KR930008190B1 - Epoxy tile - Google Patents

Epoxy tile Download PDF

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KR930008190B1
KR930008190B1 KR1019900015524A KR900005524A KR930008190B1 KR 930008190 B1 KR930008190 B1 KR 930008190B1 KR 1019900015524 A KR1019900015524 A KR 1019900015524A KR 900005524 A KR900005524 A KR 900005524A KR 930008190 B1 KR930008190 B1 KR 930008190B1
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weight
stone
epoxy
epoxy resin
composition
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KR1019900015524A
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Korean (ko)
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KR900017441A (en
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김상양
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김상양
황대익
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/12—Anodising more than once, e.g. in different baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Finishing Walls (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

내용 없음.No content.

Description

에폭시타일Epoxy tile

본 발명은 에폭시타일에 관한 것으로서, 더욱 상세하게는 에폭시 조성물에 자연석 또는 인조석 조각을 내장시켜 일정크기로 성형시켜서 된 에폭시타일에 관한 것이다.The present invention relates to an epoxy tile, and more particularly, to an epoxy tile formed by embedding a natural stone or artificial stone pieces in an epoxy composition to a certain size.

일반적으로 건물의 내부 바닥이나 벽면 등의 표면에 사용되는 석재구성을 대부분 시멘트나 인조석 또는 자연석을 혼합하여 처리된 상태로 구성하고, 근래에 들어서는 각종 타일이나 바닥 또는 장식재 등을 부착사용하고 있다. 그러나, 바닥이나 벽면에 직접 시멘트와 석재를 혼합하여 처리하는 경우에는 그 작업이 어렵고 복잡할 뿐 아니라 외관이 미려하지 못하고 딱딱한 느낌을 주기 때문에 그 사용을 기피하고 있는 실정이다.In general, most of the stone composition used on the interior floor or wall surface of the building is processed by mixing cement, artificial stone, or natural stone, and recently, various tiles, floors or decorative materials are attached and used. However, when the cement and stone is mixed directly to the floor or wall surface, the work is difficult and complicated, and the appearance is not beautiful and it is hard to avoid the use.

또한, 각종 바닥 장식재의 경우는 외관상 미려하고 부드러운 점등에서는 상당한 만족감을 주고 있으나, 영구적으로 사용될 수는 없는 것이라는 점 때문에 역시 경제적이지 못한 문제가 있었다.In addition, in the case of a variety of floor decorative material is beautiful in appearance and gives a considerable satisfaction in soft lighting, there was also a problem that is not economical because it can not be used permanently.

다른 한편으로, 건물의 내외장재로서 각종 타일류가 이용되고 있는바, 그 중에서도 수지타일과 석재 및 세라믹타일이 있으나 수지타일의 경우 내구성 및 내약품성이 현저하게 떨어지고, 세라믹타일의 경우 각종 색상이나 무늬를 가미하여 널리 이용되고는 있으나 그 타일제조시 고온소성이 필요하고 소성된 제품은 취급시 쉽게 깨어질 뿐 아니라 무겁기 때문에 역시 사용상 단점이 있었다.On the other hand, various tiles are used as interior and exterior materials of buildings. Among them, resin tiles, stones, and ceramic tiles are used. However, resin tiles have low durability and chemical resistance, and ceramic tiles have various colors and patterns. Although it has been widely used in the manufacture of the tiles, high temperature firing is required in the manufacture of the tiles, and the fired products are not only easily broken but also heavy in handling.

또한, 세라믹타일은 단조로움을 피하기 위해 여러 색상의 무늬를 전사방식에 의해 부여하고 있으나 그 가공단계에 어려움이 많기 때문에 경제적으로도 불리한 점이 많았다.In addition, the ceramic tile is given a pattern of various colors to avoid forging by the transfer method, but because of the difficulty in the processing step, there were many disadvantages economically.

그 외에도, 각종 수지산업이 발달하면서 수지조성물을 주재로 하고 천연석 또는 인조석을 혼합하여 만든 각종 인조석재가 개발되고 있으나, 성형된 수지성형물 내부에 기포가 형성되거나 내약품성, 인장강도 및 인열강도등 제반물성이 좋지 않기 때문에 널리 실용화되지는 못하고 있다.In addition, with the development of various resin industries, various artificial stones made from natural resins or mixed artificial stones are being developed, but bubbles are formed inside the molded resin moldings, and chemical resistance, tensile strength and tear strength, etc. Due to poor physical properties, it is not widely used.

또한, 최근 들어서는 각종 석재를 피복하지 아니하고 석재 내부와 표면을 착색하여 건축재로 이용하기 위한 착색방법이 알려져 있는바, 국내 특허공고 제86-1181호에는 일정 칫수로 절단한 석재를 전처리한 다음, 착색침지로에서 48시간 침지시키고나서 300∼350℃에서 가열하고 그 착색된 표면을 연마 처리하므로서 건물내외장재로 이용하도록 하는 석재의 착색방법이 기술되어 있고, 일본 특개소 61-29147호에는 석재 착색과정에서 산소 또는 오존함유공기를 사용하는 화강암 착색방법이 기술되어 있다.In addition, in recent years, a coloring method for coloring the inside and the surface of the stone and using it as a building material without covering various stones is known. In Korean Patent Publication No. 86-1181, after pre-treating a stone cut to a certain dimension, the coloring is performed. After dipping for 48 hours in the dipping furnace, the method of coloring the stone is used for interior and exterior building materials by heating at 300-350 ℃ and polishing the colored surface. Japanese Patent Laid-Open No. 61-29147 describes the process of stone coloring. Granite staining methods using oxygen or ozone containing air are described.

그러나, 이러한 착색방법은 석재의 처리기간이 너무 길고 고온에서 착색처리하기 때문에 생산성 및 제조 효율면에서 능률적이지 못하여 경제적인 문제가 있을 뿐 아니라 품위있는 색상을 얻기에도 어려움이 있었다.However, this coloring method has a long processing period of the stone and the coloring process at a high temperature is not efficient in terms of productivity and manufacturing efficiency, so there is an economic problem as well as difficulty in obtaining a refined color.

또한, 이러한 재질은 장시간 사용시 표면변색이 일어나고 크랙발생이 일어나기 때문에 건물의 내외장재로 실용화 되기에는 어려움이 있었다.In addition, these materials have a difficulty in being used as interior and exterior materials of buildings because surface discoloration and cracks occur when used for a long time.

따라서, 본 발명은 종래와 같은 제 문제점들을 해소하기 위하여 종래 인조석재의 제조에 이용되어 왔던 에폭시수지 조성물의 조성을 일부 개선하고, 여기에 일정크기의 천연석 및 인조석 조각을 침지 내장시켜 적당한 크기의 타일로 형성시킨 에폭시타일을 제공하는데 그 목적이 있다.Therefore, the present invention partially improves the composition of the epoxy resin composition that has been used in the manufacture of artificial stone in order to solve the problems of the prior art, and by immersing a certain size of natural stone and artificial stone pieces into tiles of a suitable size. The purpose is to provide a formed epoxy tile.

이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

본 발명은 에폭시수지를 기본수지로 하고, 경화제, 경화촉진제 등의 공지 첨가제가 혼합된 에폭시수지 조성물과 천연석 또는 인조석으로 이루어진 에폭시타일에 있어서, (1) 에폭시수지 70∼85중량%, 반응성 희석제 10∼20중량%, 레벨링제 0.1∼0.5중량%, 소포제 0.1∼0.5중량%, 정전방지제 0.1∼0.5중량%, 자외선 흡수제 0.1∼0.5중량% 및 난연제 1∼5중량%로 이루어진 제1조성물 100중량부와, (2) 경화제 60∼80중량%, 경화촉진제 3∼10중량%, 반응성 희석제 10∼30중량% 및 비반응성 희석제 5∼15중량%로 이루어진 제2조성물 10중량부 및, (3) 오일염료 1∼3중량부 및 안료 3∼5중량부의 혼합물로 구성된 에폭시수지 조성물에 천연석 또는 인조석 조각이 석재조각 : 에폭시수지 조성물의 비율 100:15∼30중량비로 침지 성형되어 있으면서 그 성형품의 크기가 가로 5∼50㎝, 세로 5∼150㎝, 높이 0.3∼5㎝인 것을 특징으로 하는 에폭시타일인 것이다.The present invention relates to an epoxy resin comprising an epoxy resin as a base resin, and an epoxy resin composition containing a known additive such as a curing agent and a curing accelerator, and natural or artificial stone. 100 parts by weight of the first composition consisting of -20% by weight, leveling agent 0.1-0.5% by weight, antifoaming agent 0.1-0.5% by weight, antistatic agent 0.1-0.5% by weight, ultraviolet absorber 0.1-0.5% by weight and flame retardant 1-5% by weight. (2) 10 parts by weight of a second composition consisting of 60 to 80% by weight of a curing agent, 3 to 10% by weight of a curing accelerator, 10 to 30% by weight of a reactive diluent, and 5 to 15% by weight of a non-reactive diluent, and (3) oil. Natural or artificial stone fragments are immersed in the epoxy resin composition composed of a mixture of 1 to 3 parts by weight of dye and 3 to 5 parts by weight of pigments in a ratio of 100: 15 to 30 parts by weight of the epoxy resin composition. 5-50cm, vertical 5 ~ It is an epoxy tile characterized by being 150 cm and 0.3-5 cm in height.

이와같은 본 발명을 더욱 상세히 설명하면 다음과 같다.Referring to the present invention in more detail as follows.

본 발명은 에폭시 조성물에 천연석 또는 인조석 조각을 함침 성형시킨 에폭시타일로서, 상기 에폭시 조성물은 크게는 주제인 상기 제1조성물과 경화제인 제2조성물 및 첨가제인 오일염료와 안료의 혼합물로 구성된 것이다.The present invention is an epoxy tile obtained by impregnating a natural stone or artificial stone pieces into an epoxy composition, wherein the epoxy composition is composed of a mixture of an oil dye and a pigment, which is a first composition, a second composition, and an additive.

본 발명에서 제1조성물은 기본수지로서 에피클로로하이드린과 비스페놀 A의 축합 생성물인 에폭시수지 중간체(Interme diate epoxy resin)를 사용하였다.In the present invention, the first composition used an intermediate resin, Interme diate epoxy resin, which is a condensation product of epichlorohydrin and bisphenol A.

이러한 에폭시수지 중간체의 구조식은 다음과 같다.The structural formula of this epoxy resin intermediate is as follows.

본 발명에서 액상의 수지를 사용해야 하기 때문에 상기 구조식(Ⅰ)에서 n=0인 중간체를 사용하였다.Since the liquid resin should be used in the present invention, an intermediate having n = 0 in the structural formula (I) was used.

상기 식에서 n=0일 때 끈적끈적한 액상이지만 n=1 이상이 되면 고형의 수지상이 되기 때문에 본 발명에서는 사용할 수 없다.In the above formula, when n = 0, it is a sticky liquid, but when n = 1 or more, the resin becomes a solid resin and thus cannot be used in the present invention.

이와 같은 에폭시 기본수지는 제1조성물에서 약 70∼85중량%의 양을 차지한다.Such epoxy base resin accounts for about 70 to 85% by weight of the first composition.

이러한, 기본수지 외에 본 발명에서는 에폭시 기본수지로서 이소프로필리덴디페놀의 글리시딜에테르를 에폭시수지 중에 2∼10중량%를 혼합사용할 수 있다.In addition to such a basic resin, in the present invention, 2 to 10% by weight of glycidyl ether of isopropylidenediphenol can be mixed and used as an epoxy basic resin in the epoxy resin.

본 발명의 제1조성물에는 반응성 회석제를 혼합 사용하는데, 그 예로서는 부틸글리시딜에테르/펜틸글리시딜에테르 7/1중량비의 혼합물을 사용하며, 이외에도 모노글리시딜에테르류로서 메틸 또는 에틸 폴리에피클로로하이드린 모노글리시딜에테르, 또는 n-부틸(이소프로필, 또는 이소부틸) 폴리에피클로로하이드린 모노글리시딜에테르 등을 10∼20중량% 사용할 수 있다.In the first composition of the present invention, a reactive diluent is mixed and used as an example. A mixture of butylglycidyl ether / pentylglycidyl ether 7/1 by weight is used. In addition, methyl or ethyl poly is used as monoglycidyl ether. 10 to 20 weight% of epichlorohydrin monoglycidyl ether or n-butyl (isopropyl, or isobutyl) poly epichlorohydrin monoglycidyl ether, etc. can be used.

또한, 레밸링제로는 예컨대 실리콘수지에 케톤 및 에스테르계의 고비점 용제가 혼합된 것을 사용하여 성형시 표면상태를 양호하게 하여 준다. 소포제로는 실리콘계 유기화합물을 사용하여 성형시 수지 조성물내에 기포형성을 방지하며 정전방지제로는 스테아라미도 프로필-디메틸-2-하이드록시 에틸 암모니움 나이트레이트에 50%의 이소프로필 알코올과 H2O가 함유된 것을 0.1∼0.5중량%로 사용하여 이를 이용한 성형제품을 건물 내장제로 사용할때 에폭시수지 조성물로 인해 정전기가 발생되는 것을 예방할 수 있도록 한다.In addition, as the rebalancing agent, for example, a mixture of ketone and ester-based high boiling point solvent is mixed with silicone resin to improve the surface state during molding. Antifoaming agent is used to prevent bubble formation in the resin composition during molding by using silicone-based organic compound. 50% isopropyl alcohol and H 2 O in stearamido propyl-dimethyl-2-hydroxy ethyl ammonium nitrate 0.1 to 0.5% by weight is used to prevent the generation of static electricity due to the epoxy resin composition when using the molded product using the same as building interior materials.

자외선 흡수제는 예컨대 폴리-[(6-몰플리노-S-트리아진-2,4-디일)-{(2,2,6,6-테트라메틸-4-피페리딜)이미노}-헥사-메틸렌{(2,2,6,6-테트라메틸-4-피페리딜)이미노}]를 사용하고, 난연제로는 예컨대, 브롬화 에폭시수지(에피클로로하이드린-테트라브로모 비스페놀 A)를 1∼5중량% 범위로 사용하여 수지의 난연성을 부여해 주게 된다.Ultraviolet absorbers are for example poly-[(6-morpholino-S-triazine-2,4-diyl)-{(2,2,6,6-tetramethyl-4-piperidyl) imino} -hexa- Methylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}] and brominated epoxy resin (epichlorohydrin-tetrabromo bisphenol A) is used as a flame retardant. It is used in the range of -5% by weight to impart flame retardancy of the resin.

이때, 상기 제1조성물중의 상기 각 성분들의 사용량은 상기 범위보다 너무 적으면 첨가 효과가 없고 너무 많게 되면 조성물내에서 상용성이 없을 뿐 아니라 경도, 인장강도, 굴곡강도, 압축응력이 저하되는 등 물성이 나빠지게 된다.At this time, if the amount of each of the components in the first composition is too small than the above range, there is no effect of addition and if too large, there is no compatibility in the composition, and hardness, tensile strength, flexural strength, compressive stress, etc. are lowered. Physical properties deteriorate.

한편, 제2조성물인 경화제 조성에서 사용되는 경화제로는 아민계 경화제인 폴리옥시프로필렌디아민을 60-80중량% 사용하고, 경화 촉진제로는 디메틸아미노프로필아민, 디에틸렌트리아민 또는 트리에틸렌테트라민과 같은 아민계 경화제를 제2조성물의 조성중 약 3∼10중량%로 사용한다.On the other hand, as the curing agent used in the composition of the second composition, 60-80% by weight of polyoxypropylene diamine, which is an amine curing agent, is used as a curing accelerator, such as dimethylaminopropylamine, diethylenetriamine or triethylenetetramine. The same amine curing agent is used at about 3 to 10% by weight in the composition of the second composition.

또한, 여기에 첨가되는 반응성 희석제는 상기한 제1조성물에서 사용한 것과 동종의 화합물을 10∼30중량%로 사용하며, 비반응성 희석제로는 에틸셀룰로스 또는 에틸셀로솔브를 제2조성물중 약 0.5∼1중량%의 양으로 사용한다.In addition, the reactive diluent added thereto uses 10-30% by weight of the same compound as used in the above-mentioned first composition, and as the non-reactive diluent, ethylcellulose or ethyl cellosolve is used in the range of about 0.5--30%. It is used in the amount of 1 weight%.

여기서, 반응성 및 비반응성 희석제를 혼합 사용하는 이유는 수지의 점도조절 및 상용성의 증대를 위해 사용하는 것이다.Here, the reason for mixing and using the reactive and non-reactive diluent is to use for adjusting the viscosity and increasing the compatibility of the resin.

또한, 본 발명에서는 상기 제1 및 제2조성물에 첨가제로서 오일염료 및 안료를 첨가 사용하는바, 오일염료는 색상의 선명도 및 투명성을 향상시켜 주는 역할을 하는 것으로서, 통상의 오일염료를 1~3중량부로 사용할 수 있다.In addition, in the present invention, the oil dye and the pigment are added and used as additives to the first and second compositions, and the oil dye serves to improve the clarity and transparency of the color. It can be used in parts by weight.

만일 상기 오일염료가 1중량부보다 적게 사용되면 색상의 선명도가 저하될 우려가 있고, 3중량부 보다 많이 사용되면 첨가 효과가 없다.If the oil dye is used less than 1 part by weight there is a fear that the vividness of the color is lowered, if used more than 3 parts by weight there is no addition effect.

