KR920003055U - Soldering level meter - Google Patents

Soldering level meter

Info

Publication number
KR920003055U
KR920003055U KR2019900010089U KR900010089U KR920003055U KR 920003055 U KR920003055 U KR 920003055U KR 2019900010089 U KR2019900010089 U KR 2019900010089U KR 900010089 U KR900010089 U KR 900010089U KR 920003055 U KR920003055 U KR 920003055U
Authority
KR
South Korea
Prior art keywords
level meter
soldering
soldering level
meter
level
Prior art date
Application number
KR2019900010089U
Other languages
Korean (ko)
Other versions
KR970002250Y1 (en
Inventor
밍-홍 쿠오
Original Assignee
밍-홍 쿠오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 밍-홍 쿠오 filed Critical 밍-홍 쿠오
Priority to KR2019900010089U priority Critical patent/KR970002250Y1/en
Publication of KR920003055U publication Critical patent/KR920003055U/en
Application granted granted Critical
Publication of KR970002250Y1 publication Critical patent/KR970002250Y1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B65G49/04Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction
    • B65G49/0409Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid the workpieces being immersed and withdrawn by movement in a vertical direction specially adapted for workpieces of definite length
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/081Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1518Vertically held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR2019900010089U 1990-07-10 1990-07-10 A solder leveler KR970002250Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900010089U KR970002250Y1 (en) 1990-07-10 1990-07-10 A solder leveler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900010089U KR970002250Y1 (en) 1990-07-10 1990-07-10 A solder leveler

Publications (2)

Publication Number Publication Date
KR920003055U true KR920003055U (en) 1992-02-25
KR970002250Y1 KR970002250Y1 (en) 1997-03-20

Family

ID=19300877

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900010089U KR970002250Y1 (en) 1990-07-10 1990-07-10 A solder leveler

Country Status (1)

Country Link
KR (1) KR970002250Y1 (en)

Also Published As

Publication number Publication date
KR970002250Y1 (en) 1997-03-20

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee