KR920017301A - 전기부품용 소케트에 있어서의 접촉부 - Google Patents
전기부품용 소케트에 있어서의 접촉부 Download PDFInfo
- Publication number
- KR920017301A KR920017301A KR1019920001883A KR920001883A KR920017301A KR 920017301 A KR920017301 A KR 920017301A KR 1019920001883 A KR1019920001883 A KR 1019920001883A KR 920001883 A KR920001883 A KR 920001883A KR 920017301 A KR920017301 A KR 920017301A
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- spring
- socket
- terminal
- electrical component
- Prior art date
Links
- 238000006073 displacement reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/112—Resilient sockets forked sockets having two legs
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 접촉부의 투시도, 제2도는 상기 접촉부의 측면도, 제3도는 상기 접촉부의 변위상태를 보여주는 측면도.
Claims (3)
- 제1스프링부, 상기 제1스프링부로부터 간격을 두고 떨어져 있으나 기저단 및 말초단에서 제1스프링부와 연결되는 제2스프링부, 기저단사이의 연결부에 연속적으로 이르고 배선기판 또는 그와 유사한 것과 접촉되도록 된 단자부 및 말초단 사이의 연결부에 형성되어 그위에 장착될 전기부품의 단자와 접촉되도록 된 장착접촉부를 포함하고, 상기 제1 및 제2스프링부는 장착 접촉부를 하향으로 변위시키기 위해 기저단사이의 연결부 주위로 굽어지고, 상기 장착 접촉부는 상기 제1 및 제2스프링부의 반작용에 의해 그위에 장착된 전기부품의 단자와 압력접촉하는 것을 특징으로 하는 전기부품 소케트의 접촉부.
- 제1항에 있어서, 상기 제1 및 제2스프링부는 일반적으로 평행관계에 있는 것을 특징으로 하는 전기부품 소케트의 접촉부.
- 제1항 또는 제2항에 있어서, 상기 제1 및 제2스프링부는 일반적으로 길이가 동일한 것을 특징으로 하는 전기부품 소케트의 접촉부.※참고사항:최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-103656 | 1991-02-19 | ||
JP3103656A JPH07109780B2 (ja) | 1991-02-19 | 1991-02-19 | 電気部品用ソケットにおけるコンタクト |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920017301A true KR920017301A (ko) | 1992-09-26 |
KR950009900B1 KR950009900B1 (ko) | 1995-09-01 |
Family
ID=14359826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920001883A KR950009900B1 (ko) | 1991-02-19 | 1992-02-10 | 전기부품용 소케트에 있어서의 접촉부 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5286208A (ko) |
EP (1) | EP0500227B1 (ko) |
JP (1) | JPH07109780B2 (ko) |
KR (1) | KR950009900B1 (ko) |
CA (1) | CA2060632A1 (ko) |
DE (1) | DE69203745D1 (ko) |
MY (1) | MY108180A (ko) |
Families Citing this family (53)
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DE69908638T2 (de) * | 1998-12-02 | 2004-04-29 | Formfactor, Inc., Livermore | Lithographische kontaktstrukturen |
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US6491968B1 (en) | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6056576A (en) * | 1999-04-26 | 2000-05-02 | Hon Hai Precision Ind. Co., Ltd. | ZIF socket with top loading contacts |
US6794890B1 (en) | 1999-07-27 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US7189077B1 (en) | 1999-07-30 | 2007-03-13 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
US6672912B2 (en) * | 2000-03-31 | 2004-01-06 | Intel Corporation | Discrete device socket and method of fabrication therefor |
DE10027125A1 (de) | 2000-05-31 | 2001-12-06 | Wabco Gmbh & Co Ohg | Elektrischer Steckkontakt |
US6501655B1 (en) | 2000-11-20 | 2002-12-31 | Intel Corporation | High performance fin configuration for air cooled heat sinks |
MXPA03004441A (es) * | 2000-11-20 | 2005-01-25 | Intel Corp | Configuraciones de pileta termica de alto desempeno para utilizarse en aplicaciones de empaque de alta densidad. |
US6633484B1 (en) | 2000-11-20 | 2003-10-14 | Intel Corporation | Heat-dissipating devices, systems, and methods with small footprint |
US6388207B1 (en) | 2000-12-29 | 2002-05-14 | Intel Corporation | Electronic assembly with trench structures and methods of manufacture |
US6811406B2 (en) | 2001-04-12 | 2004-11-02 | Formfactor, Inc. | Microelectronic spring with additional protruding member |
US6671172B2 (en) * | 2001-09-10 | 2003-12-30 | Intel Corporation | Electronic assemblies with high capacity curved fin heat sinks |
US7265565B2 (en) | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
US20080157793A1 (en) * | 2003-02-04 | 2008-07-03 | Microfabrica Inc. | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes |
US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
US7265562B2 (en) * | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
JP4421481B2 (ja) | 2003-05-13 | 2010-02-24 | 株式会社日本マイクロニクス | 通電試験用プローブ |