그리고, 본 발명에 따르면 상기 조성물외에 안료를 첨가 사용할 수 있는바, 이러한 안료로는 무기 또는 유기안료를 3∼5중량부로 사용할 수 있다.In addition, according to the present invention, a pigment may be added and used in addition to the composition. As the pigment, an inorganic or organic pigment may be used in an amount of 3 to 5 parts by weight.

무기안료는 0.2∼0.4mμ 크기의 것, 더욱 크게는 25mμ 정도로 큰 것을 사용할 수 있으며, 이러한 예로는 카본볼랙, 이산화티탄, 또는 크로메이트(chromates) (황)페로시아나이드(ferrocyanides) (청), 설파이드(sulfides), 옥사이드(oxides) 및 실리케이트(silicates)가 있다.Inorganic pigments may be used in sizes ranging from 0.2 to 0.4 mμ, even as large as 25 mμ, such as carbon bolac, titanium dioxide, or chromates (sulfur) ferrocyanides (blue), sulfides. (sulfides), oxides and silicates.

이와 같은 안료는 여러 금속염과 함께 상호침전법 (coprecipitation)을 적용하면 색상을 변경할 수 있다.Such pigments can be changed in color by applying coprecipitation with various metal salts.

유기안료로는 프탈로시아닌계를 비롯한 통상적인 여러 종류를 사용할 수 있으며, 특히 퀸아크리딘(Quinacridine)계 안료를 단독으로 또는 무기안료와 함께 혼합사용할 수도 있다.Organic pigments can be used a variety of conventional, including phthalocyanine-based, in particular, can be used alone or mixed with inorganic pigments Quinacridine (Quinacridine) pigments.

한편, 본 발명에 따르면, 상기와 같은 수지조성물에 천연석 또는 인조석 조각을 석재조각 :수지의 비가 100 : 15∼30중량비가 되도록 침지시키되 자연침지시켜서 타일로 성형하며, 이러한 성형시 타일의 크기는 가로 5~150cm. 세로 5∼150cm, 높이 0.3∼5cm로 성형한다.On the other hand, according to the present invention, while immersing the natural stone or artificial stone pieces in the resin composition as described above to the ratio of stone carving: resin 100: 15 to 30 by weight, by immersing in natural shape to form a tile, the size of the tile during the molding 5-150 cm. Molding is made 5 to 150 cm long and 0.3 to 5 cm high.

이때, 사용되는 천연석 또는 인조석 조각은 그 크기가 1∼10mm 입경인 것을 사용하는 것이 성형 상태나 제조후의 외관 및 물성에 가장 바람직하다.At this time, the natural stone or artificial stone pieces used are those having a particle size of 1 to 10mm is most preferable for the appearance state and physical properties after forming or production.

또한, 상기 천연석 또는 인조석 조각은 그대로 사용하거나 상기 수지조성물을 1차로 코팅하여 사용할 수 있는데, 그대로 사용할 경우에는 수지조성물내에 침지 성형시킬때 기포발생의 염려가 있기 때문에 1차 코팅하여 사용하는 것이 더욱 바람직하다.In addition, the natural stone or artificial stone fragments may be used as it is or may be used by coating the resin composition as the primary. When used as such, it is more preferable to use the primary coating because it may cause bubbles when immersed in the resin composition. Do.

이때, 상기 석재조각의 1차 코팅은 주제/경화제가 3/1중량비의 비율로 혼합된 2액형으로서, 주제중 기본수지 50∼60중량%, 난연성 기본수지 4∼5중량%, 용매20∼24중량%, 자외선 흡수제 0.2∼0.4중량%, 비반응성 희석제 4∼6중량%, 물 6∼7중량%, 유화제 5∼6중량%, 소포제 0.4∼0.8중량% 및 칙소제 0.4∼0.8중량%이며, 경화제 조성중 아민계 경화제 12~14중량%, 폴리아미드계 경화제 3∼5중량%. 촉진제 0∼1.0중량%, 용매 80∼85중량%인 석재용 조성물을 이용하는 것이 바람직하며, 그 코팅두께는 0.05∼0.1mm 두께로 하는 것이 좋고, 1차 코팅후에는 콘베어벨트를 이용하여 풍향 열건조하면 좋다.At this time, the primary coating of the stone carving is a two-component type in which the main / hardener is mixed in the ratio of 3/1 weight ratio, 50 to 60% by weight of the base resin, 4 to 5% by weight of the flame-retardant base resin, solvent 20 to 24 Weight%, ultraviolet absorber 0.2-0.4 weight%, non-reactive diluent 4-6 weight%, water 6-7 weight%, emulsifier 5-6 weight%, defoamer 0.4-0.8 weight%, thixotropic agent 0.4-0.8 weight%, 12-14 weight% of amine-type hardeners, and 3-5 weight% of polyamide-type hardeners in a hardening | curing agent composition. It is preferable to use the stone composition which is 0-1.0 weight% of accelerators, and 80-85 weight% of solvents, The coating thickness is 0.05-0.1mm thickness, and after the primary coating, it is carried out by wind direction heat drying using a conveyor belt. Do it.

