JP2002134666A5 - - Google Patents
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- Publication number
- JP2002134666A5 JP2002134666A5 JP2000330067A JP2000330067A JP2002134666A5 JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5 JP 2000330067 A JP2000330067 A JP 2000330067A JP 2000330067 A JP2000330067 A JP 2000330067A JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin sheet
- expandable member
- dissipating
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
【特許請求の範囲】
【請求項１】 放熱樹脂シートの表層部全体が平滑であり、少なくとも表層部に、電子機器部品の使用時の発熱温度より高い温度で膨張する熱膨張性部材が存在することを特徴とする放熱樹脂シート。
【請求項２】 放熱シートを構成する樹脂組成中に、熱膨張性部材が添加されており、樹脂層全体に熱膨張性部材が存在することを特徴とする請求項１記載の放熱樹脂シート。
【請求項３】 放熱樹脂シートの表層部に、熱膨張性部材がバインダー樹脂とともに塗布され、固着していることを特徴とする請求項１記載の放熱樹脂シート。
【請求項４】 熱膨張性部材が、熱膨張性のマイクロカプセルであることを特徴とする請求項１〜３のいずれか一項に記載の放熱樹脂シート。
[Claims]
1. A heat radiation characterized in that the entire surface layer of the heat dissipation resin sheet is smooth, and at least the surface layer has a heat-expandable member that expands at a temperature higher than the heat generation temperature when the electronic device component is used. Resin sheet.
2. The heat-dissipating resin sheet according to claim 1, wherein a heat-expandable member is added to the resin composition constituting the heat-dissipating sheet, and the heat-expandable member is present in the entire resin layer.
3. The heat-dissipating resin sheet according to claim 1, wherein a heat-expandable member is applied and fixed to a surface layer of the heat-dissipating resin sheet together with a binder resin.
4. A heat expandable member, the heat radiating resin sheet according to any one of claims 1-3, characterized in that the microcapsules of the thermally expandable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000330067A JP4584439B2 (en) | 2000-10-30 | 2000-10-30 | Heat dissipation resin sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000330067A JP4584439B2 (en) | 2000-10-30 | 2000-10-30 | Heat dissipation resin sheet |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002134666A JP2002134666A (en) | 2002-05-10 |
| JP2002134666A5 true JP2002134666A5 (en) | 2007-11-22 |
| JP4584439B2 JP4584439B2 (en) | 2010-11-24 |
Family
ID=18806645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000330067A Expired - Fee Related JP4584439B2 (en) | 2000-10-30 | 2000-10-30 | Heat dissipation resin sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4584439B2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7744991B2 (en) * | 2003-05-30 | 2010-06-29 | 3M Innovative Properties Company | Thermally conducting foam interface materials |
| JP2005239744A (en) * | 2004-02-24 | 2005-09-08 | Nippon Zeon Co Ltd | Heat conductive pressure-sensitive adhesive composition, heat conductive foamed sheet-like molded product and method for producing the same |
| JP2005272505A (en) * | 2004-03-23 | 2005-10-06 | Nippon Zeon Co Ltd | Heat-conductive pressure-sensitive adhesive composition and heat-conductive sheet-like formed article |
| WO2005059053A1 (en) * | 2003-12-18 | 2005-06-30 | Zeon Corporation | Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-form molded foam, and process for producing the same |
| JPWO2007148729A1 (en) * | 2006-06-21 | 2009-11-19 | 日立化成ポリマー株式会社 | Thermally conductive thermoplastic adhesive composition |
| JP5173166B2 (en) * | 2006-08-14 | 2013-03-27 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesive film peeling method |
| JP5042899B2 (en) * | 2008-03-31 | 2012-10-03 | ポリマテック株式会社 | Thermally conductive sheet and method for producing the same |
| JP2012119674A (en) * | 2010-11-11 | 2012-06-21 | Kitagawa Ind Co Ltd | Thermally conductive sheet |
| WO2018062172A1 (en) * | 2016-09-30 | 2018-04-05 | 積水化学工業株式会社 | Thermally conductive, thermally expandable resin composition, thermally conductive, thermally expandable molded body, battery module, and battery pack |
| JP2019061959A (en) * | 2017-09-26 | 2019-04-18 | 積水化学工業株式会社 | Conductivity variable member and safety system |
| JP6517909B1 (en) * | 2017-11-16 | 2019-05-22 | 株式会社パワーバンクシステム | Cold storage / heat storage sheet and cold storage / heat storage sheet generation method |
| WO2021171782A1 (en) | 2020-02-28 | 2021-09-02 | 日本ゼオン株式会社 | Intercell spacer and battery module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307351A (en) * | 1994-05-11 | 1995-11-21 | Toshiba Chem Corp | Conductive paste |
| JPH08139235A (en) * | 1994-11-08 | 1996-05-31 | Hitachi Ltd | Electronic equipment and its manufacture |
| JPH08133873A (en) * | 1994-11-11 | 1996-05-28 | Sumitomo Metal Ind Ltd | Soldering jig and its production |
| JPH09129793A (en) * | 1995-10-27 | 1997-05-16 | Tonen Corp | Heat conductive plate for semiconductor package |
| JPH09219113A (en) * | 1996-02-08 | 1997-08-19 | Asahi Chem Ind Co Ltd | Paste for heat conduction |
| JP2000150742A (en) * | 1998-11-18 | 2000-05-30 | Shibafu Engineering Kk | Heat conductive sheet and manufacture thereof and semiconductor device |
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2000
- 2000-10-30 JP JP2000330067A patent/JP4584439B2/en not_active Expired - Fee Related
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