KR920003399Y1 - Connector - Google Patents
Connector Download PDFInfo
- Publication number
- KR920003399Y1 KR920003399Y1 KR2019890019380U KR890019380U KR920003399Y1 KR 920003399 Y1 KR920003399 Y1 KR 920003399Y1 KR 2019890019380 U KR2019890019380 U KR 2019890019380U KR 890019380 U KR890019380 U KR 890019380U KR 920003399 Y1 KR920003399 Y1 KR 920003399Y1
- Authority
- KR
- South Korea
- Prior art keywords
- housing
- wafer
- coupling
- substrate
- terminal
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 하우징 평면도.1 is a plan view of the housing of the present invention.
제2도는 하우징 정면도.2 is a front view of the housing.
제3도는 하우징 종단면도.3 is a longitudinal section of the housing.
제4도는 본 고안의 웨이퍼 평면도.4 is a plan view of a wafer of the present invention.
제5도는 웨이퍼 정면도.5 is a wafer front view.
제6도는 웨이퍼 종단면도.6 is a wafer longitudinal cross-sectional view.
제7도는 하우징과 웨이퍼가 결합된 본 고안의 작용상태도.7 is a working state of the present invention coupled to the housing and the wafer.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
2 : 웨이퍼 4 : 하우징2: wafer 4: housing
6 : 암대응면 7 : 결합공6: arm facing surface 7: coupling hole
9 : 체결돌기 10 : 체결공9: fastening protrusion 10: fastening hole
12 : 숫단자 14 : 결합부12: male terminal 14: coupling portion
15 : 숫대응면 17 : 격벽15: male countertop 17: bulkhead
18 : 암단자 19 : 음차부(tuning fork)18: female terminal 19: tuning fork
본 고안은 다극으로 구성되는 하우징과 웨이퍼를 결합하여 기판과 기판을 수평 연결하기 위한 기판연결용 코넥터에 관한 것이다.The present invention relates to a substrate connecting connector for horizontally connecting a substrate and the substrate by combining the housing and the wafer constituted of a multi-pole.
종래 음차부(tuning fork : 音叉部)가 형성된 단자를 갖는 코넥터에 있어서는 단순히 하우징상에 웨이퍼를 결합하여 기판과 기판을 수평하게 연결하기 때문에 그 결합이 결합오차가 발생할 경우에는 웨이퍼의 단자가 하우징의 제위치에 끼워지지 않게되고, 또한 장착후에도 기판의 외력이 작용하게 되면 하우징과 웨이퍼가 유동하게 되어 전기적 특성을 저해하게 되는 결함이 있었다.In the conventional connector having a terminal having a tuning fork, the wafer is simply joined to the housing to connect the substrate to the substrate horizontally. When the coupling error occurs, the terminal of the wafer is connected to the housing. There was a defect that the housing and the wafer would flow if the external force of the substrate was applied even after the mounting was prevented from being put into place.
본 고안은 종래의 이와같은 문제점을 해결하기 위하여 안출된 것으로서 하우징과 웨이퍼를 긴민하게 암수결합되게 하고 하우징과 웨이퍼의 단자 하단부 양측을 각각 구부림하여 기판장착성 및 기판 보지성을 향상시킨 코넥터를 제공함에 그 목적이 있는 것이다.The present invention has been made to solve such a problem in the prior art to provide a connector that allows the male and female housings to be intimately coupled with the housing and bends both sides of the terminal lower ends of the housing and the wafer, thereby improving substrate mountability and substrate holding property. There is a purpose.
이하 본 고안을 첨부된 도면에 의거하여 구체적으로 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
본 고안은 하부기관(1)에 장착될 수 있는 웨이퍼(2)와 상부기판(3)에 장착될 수 있는 하우징(4)으로 구성된다.The present invention consists of a wafer (2) that can be mounted on the lower organ (1) and a housing (4) that can be mounted on the upper substrate (3).
상기 웨이퍼(2)는 회로수 3극 내지 20극으로 구성되는 것으로서 제1도 내지 제3도에서 보는 바와같이 하우징(4)의 삽입을 용이하게 하기 위한 유도턱(5)과 일방향으로만 끼워질 수 있게 하기 위한 암대응면(6)을 일측모서리에 갖는 결합공(7)이 형성되고, 이 결합공(7)의 저면에는 하우징(4)이 결합공(7)에 끼워지면서 하우징(4)의 상면과 대접할 수 있는 저지면(8)이 치형으로 형성되며, 결합공(7)의 양측 중앙에는 하우징(4)의 체결돌기(9)가 체결될 수 있는 체결공(10)이 뚫려 있다.The wafer 2 is composed of three to twenty poles of circuit number, and as shown in FIGS. 1 to 3, the wafer 2 may be fitted only in one direction with the guide jaw 5 to facilitate the insertion of the housing 4. A coupling hole 7 having a female counterpart 6 on one side edge is formed, and the housing 4 is fitted into the coupling hole 7 at the bottom of the coupling hole 7. Stopping surface (8) that can be treated with the upper surface of the teeth is formed in the teeth, the coupling hole (10) for fastening the projection (9) of the housing (4) is drilled in the center of both sides of the coupling hole (7). .
또, 웨이퍼(2)의 하부 양측에는 하부기관(1)과 대접할 수 있는 지지체(11)가 돌출 형성되며, 웨이퍼(2)의 중앙에는 3개 내지 20개의 숫단자(12)가 횡으로 일정 간격을 유지라며 매설되어 있다.In addition, support bodies 11 that can enter the lower engine 1 are projected on both lower sides of the wafer 2, and three to twenty male terminals 12 are horizontally fixed at the center of the wafer 2. It is buried to keep the gap.
이 숫단자(12)의 상부는 결합공(7)내로, 하부는 외부로 돌출된 것으로서 웨이퍼(2) 양단에 위치하는 숫단자(12)의 하부는 하부기판(1)의 단자공(13)에 탄설되도록 하기 위하여 구부림 되어있다.The upper portion of the male terminal 12 protrudes into the coupling hole 7 and the lower portion protrudes outward, and the lower portion of the male terminal 12 positioned at both ends of the wafer 2 is the terminal hole 13 of the lower substrate 1. It is bent to allow it to be coalesced.
하우징(4)은 회로수 3극 내지 20극으로 구성된 것으로서 제4도 내지 제6도에서 보는 바와같이 상부에 웨이퍼(2)의 결합공(7)에 대응되게 삽입될 수 있는 결합부(14)를 가지며, 이 결합부(14)의 양측 전방 모서리에는 결합공(7)이 암대응면(6)과 일치되게 대접할 수 있는 숫대응면(15)이 형성되고, 결합부(14)의 양측 상부에는 결합공(7)의 체결공(10)에 탄력적으로 체결될 수 있는 체결돌기(9)가 각각 형성되어 있다.The housing 4 has a circuit number of 3 to 20 poles, and as shown in FIGS. 4 to 6, a coupling part 14 which can be inserted into the coupling hole 7 of the wafer 2 at an upper portion thereof. At both front edges of the coupling portion 14, male mating surfaces 15 are formed to allow the coupling holes 7 to be matched with the female counter surface 6, and both sides of the coupling portion 14 are formed. Fastening protrusions 9 that can be elastically fastened to the fastening holes 10 of the coupling holes 7 are respectively formed at the top.
이와같은 하우징(4)의 중앙, 즉 결합부(14)의 중앙에는 격벽(16)을 사이에 두고 3개 내지 20개 십자공(17)이 횡으로 일정하게 형성되고 이 십자공(17)내에는 암단자(18)의 음차부(19)가 위치하데 되는바 상기와 같은 음차부(19)가 상부에 형성되고 중간에 돌기(20)가 형성되는 암단자(18)는 하부가 외부로 돌출된채 하우징(4)의 중앙에 매설되 어진다.In the center of the housing 4, that is, in the center of the coupling portion 14, three to twenty cross holes 17 are uniformly formed laterally with the partition wall 16 interposed therebetween. Is the tuning fork part 19 of the female terminal 18 is to be located bar as described above the tuning fork part 19 is formed on the top and the protrusion 20 is formed in the middle of the female terminal 18 is protruded to the outside. It is embedded in the center of the housing (4).
이 암단자(18)중에서 하우징(4) 양단자에 위치하는 암단자(18)의 하부는 상부기판(3)의 단자공(21)에 탄설 되도록 하기 위하여 구부림되어 있다.The lower part of the female terminal 18 located in the both ends of the housing 4 of this female terminal 18 is bent so that it may be coalesced in the terminal hole 21 of the upper board 3.
이와같이 구성된 본 고안의 작용효과를 설명하면 다음과 같다.Referring to the effect of the present invention configured as described above are as follows.
먼저, 숫단자(12)를 이와 대응되게 천공되어 있는 단자공(13)에 끼워 웨이퍼(2)를 하부기판(1)상에 장착한다.First, the male terminal 12 is inserted into the terminal hole 13 correspondingly drilled to mount the wafer 2 on the lower substrate 1.
이와같은 장착에 의하여 지지체(11)는 하부기판(1)과 대접하게 되고 웨이퍼(2) 양단의 구부림한 숫단자(12)는 단자공(13)에 탄성력을 발휘하여 긴밀하게 끼워지게 되므로 하부기판(1)의 후면에서 납땜작업이 완료될때 까지 유동하지 않고 긴밀하게 장착력을 유지하게 된다.By such mounting, the support 11 is brought into contact with the lower substrate 1, and the bent male terminal 12 at both ends of the wafer 2 is tightly inserted by exerting an elastic force in the terminal hole 13 so that the lower substrate is provided. At the back of (1), the mounting force is maintained without flowing until soldering is completed.
또한, 암단자(18)를 이와 대응되게 천공되어 있는 단자공(21)에 끼워 하우징(4)을 상부기판(3)상에 장착한다.In addition, the female terminal 18 is inserted into the terminal hole 21 correspondingly perforated to mount the housing 4 on the upper substrate 3.
이와같은 장착에 의하여 하우징(4) 양단의 구부림한 암단자(18)는 단자공(21)에 탄성력을 발휘하면서 긴밀하게 꺼워지게 되므로 상부기판(3)의 후면에서 납땜작업이 완료될 때 까지 유동하지 않고 긴밀하게 장착력을 유지하게 된다.By such mounting, the bent female terminal 18 at both ends of the housing 4 is turned off tightly while exerting elastic force on the terminal hole 21, and thus flows from the rear side of the upper substrate 3 until the soldering operation is completed. It will maintain the mounting force closely.
다음에 납땜에 의하여 장착이 완료된 웨이퍼(2)와 하우징(4)을 결합하게 되는 바 하우징(4)의 결합부(14)는 결합공(7)내로 끼워지게 되고 이와 동시에 암단자(18)의 음차부(19)에는 숫단자(12)가 끼워지게 된다.Next, the coupling portion 14 of the housing 4 is fitted into the coupling hole 7, which joins the wafer 2 and the housing 4 which have been mounted by soldering, and at the same time, the female terminal 18 The male terminal 12 is fitted into the tuning fork portion 19.
상기 하우징(4)의 결합부(14)는 최초에 결합공(7)상에 유도턱(5)에 의하여 결합공(7)내에 오차없이 안내되고 결합부(14)의 숫대응면(15)은 결합공(7)의 암대응면(6)과 일치되게 대접하면서 끼워지다가 결합부(14) 상면이 결합공(7)의 저지면(8)에 이르러서야 웨이퍼(2)와 하우징(4)의 결합이 완료되는 것이다.The engaging portion 14 of the housing 4 is initially guided without error into the engaging hole 7 by the guide jaw 5 on the engaging hole 7 and the male corresponding surface 15 of the engaging part 14 is provided. The silver is inserted into the mating surface of the coupling hole 7 to be aligned with the arm facing surface 6, and the upper surface of the coupling portion 14 reaches the blocking surface 8 of the coupling hole 7. Will be completed.
상기 결합시 결합부(14) 양측의 체결돌기(9)는 웨이퍼(2)의 결합공(7) 양측에 뚫려 있는 체결공(10)에 탄성적으로 끼워지므로 웨이퍼(2)와 하우징(4)이 결합방향으로 유동되지 않게 되는 것이다.The coupling protrusions 9 on both sides of the coupling portion 14 are elastically fitted to the coupling holes 10 drilled on both sides of the coupling hole 7 of the wafer 2, so that the wafer 2 and the housing 4 are coupled to each other. It will not flow in this coupling direction.
이상에서 설명한 바와 같이 본 고안은 하우징과 웨이퍼의 기판장착성을 향상시키면서 서로 X, Y, Z방향으로의 결합오차를 허용하지 않게 암수 결합되는 것으로서 그 기판보지성에 의하여 회로내의 전기적특성을 높이는 효과가 있는 것이다.As described above, the present invention improves the substrate mountability of the housing and the wafer, and is male and female, which does not allow a coupling error in the X, Y, and Z directions. will be.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019890019380U KR920003399Y1 (en) | 1989-12-20 | 1989-12-20 | Connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019890019380U KR920003399Y1 (en) | 1989-12-20 | 1989-12-20 | Connector |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910013110U KR910013110U (en) | 1991-07-30 |
KR920003399Y1 true KR920003399Y1 (en) | 1992-05-30 |
Family
ID=19293531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019890019380U KR920003399Y1 (en) | 1989-12-20 | 1989-12-20 | Connector |
Country Status (1)
Country | Link |
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KR (1) | KR920003399Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101532399B1 (en) * | 2015-02-10 | 2015-06-29 | 김나현 | Conector for printed circuit board |
-
1989
- 1989-12-20 KR KR2019890019380U patent/KR920003399Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101532399B1 (en) * | 2015-02-10 | 2015-06-29 | 김나현 | Conector for printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
KR910013110U (en) | 1991-07-30 |
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