클램프(43)를 압압하여 지그(4)를 개방한다. 그러므로, 아연도금 프린트회로 기판(6)은 좌측 콘베이어 밸트(3)에 의해 해제되고 멀리 이동하고 우측콘베이어 밸트(4)는 아연도금되지 않은 프린트회로 기판을 지그(4)로 공급한다(제6도). 그후, 하방 및 상방 이동 공압실린더(23),(24)는 상단 및 하단 클램프(44),(43)를 프린트회로기판(6)에 클램프하는 위치로 돌아가고, 상승장치(5)가 프린트회로기판(6)과 함께 지그(4)를 상승하도록 구동된다. 지그(4)가 상방으로 상승되면, 브로잉 수단(12)은 저단위치에서 클램핑 유닛에 의해 클램프된 프린트회로기판(6)상의 초과납땜을 붙어 버린다(제7도). 지그(4)가 소정위치로 상승되면, 해제수단(7)은 90°정도 지그(4)를 회전하여, 납땜되지 않은 프린트회로기판(6)을 저단위치로 이동하고, 아연도금 프린트회로 기판(6)을 수평위치에서 이동한다.In operation, the horizontal pneumatic cylinder 22 first moves the downwardly moving pneumatic cylinder 23 to engage with the recessed portion 230 of the fryer and the projection 434 of the low end clamp of the jig 4. Then, the upwardly moving pneumatic cylinder 24 acts to raise the upper clamp 44, while the downwardly moving pneumatic cylinder 23 presses the low stage clamp 43 to open the jig 4. Therefore, the galvanized printed circuit board 6 is released by the left conveyor belt 3 and moves away and the right conveyor belt 4 supplies the non-galvanized printed circuit board to the jig 4 (Fig. 6). ). Thereafter, the downward and upward moving pneumatic cylinders 23 and 24 return to the positions at which the upper and lower clamps 44 and 43 are clamped to the printed circuit board 6, and the lifting device 5 is connected to the printed circuit board. It is driven to raise the jig 4 together with (6). When the jig 4 is raised upward, the blowing means 12 sticks excess solder on the printed circuit board 6 clamped by the clamping unit at the low end position (Fig. 7). When the jig 4 is raised to a predetermined position, the releasing means 7 rotates the jig 4 by about 90 ° to move the unsoldered printed circuit board 6 to the low end position, and the galvanized printed circuit board ( Move 6) in the horizontal position.
결국, 상승장치(5)는 지그(4)를 아래로 움직여서, 납땜되지 않은 프린트회로기판(6)은 납땜을 위해 콘테이너(11)로 낮아진다(제8도).As a result, the raising device 5 moves the jig 4 downward, so that the unsolded printed circuit board 6 is lowered into the container 11 for soldering (Fig. 8).
본 고안을 특정해서 설명했다 하더라도, 본 명세서의 기재는 단지 예에 불과한 것이고, 구조상 여러변경을 할 수 있고 부품의 배열과 조합은 후술하는 청구범위의 요지에서 벗어남이 없이 될 수 있을 것이다.Although the present invention has been described in detail, the description herein is merely an example, and various modifications may be made in structure and arrangements and combinations of parts may be made without departing from the spirit of the following claims.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900010089U KR970002250Y1 (en) | 1990-07-10 | 1990-07-10 | A solder leveler |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900010089U KR970002250Y1 (en) | 1990-07-10 | 1990-07-10 | A solder leveler |
Publications (2)
Publication Number | Publication Date |
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KR920003055U KR920003055U (en) | 1992-02-25 |
KR970002250Y1 true KR970002250Y1 (en) | 1997-03-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019900010089U KR970002250Y1 (en) | 1990-07-10 | 1990-07-10 | A solder leveler |
Country Status (1)
Country | Link |
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KR (1) | KR970002250Y1 (en) |
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1990
- 1990-07-10 KR KR2019900010089U patent/KR970002250Y1/en active IP Right Grant
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Publication number | Publication date |
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KR920003055U (en) | 1992-02-25 |
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