KR920017301A - 전기부품용 소케트에 있어서의 접촉부 - Google Patents

전기부품용 소케트에 있어서의 접촉부 Download PDF

Info

Publication number
KR920017301A
KR920017301A KR1019920001883A KR920001883A KR920017301A KR 920017301 A KR920017301 A KR 920017301A KR 1019920001883 A KR1019920001883 A KR 1019920001883A KR 920001883 A KR920001883 A KR 920001883A KR 920017301 A KR920017301 A KR 920017301A
Authority
KR
South Korea
Prior art keywords
contact
spring
socket
terminal
electrical component
Prior art date
Application number
KR1019920001883A
Other languages
English (en)
Other versions
KR950009900B1 (ko
Inventor
노리유끼 마쯔오까
Original Assignee
야마나까 가즈다까
야마이찌 덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 야마나까 가즈다까, 야마이찌 덴끼 가부시끼가이샤 filed Critical 야마나까 가즈다까
Publication of KR920017301A publication Critical patent/KR920017301A/ko
Application granted granted Critical
Publication of KR950009900B1 publication Critical patent/KR950009900B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/10Sockets for co-operation with pins or blades
    • H01R13/11Resilient sockets
    • H01R13/112Resilient sockets forked sockets having two legs

Landscapes

  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

내용 없음

Description

전기부품용 소케트에 있어서의 접촉부
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 접촉부의 투시도, 제2도는 상기 접촉부의 측면도, 제3도는 상기 접촉부의 변위상태를 보여주는 측면도.

Claims (3)

  1. 제1스프링부, 상기 제1스프링부로부터 간격을 두고 떨어져 있으나 기저단 및 말초단에서 제1스프링부와 연결되는 제2스프링부, 기저단사이의 연결부에 연속적으로 이르고 배선기판 또는 그와 유사한 것과 접촉되도록 된 단자부 및 말초단 사이의 연결부에 형성되어 그위에 장착될 전기부품의 단자와 접촉되도록 된 장착접촉부를 포함하고, 상기 제1 및 제2스프링부는 장착 접촉부를 하향으로 변위시키기 위해 기저단사이의 연결부 주위로 굽어지고, 상기 장착 접촉부는 상기 제1 및 제2스프링부의 반작용에 의해 그위에 장착된 전기부품의 단자와 압력접촉하는 것을 특징으로 하는 전기부품 소케트의 접촉부.
  2. 제1항에 있어서, 상기 제1 및 제2스프링부는 일반적으로 평행관계에 있는 것을 특징으로 하는 전기부품 소케트의 접촉부.
  3. 제1항 또는 제2항에 있어서, 상기 제1 및 제2스프링부는 일반적으로 길이가 동일한 것을 특징으로 하는 전기부품 소케트의 접촉부.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019920001883A 1991-02-19 1992-02-10 전기부품용 소케트에 있어서의 접촉부 KR950009900B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-103656 1991-02-19
JP3103656A JPH07109780B2 (ja) 1991-02-19 1991-02-19 電気部品用ソケットにおけるコンタクト

Publications (2)

Publication Number Publication Date
KR920017301A true KR920017301A (ko) 1992-09-26
KR950009900B1 KR950009900B1 (ko) 1995-09-01

Family

ID=14359826

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920001883A KR950009900B1 (ko) 1991-02-19 1992-02-10 전기부품용 소케트에 있어서의 접촉부

Country Status (7)