이러한 석재조각을 상기 수지조성물에 침지성형시킬때 몰드의 규격에 관계없이 우선 상기 수지조성물을 몰드의 성형품 높이에 3/1만큼 붇고 코팅된 자연석 또는 인조석을 골고루 펴면서 투여하여 몰드 높이와 동일한 높이로 가득 채운다.When immersing such stone pieces into the resin composition, the resin composition is first subtracted by 3/1 to the molded product height of the mold and evenly coated and coated with natural stone or artificial stone to be filled with the same height as the mold height. Fill it.

이때, 상기 수지조성물은 석재조각의 침지로 인해 몰드 전체 높이의 3/2까지 올라오게 되며, 그 위에 뿌려진 석재조각은 일부가 침지된 상태에서 외부로 거칠게 돌출된 요철 형태가 되어지도록 하여 그대로 경화시킨다.At this time, the resin composition is raised to 3/2 of the total height of the mold due to the immersion of the stone pieces, and the stone pieces sprayed thereon are hardened as it is so as to be roughly projected to the outside in a partially immersed state. .

본 발명에 따르면, 성형시 경화시간은 자연경화시 8∼25시간동안, 가열경화시 30~80분동안 경화시키는 바, 완전 경화후 탈형시키면 성형된 밑부분은 평활한 면이 형성되나 윗부분은 석재조각이 불규칙하게 돌출된 요철형태 그대로 성형 타일이 생성된다.According to the present invention, the curing time during molding is cured for 8 to 25 hours during natural curing and for 30 to 80 minutes during heat curing. When demolding after complete curing, the molded lower part is formed with a flat surface, but the upper part is made of stone. Molded tiles are produced in the form of irregularities protruding irregularly.

이러한, 본 발명의 성형타일은 플라스틱몰드를 사용하여 성형시키는 것이 바람직한 바, 이는 에폭시수지와 플라스틱몰드 사이에 이형성이 우수하기 때문이다.Such a molding tile of the present invention is preferably molded using a plastic mold, because it is excellent in releasability between the epoxy resin and the plastic mold.

여기서, 석재가 돌출된 부분은 건축내장재로 시공시 시멘트 등과 쉽게 접착될 수 있어 접착성 향상에 큰 도움을 주게 되는 잇점이 있다.Here, the protruding part of the stone can be easily adhered to cement and the like during construction as a building interior material has an advantage that greatly helps in improving the adhesiveness.

또한, 종래의 방법에 따라 성형품을 재단하는 경우와 비교할때 본 발명에서의 크기대로 규격화하여 성형하게 되면 다음의 비교표에서와 같이 원료 절감효과를 얻을 수 있다.In addition, compared to the case of cutting the molded article according to the conventional method, when the standardized to the size in the present invention and molding, it is possible to obtain the raw material saving effect as shown in the following comparison table.

이러한, 본 발명에 따른 성형타일은 특히 바닥면에 접착시공할 경우 평활한 성형면을 다시 광연마 처리하여 사용하게 되면 표면강도를 높일 수 있다.Such a molding tile according to the present invention can increase the surface strength, in particular, when using the photo-polishing treatment of the smooth molding surface again when the adhesive construction on the bottom surface.

상술한 바와 같이 본 발명에 따라 제조된 에폭시타일은 건축 내외장 타일로 매우 유용한 바, 그 물성을 측정해 본 결과 경도 80∼90(Rockwell M), 인장강도 350∼380(JIS K6911), 굴곡강도 580∼600(ASTM D-790), 압축응력 750∼800(ASTM D-695), 열변형 온도 110℃(ASTM 648), 흡수율 0.2(JIS K 6911)인 것으로 나타나 제반물성이 우수하면서도 외관이 미려하고, 또 내약품성도 우수한 것으로서, 착색에 따라 여러 색상의 제품으로 제조하여 기존의 타일보다 매우 유용하게 이용될 수 있다.As described above, the epoxy tile manufactured according to the present invention is very useful as an interior and exterior tiles of a building. As a result of measuring the physical properties, hardness 80-90 (Rockwell M), tensile strength 350-380 (JIS K6911), flexural strength 580 ~ 600 (ASTM D-790), compressive stress 750 ~ 800 (ASTM D-695), heat deformation temperature 110 ℃ (ASTM 648), absorption rate 0.2 (JIS K 6911). In addition, it is also excellent in chemical resistance, it can be used to make a product of various colors according to the coloration is very useful than conventional tiles.

