KR950702746A - 전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) - Google Patents
전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) Download PDFInfo
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- KR950702746A KR950702746A KR1019950700323A KR19950700323A KR950702746A KR 950702746 A KR950702746 A KR 950702746A KR 1019950700323 A KR1019950700323 A KR 1019950700323A KR 19950700323 A KR19950700323 A KR 19950700323A KR 950702746 A KR950702746 A KR 950702746A
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- South Korea
- Prior art keywords
- resin
- electrodes
- bumps
- bump
- electrode
- Prior art date
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- 239000011347 resin Substances 0.000 claims abstract 9
- 229920005989 resin Polymers 0.000 claims abstract 9
- 239000002184 metal Substances 0.000 claims abstract 7
- 229910052751 metal Inorganic materials 0.000 claims abstract 7
- 238000000034 method Methods 0.000 claims description 12
- 238000007516 diamond turning Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 210000001364 upper extremity Anatomy 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 abstract 1
- 239000010432 diamond Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
Abstract
복수의 전극을 갖는 전자 소자는 선택된 전극상에 수지로 둘러싸인 금속 범프른 위치시킴으로써 다른 전자 소자와의 본딩을 위해 형성된다. 상기 범프는 범프의 외표면이 실질적으로 한 평면에 놓이도록 다이아몬드 터닝된다. 그리고 나서 수지가 제거된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제6-8도는 본 발명의 방법에 따른 처리 단계에서의 전자소자를 도시한다.
Claims (10)
- 다른 전자 소자와 전기 접속을 이루기 위해 복수의 전극을 갖는 전자 소자를 형성하는 방법에 있어서, 상기 전극중 선택된 한 전극상에 수지로 둘러 쌓인 금속 범프를 위치시키는 단계와, 상기 범프 각각이 실직적으로 한 평면에 놓이는 외표면을 갖도록 상기 범프와 수지를 다이아몬드 터닝하는 단계와, 상기 수지를 제거하는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
- 제1항에 있어서, 상기 범프는 전기도금에 의해 형성되는 것을 특징으로 하는 전자 소자 형성 방법.
- 제2항에 있어서, 상기 전극상에 상기 금속 범프를 위치시키기 전에 상기 전극을 덮는 균일한 층으로서 상지 수지를 중착시키는 단계와, 상기 선택된 전극을 노출시키기 위해 상기 수지층을 패터닝하는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
- 제3항에 있어서, 상기 패터닝은 사진 석판기술에 의해 이루어지는 것을 특징으로 하는 전자 소자 형성 방법.
- 제1항에 있어서, 상기 범프는 임시 기판위에 형성되고 나서 상기 전극으로 이동되는 것을 특징으로 하는 전자 소자 형성 방법.
- 제5항에 있어서, 상기 수지는 상기 범프가 상기 전극에 부착된 후에 증착되는 것을 특징으로 하는 전자 소자 형성 방법.
- 제1항에 있어서, 상기 금속 범프는 금을 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
- 제1항에 있어서, 상기 금속 범프는 구리를 포함하는 것을 특징으로 하는 전자 형성 방법.
- 제8항에 있어서, 상기 금속 범프는 외표면에 금의 층을 입히는 단계를 포함하는 것을 특징으로 하는 전자 소자 형성 방법.
- 제9항에 있어서, 상기 금속 상기 금속 범프가 다이아몬드 터닝된 후에 그리고 상기 수지가 제거되기 전에 입혀지는 것을 특징으로 하는 전자 소자 형성 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92255992A | 1992-07-30 | 1992-07-30 | |
US922,559 | 1992-07-30 | ||
PCT/US1993/006700 WO1994003921A2 (en) | 1992-07-30 | 1993-07-16 | Planarizing bumps for interconnecting matching arrays of electrodes |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950702746A true KR950702746A (ko) | 1995-07-29 |
Family
ID=25447214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950700323A KR950702746A (ko) | 1992-07-30 | 1993-07-16 | 전극의 정합 어레이를 상호접속시키기 위한 범프의 평면화 방법(planarizing bumps for interconnecting matching arrays of electrodes) |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0653105A1 (ko) |
JP (1) | JPH07509588A (ko) |
KR (1) | KR950702746A (ko) |
CA (1) | CA2139314A1 (ko) |
WO (1) | WO1994003921A2 (ko) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910006967B1 (ko) * | 1987-11-18 | 1991-09-14 | 가시오 게이상기 가부시기가이샤 | 반도체 장치의 범프 전극 구조 및 그 형성 방법 |
CA2029244A1 (en) * | 1989-11-03 | 1991-05-04 | Timothy L. Hoopman | Planarizing surfaces of interconnect substrates by diamond turning |
JP2624567B2 (ja) * | 1990-09-06 | 1997-06-25 | 松下電子工業株式会社 | バンプレベリング方法およびその装置 |
US5072520A (en) * | 1990-10-23 | 1991-12-17 | Rogers Corporation | Method of manufacturing an interconnect device having coplanar contact bumps |
JPH04188734A (ja) * | 1990-11-21 | 1992-07-07 | Matsushita Electron Corp | 半導体装置のバンプレベリング方法 |
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1993
- 1993-07-16 WO PCT/US1993/006700 patent/WO1994003921A2/en not_active Application Discontinuation
- 1993-07-16 KR KR1019950700323A patent/KR950702746A/ko not_active Application Discontinuation
- 1993-07-16 EP EP93917226A patent/EP0653105A1/en not_active Ceased
- 1993-07-16 JP JP6505331A patent/JPH07509588A/ja active Pending
- 1993-07-16 CA CA002139314A patent/CA2139314A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1994003921A2 (en) | 1994-02-17 |
CA2139314A1 (en) | 1994-02-17 |
JPH07509588A (ja) | 1995-10-19 |
WO1994003921A3 (en) | 1994-04-14 |
EP0653105A1 (en) | 1995-05-17 |
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