Country Link
US (1) US5286208A (ko)
EP (1) EP0500227B1 (ko)
JP (1) JPH07109780B2 (ko)
KR (1) KR950009900B1 (ko)
CA (1) CA2060632A1 (ko)
DE (1) DE69203745D1 (ko)
MY (1) MY108180A (ko)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7063541B2 (en) 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
DE69908638T2 (de) * 1998-12-02 2004-04-29 Formfactor, Inc., Livermore Lithographische kontaktstrukturen
US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6056576A (en) * 1999-04-26 2000-05-02 Hon Hai Precision Ind. Co., Ltd. ZIF socket with top loading contacts
US6794890B1 (en) 1999-07-27 2004-09-21 Mitsubishi Denki Kabushiki Kaisha Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6780001B2 (en) * 1999-07-30 2004-08-24 Formfactor, Inc. Forming tool for forming a contoured microelectronic spring mold
US7189077B1 (en) 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
DE10027125A1 (de) 2000-05-31 2001-12-06 Wabco Gmbh & Co Ohg Elektrischer Steckkontakt
US6501655B1 (en) 2000-11-20 2002-12-31 Intel Corporation High performance fin configuration for air cooled heat sinks
MXPA03004441A (es) * 2000-11-20 2005-01-25 Intel Corp Configuraciones de pileta termica de alto desempeno para utilizarse en aplicaciones de empaque de alta densidad.
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
US6388207B1 (en) 2000-12-29 2002-05-14 Intel Corporation Electronic assembly with trench structures and methods of manufacture
US6811406B2 (en) 2001-04-12 2004-11-02 Formfactor, Inc. Microelectronic spring with additional protruding member
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US20080157793A1 (en) * 2003-02-04 2008-07-03 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US7265562B2 (en) * 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
JP4421481B2 (ja) 2003-05-13 2010-02-24 株式会社日本マイクロニクス 通電試験用プローブ
TW200536039A (en) * 2003-12-31 2005-11-01 Microfabrica Inc Cantilever microprobes for contacting electronic components and methods for making such probes
JP4592292B2 (ja) * 2004-01-16 2010-12-01 株式会社日本マイクロニクス 電気的接続装置
CN2800519Y (zh) * 2005-04-28 2006-07-26 富士康(昆山)电脑接插件有限公司 电连接器
JP2008196914A (ja) * 2007-02-09 2008-08-28 Micronics Japan Co Ltd プローブおよびプローブ組立体
US20090009197A1 (en) * 2007-07-02 2009-01-08 Kabushiki Kaisha Nihon Micronics Probe for electrical test
US7589547B2 (en) * 2007-09-13 2009-09-15 Touchdown Technologies, Inc. Forked probe for testing semiconductor devices
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US8089294B2 (en) * 2008-08-05 2012-01-03 WinMENS Technologies Co., Ltd. MEMS probe fabrication on a reusable substrate for probe card application
US7737714B2 (en) * 2008-11-05 2010-06-15 Winmems Technologies Holdings Co., Ltd. Probe assembly arrangement
US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
JP4883215B1 (ja) * 2010-10-29 2012-02-22 オムロン株式会社 端子およびこれを用いたコネクタ
JP4811530B1 (ja) * 2010-11-04 2011-11-09 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083427B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
JP2014013184A (ja) * 2012-07-04 2014-01-23 Micronics Japan Co Ltd カンチレバー型プローブ集合体とそれを備えるプローブカード又はプローブユニット
US9086433B2 (en) 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
EP3499653B1 (en) * 2017-12-12 2021-08-18 Rasco GmbH Contactor spring and contactor socket
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
JP7353859B2 (ja) * 2019-08-09 2023-10-02 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188085A (en) * 1978-09-27 1980-02-12 Burroughs Corporation High density solder tail connector assembly for leadless integrated circuit packages
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
US4370012A (en) * 1980-11-20 1983-01-25 Amp Incorporated Electrical connector for circuit board or substrate
JPS61150249A (ja) * 1984-12-24 1986-07-08 Toshiba Corp 半導体装置用ソケツトピン
US4832617A (en) * 1988-03-31 1989-05-23 Foxx Conn International, Inc. Circuit board socket, contact and method of manufacture
CA1303175C (en) * 1988-04-27 1992-06-09 Imants R. Lauks Static-free interrogating connector for electric components
JP2602551B2 (ja) * 1989-06-13 1997-04-23 山一電機工業株式会社 バイパス片を有するコンタクト
US4959029A (en) * 1989-08-18 1990-09-25 Amp Incorporated Electrical contact
US4995816A (en) * 1989-09-29 1991-02-26 Amp Incorporated Pivotal electrical contact
US5100338A (en) * 1990-08-31 1992-03-31 Foxconn International, Inc. Contact for circuit board socket

Also Published As

Publication number Publication date
MY108180A (en) 1996-08-30
KR950009900B1 (ko) 1995-09-01
JPH07109780B2 (ja) 1995-11-22
EP0500227A3 (en) 1992-11-25
JPH0594856A (ja) 1993-04-16
EP0500227A2 (en) 1992-08-26
DE69203745D1 (de) 1995-09-07
US5286208A (en) 1994-02-15
CA2060632A1 (en) 1992-08-20
EP0500227B1 (en) 1995-08-02

Similar Documents

Publication Publication Date Title
KR920017301A (ko) 전기부품용 소케트에 있어서의 접촉부
KR910020972A (ko) 전기통신케이블용 콘넥터구조
KR960030755A (ko) 도전성 접점
KR940003126A (ko) 부동형 전기 커넥터
KR890700942A (ko) 장착수단을 가진 전기커넥터 보호부재
KR870003681A (ko) 리드(lead)를 갖는 전기부품
KR900017238A (ko) 용량 결합된 접속기
KR930024226A (ko) 하우징과 접촉부 사이에 과응력 방지 수단을 갖는 전기 커넥터
KR870006824A (ko) 전극 부품을 표면 장착하기 위한 안전형 리드 구조체
KR860007852A (ko) Plcc용 테스트 클립
KR890012413A (ko) 힌지(hinged)전기 콘넥터
KR850000144A (ko) 간이 전기스위치
KR920000151A (ko) 전기커넥터 및 전기 커넥터용 콘택트
KR910020971A (ko) 인쇄 회로 기판용 고밀도 전기 컨넥터 조립체
KR900010839A (ko) 전기 스위치
KR910002046A (ko) 바이패스편을 가지는 콘택트
KR970703630A (ko) 표면 조립된 플러그 인 커넥터(surface-mounted plug-in connector)
KR920019016A (ko) 장착-접촉형 콘택트
KR970031104A (ko) 전기 커넥터(electrical connector)
KR880005633A (ko) 가변저항기
KR950703217A (ko) 잭 커넥터 장치(Jack Connector Device)
FR2709879B1 (fr) Connecteur à organes de contact autodénudants.
KR910700559A (ko) 전기 커넥터
KR970060577A (ko) 부품의 전기 콘택팅용 콘택 스프링
KR960030497A (ko) 하우징내의 다수의 궤적들을 갖는 다수의 전기 도선들을 선택적으로 전기 접속시키는 시스템

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee