KR950031473U - Semiconductor wafer drying equipment - Google Patents
Semiconductor wafer drying equipmentInfo
- Publication number
- KR950031473U KR950031473U KR2019940008897U KR19940008897U KR950031473U KR 950031473 U KR950031473 U KR 950031473U KR 2019940008897 U KR2019940008897 U KR 2019940008897U KR 19940008897 U KR19940008897 U KR 19940008897U KR 950031473 U KR950031473 U KR 950031473U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- drying equipment
- wafer drying
- equipment
- semiconductor
- Prior art date
Links
- 238000001035 drying Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940008897U KR200169676Y1 (en) | 1994-04-26 | 1994-04-26 | Dryer for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940008897U KR200169676Y1 (en) | 1994-04-26 | 1994-04-26 | Dryer for semiconductor wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950031473U true KR950031473U (en) | 1995-11-22 |
KR200169676Y1 KR200169676Y1 (en) | 2000-02-01 |
Family
ID=19381806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940008897U KR200169676Y1 (en) | 1994-04-26 | 1994-04-26 | Dryer for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200169676Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040032200A (en) * | 2002-10-01 | 2004-04-17 | 주식회사 에이텍 | Apparatus for washing and drying wafer and method of washing and drying wafer using that |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990048784A (en) * | 1997-12-10 | 1999-07-05 | 김영환 | Manufacturing method of semiconductor device |
-
1994
- 1994-04-26 KR KR2019940008897U patent/KR200169676Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040032200A (en) * | 2002-10-01 | 2004-04-17 | 주식회사 에이텍 | Apparatus for washing and drying wafer and method of washing and drying wafer using that |
Also Published As
Publication number | Publication date |
---|---|
KR200169676Y1 (en) | 2000-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20081027 Year of fee payment: 10 |
|
EXPY | Expiration of term |