KR950702746A - 전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) - Google Patents

전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) Download PDF

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KR950702746A
KR950702746A KR1019950700323A KR19950700323A KR950702746A KR 950702746 A KR950702746 A KR 950702746A KR 1019950700323 A KR1019950700323 A KR 1019950700323A KR 19950700323 A KR19950700323 A KR 19950700323A KR 950702746 A KR950702746 A KR 950702746A
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resin
electrodes
bumps
bump
electrode
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KR1019950700323A
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스탠리 에프. 테드
스테펜 제이. 쯔나메로스키
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워렌 리차드 보비
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR950702746A publication Critical patent/KR950702746A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
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    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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Abstract

복수의 전극을 갖는 전자 소자는 선택된 전극상에 수지로 둘러싸인 금속 범프른 위치시킴으로써 다른 전자 소자와의 본딩을 위해 형성된다. 상기 범프는 범프의 외표면이 실질적으로 한 평면에 놓이도록 다이아몬드 터닝된다. 그리고 나서 수지가 제거된다.

Description

전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(PLANARIZING BUMPS FOR INTERCONNECTING MATCHING ARRAYS OF ELECTRODES)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제6-8도는 본 발명의 방법에 따른 처리 단계에서의 전자소자를 도시한다.

Claims (10)

  1. 다른 전자 소자와 전기 접속을 이루기 위해 복수의 전극을 갖는 전자 소자를 형성하는 방법에 있어서, 상기 전극중 선택된 한 전극상에 수지로 둘러 쌓인 금속 범프를 위치시키는 단계와, 상기 범프 각각이 실직적으로 한 평면에 놓이는 외표면을 갖도록 상기 범프와 수지를 다이아몬드 터닝하는 단계와, 상기 수지를 제거하는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
  2. 제1항에 있어서, 상기 범프는 전기도금에 의해 형성되는 것을 특징으로 하는 전자 소자 형성 방법.
  3. 제2항에 있어서, 상기 전극상에 상기 금속 범프를 위치시키기 전에 상기 전극을 덮는 균일한 층으로서 상지 수지를 중착시키는 단계와, 상기 선택된 전극을 노출시키기 위해 상기 수지층을 패터닝하는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
  4. 제3항에 있어서, 상기 패터닝은 사진 석판기술에 의해 이루어지는 것을 특징으로 하는 전자 소자 형성 방법.
  5. 제1항에 있어서, 상기 범프는 임시 기판위에 형성되고 나서 상기 전극으로 이동되는 것을 특징으로 하는 전자 소자 형성 방법.
  6. 제5항에 있어서, 상기 수지는 상기 범프가 상기 전극에 부착된 후에 증착되는 것을 특징으로 하는 전자 소자 형성 방법.
  7. 제1항에 있어서, 상기 금속 범프는 금을 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
  8. 제1항에 있어서, 상기 금속 범프는 구리를 포함하는 것을 특징으로 하는 전자 형성 방법.
  9. 제8항에 있어서, 상기 금속 범프는 외표면에 금의 층을 입히는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
  10. 제9항에 있어서, 상기 금속 상기 금속 범프가 다이아몬드 터닝된 후에 그리고 상기 수지가 제거되기 전에 입혀지는 것을 특징으로 하는 전자 소자 형성 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950700323A 1992-07-30 1993-07-16 전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) KR950702746A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92255992A 1992-07-30 1992-07-30
US922,559 1992-07-30
PCT/US1993/006700 WO1994003921A2 (en) 1992-07-30 1993-07-16 Planarizing bumps for interconnecting matching arrays of electrodes

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KR950702746A true KR950702746A (ko) 1995-07-29

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KR1019950700323A KR950702746A (ko) 1992-07-30 1993-07-16 전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes)

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EP (1) EP0653105A1 (ko)
JP (1) JPH07509588A (ko)
KR (1) KR950702746A (ko)
CA (1) CA2139314A1 (ko)
WO (1) WO1994003921A2 (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR910006967B1 (ko) * 1987-11-18 1991-09-14 가시오 게이상기 가부시기가이샤 반도체 장치의 범프 전극 구조 및 그 형성 방법
CA2029244A1 (en) * 1989-11-03 1991-05-04 Timothy L. Hoopman Planarizing surfaces of interconnect substrates by diamond turning
JP2624567B2 (ja) * 1990-09-06 1997-06-25 松下電子工業株式会社 バンプレベリング方法およびその装置
US5072520A (en) * 1990-10-23 1991-12-17 Rogers Corporation Method of manufacturing an interconnect device having coplanar contact bumps
JPH04188734A (ja) * 1990-11-21 1992-07-07 Matsushita Electron Corp 半導体装置のバンプレベリング方法

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WO1994003921A2 (en) 1994-02-17
CA2139314A1 (en) 1994-02-17
JPH07509588A (ja) 1995-10-19
WO1994003921A3 (en) 1994-04-14
EP0653105A1 (en) 1995-05-17

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