TW200536039A (en) * | 2003-12-31 | 2005-11-01 | Microfabrica Inc | Cantilever microprobes for contacting electronic components and methods for making such probes |
JP4592292B2 (ja) * | 2004-01-16 | 2010-12-01 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN2800519Y (zh) * | 2005-04-28 | 2006-07-26 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP2008196914A (ja) * | 2007-02-09 | 2008-08-28 | Micronics Japan Co Ltd | プローブおよびプローブ組立体 |
US20090009197A1 (en) * | 2007-07-02 | 2009-01-08 | Kabushiki Kaisha Nihon Micronics | Probe for electrical test |
US7589547B2 (en) * | 2007-09-13 | 2009-09-15 | Touchdown Technologies, Inc. | Forked probe for testing semiconductor devices |
DE102008023761B9 (de) * | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
US8089294B2 (en) * | 2008-08-05 | 2012-01-03 | WinMENS Technologies Co., Ltd. | MEMS probe fabrication on a reusable substrate for probe card application |
US7737714B2 (en) * | 2008-11-05 | 2010-06-15 | Winmems Technologies Holdings Co., Ltd. | Probe assembly arrangement |
US7928751B2 (en) * | 2009-02-18 | 2011-04-19 | Winmems Technologies Holdings Co., Ltd. | MEMS interconnection pins fabrication on a reusable substrate for probe card application |
JP4883215B1 (ja) * | 2010-10-29 | 2012-02-22 | オムロン株式会社 | 端子およびこれを用いたコネクタ |
JP4811530B1 (ja) * | 2010-11-04 | 2011-11-09 | オムロン株式会社 | 端子およびこれを用いたコネクタ |
JP5083427B2 (ja) * | 2011-03-14 | 2012-11-28 | オムロン株式会社 | 端子およびこれを用いたコネクタ |
JP5083426B2 (ja) * | 2011-03-14 | 2012-11-28 | オムロン株式会社 | 端子およびこれを用いたコネクタ |
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US9052342B2 (en) | 2011-09-30 | 2015-06-09 | Formfactor, Inc. | Probe with cantilevered beam having solid and hollow sections |
JP2014013184A (ja) * | 2012-07-04 | 2014-01-23 | Micronics Japan Co Ltd | カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット |
US9086433B2 (en) | 2012-12-19 | 2015-07-21 | International Business Machines Corporation | Rigid probe with compliant characteristics |
DE102017209510A1 (de) * | 2017-06-06 | 2018-12-06 | Feinmetall Gmbh | Kontaktelementsystem |
EP3499653B1 (en) * | 2017-12-12 | 2021-08-18 | Rasco GmbH | Contactor spring and contactor socket |
US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
US11768227B1 (en) | 2019-02-22 | 2023-09-26 | Microfabrica Inc. | Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers |
JP2021028603A (ja) * | 2019-08-09 | 2021-02-25 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
JP7353859B2 (ja) * | 2019-08-09 | 2023-10-02 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
US11802891B1 (en) | 2019-12-31 | 2023-10-31 | Microfabrica Inc. | Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using |
US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
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US4188085A (en) * | 1978-09-27 | 1980-02-12 | Burroughs Corporation | High density solder tail connector assembly for leadless integrated circuit packages |
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US4995816A (en) * | 1989-09-29 | 1991-02-26 | Amp Incorporated | Pivotal electrical contact |
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-
1991
- 1991-02-19 JP JP3103656A patent/JPH07109780B2/ja not_active Expired - Lifetime
-
1992
- 1992-02-03 EP EP92300903A patent/EP0500227B1/en not_active Expired - Lifetime
- 1992-02-03 DE DE69203745T patent/DE69203745D1/de not_active Expired - Lifetime
- 1992-02-04 US US07/831,573 patent/US5286208A/en not_active Expired - Lifetime
- 1992-02-04 CA CA002060632A patent/CA2060632A1/en not_active Abandoned
- 1992-02-10 KR KR1019920001883A patent/KR950009900B1/ko not_active IP Right Cessation
- 1992-02-18 MY MYPI92000266A patent/MY108180A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY108180A (en) | 1996-08-30 |
KR950009900B1 (ko) | 1995-09-01 |
JPH07109780B2 (ja) | 1995-11-22 |
EP0500227A3 (en) | 1992-11-25 |
JPH0594856A (ja) | 1993-04-16 |
EP0500227A2 (en) | 1992-08-26 |
DE69203745D1 (de) | 1995-09-07 |
US5286208A (en) | 1994-02-15 |
CA2060632A1 (en) | 1992-08-20 |
EP0500227B1 (en) | 1995-08-02 |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |