JPS6121172Y2 - - Google Patents
Info
- Publication number
- JPS6121172Y2 JPS6121172Y2 JP19866782U JP19866782U JPS6121172Y2 JP S6121172 Y2 JPS6121172 Y2 JP S6121172Y2 JP 19866782 U JP19866782 U JP 19866782U JP 19866782 U JP19866782 U JP 19866782U JP S6121172 Y2 JPS6121172 Y2 JP S6121172Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- solder
- molten solder
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 238000005476 soldering Methods 0.000 claims description 18
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
〔考案の技術分野〕
本考案は、上下動式はんだ付け装置に関するも
のである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a vertically moving soldering device.
一般的に、はんだ付けラインの搬送ホルダの左
右側部の爪によつてプリント基板の左右両側部を
支持してはんだ付け装置上を移動すると、プリン
ト基板は、自重によつて中央部が下方に彎曲し、
溶融はんだがプリント基板の上面にまで侵入する
おそれがある。
Generally, when a printed circuit board is moved on a soldering machine with the right and left sides of the printed circuit board supported by the left and right claws of the transport holder on a soldering line, the center part of the printed circuit board moves downward due to its own weight. curved,
There is a risk that molten solder will penetrate to the top surface of the printed circuit board.
従来は、上記プリント基板の中央部に小孔を穿
設し、この小孔にホルダに設けた吊上げ棒の下端
を係合するか、または上記ホルダの前後端部に設
けた吊上げ棒をプリント基板の前後端部に係合
し、この吊上げ棒によつてプリント基板の中央部
が下方に彎曲しないように吊上げている。 Conventionally, a small hole is drilled in the center of the printed circuit board, and the lower end of a lifting rod provided on the holder is engaged with this small hole, or the lifting rods provided at the front and rear ends of the holder are connected to the printed circuit board. The lifting rods are used to lift the central part of the printed circuit board to prevent it from curving downward.
ところが上記吊上げ棒には、プリント基板との
係合を手作業によつて行うわずらわしさが伴い、
その改良が望まれている。 However, the above-mentioned lifting rod involves the trouble of having to manually engage it with the printed circuit board.
Improvements are desired.
また噴流式はんだ付け装置においては、実開昭
56−152161号公報に示されるように溶融はんだの
噴流口に反り防止板を設け、この反り防止板の上
縁部でプリント基板の彎曲を矯正するようにして
いる。 In addition, in the case of jet soldering equipment,
As shown in Japanese Patent No. 56-152161, a warpage prevention plate is provided at the molten solder jet port, and the upper edge of this warpage prevention plate corrects the curvature of the printed circuit board.
しかしこの反り防止板は噴流はんだの上端レベ
ルを貫通しているため、はんだの表面張力作用に
より反り防止板とプリント基板との接触部にはん
だが入りこまず、この反り防止板部分においてプ
リント基板に噴流はんだが附着しないおそれがあ
る。 However, since this anti-warp plate passes through the upper end level of the jet solder, the surface tension of the solder prevents the solder from entering the contact area between the anti-warp plate and the printed circuit board. There is a risk that the jet solder may not adhere.
本考案は、はんだ付け装置の側の改良すること
により、プリント基板の中央部の自重による彎曲
を矯正し、プリント基板の上面に溶融はんだが侵
入するおそれを防止し、かつ前記彎曲を矯正する
部材によつてはんだ付けに支障が起きないように
するものである。
The present invention corrects the curvature of the central part of the printed circuit board due to its own weight by improving the soldering device, prevents the risk of molten solder entering the top surface of the printed circuit board, and provides a member for correcting the curvature. This is to ensure that soldering is not hindered by this.
本考案の上下動式はんだ付け装置は、はんだ槽
とプリント基板とを相対的に上下動するとともに
はんだ槽に対しプリント基板を搬送してプリント
基板の下面にはんだ槽内の溶融はんだをはんだ付
けするはんだ付け装置において、上記はんだ槽の
プリント基板搬入側からプリント基板搬出側にわ
たつて長尺支持部材を設け、この長尺支持部材の
搬入側部および搬出側部にはんだ槽内の溶融はん
だ中に比較的深く浸漬される逃げ部を形成すると
ともに、上記長尺支持部材の中央部に上記溶融は
んだのはんだ面の近傍レベルまで突出され溶融は
んだに接触するプリント基板の下面を支持する押
上げ部を形成したことを特徴とする構成であり、
そうして、上記はんだ槽に搬入されたプリント基
板のほぼ中央部を上記長尺支持部材の押上げ部に
よつて押上げ、このプリント基板が全面にわたつ
てフラツトとなるように矯正するものである。
The vertically moving soldering device of the present invention moves the solder bath and the printed circuit board up and down relative to each other, conveys the printed circuit board to the solder bath, and solders the molten solder in the solder bath to the bottom surface of the printed circuit board. In the soldering apparatus, an elongated support member is provided from the printed circuit board input side to the printed circuit board output side of the solder bath, and the molten solder in the solder bath is provided on the input side and the output side of the elongated support member. In addition to forming a relief part that is immersed relatively deeply, a push-up part is provided in the center of the elongated support member to support the lower surface of the printed circuit board that protrudes to a level near the solder surface of the molten solder and comes into contact with the molten solder. It is a configuration characterized by the formation of
Then, the approximately central part of the printed circuit board carried into the solder bath is pushed up by the pushing up part of the long support member, and the printed circuit board is straightened so that it becomes flat over the entire surface. be.
以下、本考案を図面に示す実施例を参照して詳
細に説明する。
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
第１図に示すように、支台（図示せず）によつ
てはんだ槽１を固定支持し、このはんだ槽１の前
後左右部の４個所に位置する筒状ガイド２を上記
支台に固着する。またこの各ガイド２に上下動棒
３，４を上下動自在に嵌着し、その前方左右の上
下動棒３の上端のＬ字板５にはんだ槽１の上方の
左右両側に位置する可変レール６の前端部を回動
自在かつ水平方向にややスライド可能に軸着する
とともに、下端に前方上下動枠７の左右両端を固
着し、また後方左右の上下動棒４の上端Ｌ字板８
に左右両側の上記可変レール６の後端部を回動自
在に軸着するとともに、下端に後方上下動枠９の
左右両端を固着する。 As shown in FIG. 1, a solder bath 1 is fixedly supported by a support (not shown), and cylindrical guides 2 located at four locations on the front, rear, left, and right sides of the solder bath 1 are fixed to the support. do. In addition, vertically movable rods 3 and 4 are fitted to each guide 2 so as to be vertically movable, and variable rails located on both left and right sides above the solder bath 1 are attached to the L-shaped plate 5 at the upper end of the vertically movable rods 3 on the left and right front sides. 6 is rotatably and slightly slidably pivoted in the horizontal direction, and both left and right ends of the front vertically movable frame 7 are fixed to the lower end, and an L-shaped plate 8 at the upper end of the rear left and right vertically movable rods 4 is attached.
The rear end portions of the variable rails 6 on both the left and right sides are rotatably pivoted, and both left and right ends of the rear vertically movable frame 9 are fixed to the lower end.
上記両側の可変レール６が最上昇した状態でこ
の両側の可変レール６の前端部および後端部に連
続的に接続する前方固定レール１０と後方固定レ
ール１１とを固定的に配設する。 A front fixed rail 10 and a rear fixed rail 11 are fixedly provided, which are continuously connected to the front and rear ends of the variable rails 6 on both sides when the variable rails 6 on both sides are raised to the highest level.
上記前方上下動枠７の中央下側に一対のカムフ
オロア１２を回動自在に軸着し、このカムフオロ
ア１２の下面に前方カム体１３の外周面を当接係
合する。また上記後方上下動枠９の中央下側に一
対のカムフオロア１４を回動自在に軸着し、この
カムフオロア１４の下面に後方カム体１５の外周
面を当接係合する。上記前方カム体１３および後
方カム体１５はそれぞれ回転軸１６に一体に嵌着
されていて、減速機構（図示せず）などを介して
電動モータ１７によつて同時に回動される。 A pair of cam followers 12 are rotatably attached to the lower center of the front vertically moving frame 7, and the outer circumferential surface of the front cam body 13 is abutted and engaged with the lower surface of the cam followers 12. Further, a pair of cam followers 14 are rotatably pivoted to the lower center of the rear vertically moving frame 9, and the outer circumferential surface of the rear cam body 15 is abutted and engaged with the lower surface of the cam followers 14. The front cam body 13 and the rear cam body 15 are each integrally fitted onto a rotating shaft 16, and are simultaneously rotated by an electric motor 17 via a speed reduction mechanism (not shown) or the like.
また一側のレール１１，６，１０に沿つて搬送
機構の無端チエン２１を配設し、この一側の無端
チエン２１から上方に突設したピン棒２２に、両
側のレール１１，６，１０で両側の転輪２３が載
支されるホルダ２４の一側連結板２５を上下動自
在に嵌合し、そして上記チエン２１を回行駆動す
ることによつて上記ホルダ２４を強制移動すると
ともに、可変レール６上では、一定の高さの上記
チエン２１およびピン棒２２に対して上記ホルダ
２４を可変レール６とともに上下動できるように
する。さらに上記ホルダ２４から下側に突出した
両側の保持部２６に、前記はんだ槽１中の溶融は
んだＬに対面する被はんだ付け物としてのプリン
ト基板Ｐを着脱自在に装着するようにする。 Also, an endless chain 21 of the conveying mechanism is arranged along the rails 11, 6, 10 on one side, and a pin rod 22 protruding upward from the endless chain 21 on one side is connected to the rails 11, 6, 10 on both sides. The connecting plate 25 on one side of the holder 24 on which the rolling wheels 23 on both sides are supported is fitted so as to be vertically movable, and the holder 24 is forcibly moved by rotating the chain 21. On the variable rail 6, the holder 24 can be moved up and down together with the variable rail 6 relative to the chain 21 and pin rod 22 at a constant height. Furthermore, a printed circuit board P as an object to be soldered, which faces the molten solder L in the solder bath 1, is detachably attached to the holding parts 26 on both sides projecting downward from the holder 24.
また第２図に示すように、上記はんだ槽１のプ
リント基板搬入側の外側面とプリント基板搬出側
の外側面とにそれぞれ取付け棒３１，３２を溶接
等により固定し、この搬入側の取付け棒３１から
搬出側の取付け棒３２にわたつて長尺支持部材と
しての支持棒３３を２本設ける。 Further, as shown in FIG. 2, mounting rods 31 and 32 are fixed by welding or the like to the outer surface of the printed circuit board loading side and the outer surface of the printed circuit board unloading side of the solder bath 1, respectively. Two support rods 33 as elongated support members are provided extending from the attachment rod 32 on the carry-out side.
この各支持棒３３は、両端部に逆Ｕ形の摺動調
整部３４を一体的に設けてなり、この摺動調整部
３４の下側凹溝部３５を上記取付け棒３１，３２
に上方から嵌合してねじ３６により固定する。ま
たこの支持棒３３はステンレスまたはチタン等の
腐蝕に強い材質の丸棒を用いて折曲成形し、両端
部の内側部を下方に折返してはんだ槽１への挿入
部３７を形成し、この挿入部３７に続いて溶融は
んだ中に深く浸漬される逃げ部３８を直線状に形
成し、この逃げ部３８の中央部に、溶融はんだの
はんだ面よりわずかに下側のレベルまで凸状に形
成した押上げ部３９を形成して成るものである。
この２本の支持棒３３は、はんだ付けされるプリ
ント基板のほぼ中央部と一致するように、かつプ
リント基板の下面に設けたチツプ部品やリード線
を避けるように、取付け棒３１，３２に沿つて移
動調整した後に、上記ねじ３６によつて固定す
る。 Each support rod 33 is integrally provided with an inverted U-shaped sliding adjustment portion 34 at both ends, and the lower groove portion 35 of this sliding adjustment portion 34 is connected to the mounting rods 31, 32.
from above and fixed with screws 36. The support rod 33 is formed by bending a round rod made of a corrosion-resistant material such as stainless steel or titanium, and the inside portions of both ends are bent downward to form an insertion portion 37 into the solder bath 1. A relief portion 38 that is deeply immersed in the molten solder is formed in a straight line following the portion 37, and a convex shape is formed in the center of the relief portion 38 to a level slightly below the solder surface of the molten solder. A push-up portion 39 is formed.
These two support rods 33 are placed along the mounting rods 31 and 32 so as to be aligned with the center of the printed circuit board to be soldered and to avoid chip parts and lead wires provided on the bottom surface of the printed circuit board. After adjusting the movement, fix with the screw 36 mentioned above.
次に作用を説明する。 Next, the action will be explained.
回転軸１６を駆動し、前後のカム体１３，１５
を回動させると、前方上下動枠７と後方上下動枠
９とが別個に上下動し、これによつて可変レール
６は上下動するとともに前後方向に傾動変位す
る。この場合の可変レール６の変位態様は前後の
カム体１３，１５の外周カム面により規定され
る。 Drives the rotating shaft 16 and drives the front and rear cam bodies 13, 15.
When rotated, the front vertically movable frame 7 and the rear vertically movable frame 9 move up and down separately, whereby the variable rail 6 moves up and down and is tilted and displaced in the front and rear direction. The displacement mode of the variable rail 6 in this case is defined by the outer peripheral cam surfaces of the front and rear cam bodies 13, 15.
すなわち、無端チエン２１によつて強制移送さ
れてきたホルダ２４が、第３図ａに示すように、
固定レール１１上から可変レール６上に移載され
ると、第３図ｂに示すように、可変レール６の前
端部Ａが速く下降するのに対して、後端部Ｂは遅
く下降するので、ホルダ２４は徐々に下降傾斜し
てプリント基板Ｐは、前端部下面から、はんだ槽
１内のヒータによつて溶融されたはんだＬ面に接
触を開始するとともに、このプリント基板Ｐの前
端部下面を上記支持棒３３の押上げ部３９に係合
してこの基板Ｐの前端部がはんだＬ中に没入しな
いようにし、続いて第３図ｃに示すように、可変
レール６の前後端部Ａ，Ｂは水平状態へと変位
し、第３図ｄに示すように、しばらくの間は水平
状態を保持するから、この間でプリント基板Ｐの
下面は溶融はんだＬ面に接触するとともに、上記
押上げ部３９によつて、自重で下方に彎曲しよう
とするプリント基板Ｐの中央部を上方に押上げ
て、プリント基板Ｐを全体にわたつてフラツトに
矯正し、この基板Ｐに第４図に示すように固定さ
れたチツプ部品ｗや挿着された電子部品のリード
線を基板Ｐの下面にはんだ付けする。なおプリ
ント基板Ｐは一部において前記押上げ部３９と接
触し、そのままでは、はんだ表面張力作用により
プリント基板Ｐと押上げ部３９との間にはんだが
入りこまず、その接触部分においてはんだ付け不
良のおそれがあるが、この押上げ部３９と接触す
る部分も移動することにより第３図ｃ，ｄに示さ
れるように前記逃げ部３８上の溶融はんだＬと接
触するから、前記押上げ部３９によりはんだ付け
不良が生ずることなくプリント基板の全面にわた
つて良好なはんだ付けがなされる。続いて第３図
ｅに示すように、ホルダ２４を徐々に上昇傾斜さ
せてプリント基板Ｐの下面を溶融はんだＬ面から
離脱させ、このときプリント基板Ｐの後端中央部
は、はんだＬ面から離脱するまで、上記支持棒３
３の押上げ部３９によつて下方への彎曲を矯正さ
れ、続いて第３図ｆに示すように、可変レール６
を徐々に水平に戻すとともに固定レール１０，１
１の高さに上昇し、ホルダ２４を可変レール６か
ら固定レール１０上に移載する。以上のプリント
基板Ｐの一連の動作を第４図に示す。 That is, as shown in FIG. 3a, the holder 24 that has been forcibly transferred by the endless chain 21 is
When transferred from the fixed rail 11 to the variable rail 6, as shown in FIG. 3b, the front end A of the variable rail 6 descends quickly, while the rear end B descends slowly. , the holder 24 gradually tilts downward, and the printed circuit board P starts to come into contact with the solder L surface melted by the heater in the solder bath 1 from the lower surface of the front end of the printed circuit board P. is engaged with the push-up portion 39 of the support rod 33 to prevent the front end of the board P from sinking into the solder L, and then, as shown in FIG. 3c, the front and rear ends A of the variable rail 6 are , B are displaced to a horizontal state and remain horizontal for a while as shown in FIG. The central part of the printed circuit board P, which is about to curve downward under its own weight, is pushed upward by the section 39, and the entire printed circuit board P is straightened flat, and the printed circuit board P is flattened as shown in FIG. The lead wires of the chip parts w fixed to and the electronic parts inserted are soldered to the lower surface of the board P. Note that a portion of the printed circuit board P contacts the push-up portion 39, and if it remains as it is, solder will not enter between the printed circuit board P and the push-up portion 39 due to the effect of solder surface tension, resulting in poor soldering at that contact portion. However, as the portion that contacts the push-up portion 39 also moves, it comes into contact with the molten solder L on the relief portion 38 as shown in FIGS. 3c and 3d, so that the push-up portion 39 As a result, good soldering can be performed over the entire surface of the printed circuit board without causing soldering defects. Subsequently, as shown in FIG. 3e, the holder 24 is gradually tilted upward to separate the bottom surface of the printed circuit board P from the molten solder L surface, and at this time, the rear end center of the printed circuit board P is separated from the solder L surface. Hold the support rod 3 until it detaches.
The downward curvature is corrected by the push-up portion 39 of No. 3, and then, as shown in FIG.
While gradually returning the fixed rails 10, 1 to the horizontal position,
1 and transfer the holder 24 from the variable rail 6 to the fixed rail 10. The series of operations of the printed circuit board P described above is shown in FIG.
なお上記支持棒３３の摺動調整部３４は、下側
凹溝部３５を上下方向にずらすことにより上下方
向にも調整することができ、溶融はんだＬのはん
だ面に応じて支持棒３３を上下動調整することも
できる。 The sliding adjustment portion 34 of the support rod 33 can also be adjusted in the vertical direction by shifting the lower groove portion 35 in the vertical direction, and the support rod 33 can be moved up and down according to the solder surface of the molten solder L. It can also be adjusted.
本考案は、はんだ槽１を上下動する上下動式は
んだ付け装置に適用してもよい。 The present invention may be applied to a vertically moving soldering device that moves the solder bath 1 up and down.
本考案によれば、はんだ槽のプリント基板搬入
側からプリント基板搬出側にわたつて長尺支持部
材を設け、この長尺支持部材の搬入側部および搬
出側部にはんだ槽内の溶融はんだ中に比較的深く
浸漬される逃げ部を形成するとともに、上記長尺
支持部材の中央部に上記溶融はんだのはんだ面の
近傍レベルまで突出された溶融はんだに接触する
プリント基板の下面を支持する押上げ部を形成し
たから、この長尺支持部材の押上げ部によつて、
プリント基板において自重により下方に彎曲しや
すい中央部を上方に矯正することができ、プリン
ト基板の上面に溶融はんだが侵入してプリント基
板上の電子部品等を損傷するおそれを防止でき
る。さらに長尺支持部材は押上げ部と逃げ部とか
ら成るので、押上げ部と接触するプリント基板部
分も移動することにより逃げ部上の溶融はんだ面
と確実に接触し、押上げ部によりはんだ付け不良
が生ずることなくプリント基板の全面にわたつて
良好なはんだ付けがなされる。
According to the present invention, a long support member is provided from the printed circuit board input side to the printed circuit board output side of the solder bath, and the molten solder in the solder bath is placed on the input side and the output side of the long support member. a push-up part that forms a relief part that is immersed relatively deeply, and that supports the lower surface of the printed circuit board that comes into contact with the molten solder that protrudes from the center of the elongated support member to a level near the solder surface of the molten solder; Since this is formed, by the push-up part of this elongated support member,
The center portion of the printed circuit board, which tends to curve downward due to its own weight, can be straightened upward, and it is possible to prevent molten solder from entering the upper surface of the printed circuit board and damaging electronic components, etc. on the printed circuit board. Furthermore, since the elongated support member consists of a push-up part and a relief part, the part of the printed circuit board that comes into contact with the push-up part also moves to ensure that it comes into contact with the molten solder surface on the relief part, and the push-up part allows soldering. Good soldering can be performed over the entire surface of the printed circuit board without causing any defects.
第１図は本考案の上下動式はんだ付け装置の一
実施例を示す斜視図、第２図はそのはんだ槽の斜
視図、第３図はそのはんだ付け作用を説明にした
がつて示す断面図、第４図はそのはんだ付け作用
を連続的に示す断面図である。
１……はんだ槽、３３……長尺支持部材として
の支持棒、３８……逃げ部、３９……押上げ部、
Ｐ……プリント基板、Ｌ……溶融はんだ。
Fig. 1 is a perspective view showing an embodiment of the vertically movable soldering device of the present invention, Fig. 2 is a perspective view of its solder tank, and Fig. 3 is a sectional view showing its soldering action according to an explanation. , and FIG. 4 are sectional views sequentially showing the soldering action. 1...Solder bath, 33...Support rod as a long support member, 38...Escape part, 39...Push-up part,
P...Printed circuit board, L...molten solder.
Claims (1)
るとともにはんだ槽に対しプリント基板を搬送し
てプリント基板の下面にはんだ槽内の溶融はんだ
をはんだ付けするはんだ付け装置において、上記
はんだ槽のプリント基板搬入側からプリント基板
搬出側にわたつて長尺支持部材を設け、この長尺
支持部材の搬入側部および搬出側部にはんだ槽内
の溶融はんだ中に比較的深く浸漬される逃げ部を
形成するとともに、上記長尺支持部材の中央部に
上記溶融はんだのはんだ面の近傍レベルまで突出
され溶融はんだに接触するプリント基板の下面を
支持する押上げ部を形成したことを特徴とする上
下動式はんだ付け装置。 In a soldering device that moves a solder bath and a printed circuit board relative to each other up and down, conveys the printed circuit board to the solder bath, and solders molten solder in the solder bath to the bottom surface of the printed circuit board, the printed circuit board in the solder bath is An elongated support member is provided from the carry-in side to the printed circuit board carry-out side, and relief portions are formed on the carry-in side and the carry-out side of the long support member to be immersed relatively deeply into the molten solder in the solder tank. and a vertically moving solder, characterized in that a push-up part is formed in the center of the elongated support member to a level near the solder surface of the molten solder and supports the lower surface of the printed circuit board that comes into contact with the molten solder. attaching device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866782U JPS59102257U (en) | 1982-12-25 | 1982-12-25 | Vertical soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866782U JPS59102257U (en) | 1982-12-25 | 1982-12-25 | Vertical soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59102257U JPS59102257U (en) | 1984-07-10 |
| JPS6121172Y2 true JPS6121172Y2 (en) | 1986-06-25 |
Family
ID=30424232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19866782U Granted JPS59102257U (en) | 1982-12-25 | 1982-12-25 | Vertical soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59102257U (en) |
-
1982
- 1982-12-25 JP JP19866782U patent/JPS59102257U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59102257U (en) | 1984-07-10 |
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