이하, 본 발명을 실시예에 의거 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to Examples.

[실시예]EXAMPLE

(제 1 조성물)(First composition)

기본수지(YD-128)* 79gBasic Resin (YD-128) * 79g

반응성 희석제** 16gReactive Diluent ** 16g

준반응성 희석제(크실렌수지) 0.6gSemi-reactive diluent (xylene resin) 0.6 g

레벨링제(이소프로필리덴디페놀의 디글리시딜에테르 0.2gLeveling agent (0.2 g of diglycidyl ether of isopropylidenediphenol

소포제(10% 실리콘에멀젼) 0.25gAntifoaming Agent (10% Silicone Emulsion) 0.25g

정전방지제(cyastatsn, 미국 시아나미드사 제품) 0.2gAntistatic Agent (cyastatsn, Cyanamide, USA) 0.2g

자외선 흡수제(UV-3346, 미국 시아나미드사 제품) 0.3g0.3 g of ultraviolet absorbers (UV-3346, product made in the United States cyanamide)

난연제(YNB-400, 한국 국도화학 제품) 3.45gFlame Retardant (YNB-400, Korea Kukdo Chemical) 3.45g

계 100g100 g

(제 2 조성물)(Second composition)

경화제(Triethylene tetramine) 7gHardener (Triethylene tetramine) 7g

촉진제(Benzyl dimethyl amine) 0.5g0.5g Benzyl dimethyl amine

반응성 희석제** 1.5gReactive Diluent ** 1.5g

비반응성 희석제(하이졸) 1g1 g of non-reactive diluent (hysol)

계 10g10 g of systems

상기 조성중에서,In the said composition,

* : 기본수지는 국도화학 제품, 에피클로로하이드린과 비스페놀 A의 축합생성물로 끈적끈적한 액상.*: Base resin is a condensation product of epichlorohydrin and bisphenol A. It is a sticky liquid.

에폭시 당량, 184-190 : 점도(25℃), 11500-13500cps : 색상(Gardner), 0.5Max : 비중(20℃), 1.17 : 굴절율(20℃), 1.5713.Epoxy equivalent, 184-190: viscosity (25 ° C), 11500-13500cps: color (Gardner), 0.5Max: specific gravity (20 ° C), 1.17: refractive index (20 ° C), 1.5713.

** : 반응성 희석제는 부틸글리시딜에테르/펜틸글리시딜에테르=7/1의 비율인 혼합물을 사용하였다.**: A reactive diluent used a mixture of butylglycidyl ether / pentylglycidyl ether = 7/1.

상기 제1조성물(점도 : 2580cps, 비중 1.40)과 제2조성물(점도 : 290cps, 비중 1.05)을 혼합하고 여기에 오일염료 및 안료를 각각 1g 넣은 후 가로×세로×높이가 30×100×2cm인 몰드내에 3/1 높이로 주입하였다.After mixing the first composition (viscosity: 2580cps, specific gravity 1.40) and the second composition (viscosity: 290cps, specific gravity 1.05) and put 1g of oil dye and pigment, respectively, the horizontal × vertical × height is 30 × 100 × 2cm It was injected into the mold at 3/1 height.

통상의 화강암 석재조각(입경 2∼8mm)을 상기 몰드내에 가득 펴서 채우고(수지조성 : 석재조각 = 100 : 25) 자연상태에서 24시간 경화시킨 후, 탈형하여 엷은 연두색 표면색을 갖는 타일(30×100×2cm)을 제조하였다.Normal granite stone fragments (2-8 mm in diameter) are filled and filled in the mold (resin composition: stone fragments = 100: 25), cured in natural conditions for 24 hours, and then demolded to give a pale yellow-green surface color (30 × 100). X 2 cm).

제조된 상기 타일에 대한 물성측정 결과를 표 1에, 온도별 내약품성 측정결과를 표 2에 각각 나타내었다.Table 1 shows the results of measurement of physical properties of the tiles, and the results of chemical resistance measurement according to temperature, respectively.

[표 1]TABLE 1

[표 2]TABLE 2

에폭시수지타일의 내약품성Chemical Resistance of Epoxy Resin Tiles

(주) ○ : 우수, △ : 양호, × : 불량(Note) ○: Excellent, △: Good, ×: Poor

Claims (4)

에폭시수지를 기본수지로 하고, 경화제, 경화촉진제 등의 공지 첨가제가 혼합된 에폭시수지 조성물과 천연석 또는 인조석으로 이루어진 에폭시타일에 있어서, (1) 에폭시수지 70∼85중량%, 반응성 희석제 10∼20중량%, 레벨링제 0.1∼0.5중량%, 소포제 0.1∼0.5주량%, 정전방지제 0.1∼0.5중량%, 자외선 흡수제 0.1∼0.5중량% 및 난연제 1∼5중량%로 이루어진 제1조성물 100중량부와, (2) 경화제 60∼80중량%, 경화촉진제 3∼10중량%, 반응성 희석제 10∼30중량% 및 비반응성 희석제 5∼15중량%로 이루어진 제2조성물 10중량부 및, (3) 오일염료 1∼3중량부와 안료 3∼5중량부의 혼합물로 구성된 에폭시수지 조성물에 천연석 또는 인조석 조각이 석재조각 : 에폭시수지 조성물의 비율이 100:15∼30중량비로 침지 성형되어 있으면서 그 성형품의 크기가 가로 5∼50㎝, 세로 5∼150㎝, 높이 0.3∼5㎝인 것을 특징으로 하는 에폭시타일.Epoxy resin comprising epoxy resin as a base resin and known additives such as a curing agent and a curing accelerator and natural stone or artificial stone, comprising: (1) 70 to 85% by weight of epoxy resin and 10 to 20% by weight of reactive diluent. %, 0.1 to 0.5% by weight of leveling agent, 0.1 to 0.5% by weight of antifoaming agent, 0.1 to 0.5% by weight of antistatic agent, 0.1 to 0.5% by weight of ultraviolet absorber, and 1 to 5% by weight of flame retardant, 100 parts by weight of ( 2) 10 parts by weight of a second composition consisting of 60 to 80% by weight of a curing agent, 3 to 10% by weight of a curing accelerator, 10 to 30% by weight of a reactive diluent, and 5 to 15% by weight of a non-reactive diluent, and (3) 1 to 1 oil dye. Natural or artificial stone fragments in the epoxy resin composition composed of a mixture of 3 parts by weight and 3 to 5 parts by weight of the stone: The epoxy resin composition is immersed and molded at a ratio of 100: 15 to 30 parts by weight, and the size of the molded product is 5 to 4 horizontally. 50 cm, 5 to 150 cm Epoxy tiles, characterized in that 0.3~5㎝. 제 1 항에 있어서, 상기 천연석 또는 인조석 조각은 그 입경이 1∼10mm인 것을 특징으로 하는 에폭시 타일.The epoxy tile according to claim 1, wherein the natural stone or artificial stone piece has a particle diameter of 1 to 10 mm. 제 1 항에 있어서, 상기 천연석 또는 인조석 조각은 에폭시수지 조성물을 0.05∼0.1mm두께로 1차 코팅시킨 것을 특징으로 하는 에폭시타일.The epoxy tile according to claim 1, wherein the natural stone or artificial stone piece is first coated with an epoxy resin composition at a thickness of 0.05 to 0.1 mm. 제 1 항에 있어서, 상기 타일의 성형면은 평활하고, 그 반대면은 석재조각이 불규칙하게 돌출되어 요철형태로 성형된 것을 특징으로 하는 에폭시 타일.The epoxy tile according to claim 1, wherein a molding surface of the tile is smooth, and an opposite surface of the tile is formed in a concave-convex shape by irregularly protruding stone pieces.
KR1019900015524A 1990-04-20 1990-04-20 Epoxy tile KR930008190B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371222B1 (en) * 2013-04-16 2014-03-10 고삼석 The solventless coating composition and method of forming a coating film using the same
CN103964748A (en) * 2014-04-10 2014-08-06 广东省建筑科学研究院 Quick patching material for expansion joint and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371222B1 (en) * 2013-04-16 2014-03-10 고삼석 The solventless coating composition and method of forming a coating film using the same
CN103964748A (en) * 2014-04-10 2014-08-06 广东省建筑科学研究院 Quick patching material for expansion joint and preparation method thereof

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