KR920003028Y1 - Connector - Google Patents

Connector Download PDF

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Publication number
KR920003028Y1
KR920003028Y1 KR2019890019432U KR890019432U KR920003028Y1 KR 920003028 Y1 KR920003028 Y1 KR 920003028Y1 KR 2019890019432 U KR2019890019432 U KR 2019890019432U KR 890019432 U KR890019432 U KR 890019432U KR 920003028 Y1 KR920003028 Y1 KR 920003028Y1
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KR
South Korea
Prior art keywords
substrate
pin
housing
connector
wafer
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KR2019890019432U
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Korean (ko)
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KR910013107U (en
Inventor
정진택
Original Assignee
한국몰렉스 주식회사
정진택
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Priority to KR2019890019432U priority Critical patent/KR920003028Y1/en
Publication of KR910013107U publication Critical patent/KR910013107U/en
Application granted granted Critical
Publication of KR920003028Y1 publication Critical patent/KR920003028Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

내용 없음.No content.

Description

기판연결용 코넥터Board Connection Connector

제1도는 본 고안의 웨이퍼 사이도.1 is also a wafer between the present invention.

제2도는 웨이퍼의 단자사시도.2 is a terminal perspective view of a wafer.

제3도는 웨이퍼의 종단면도.3 is a longitudinal cross-sectional view of the wafer.

제4도는 본 고안의 하우징 사시도.4 is a perspective view of the housing of the present invention.

제5도는 일실시예를 나타낸 하우징의 단자사시도.Figure 5 is a terminal perspective view of the housing showing one embodiment.

제6도는 일실시예에 의한 하우징의 작용상태도.6 is a working state of the housing according to an embodiment.

제7도는 다른 실시예를 나타낸 하우징의 단자사시도.7 is a terminal perspective view of a housing showing another embodiment.

제8도는 다른 실시예에 의한 하우징의 작용상태도.8 is a working state of the housing according to another embodiment.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 웨이퍼 2 : 하우징1: wafer 2: housing

3 : 삽입공 4, 14, 14' : 단자3: insertion hole 4, 14, 14 ': terminal

6, 16 : 매설부 7, 17, 17' : 상부핀6, 16: buried part 7, 17, 17 ': upper pin

8, 18, 18', 18" : 긴착돌기 9, 19, 19' : 하부핀8, 18, 18 ', 18 ": Anchor 9, 19, 19': Lower pin

10 : 십자공 11 : 일자공10: crosshair 11: straight ball

12 : 상부절곡홈 13 : 하부절곡홈12: upper bending groove 13: lower bending groove

20 : 음차부 21 : 1점돌기20: tuning fork 21: 1-point projection

22 : 2점돌기 25 : 절곡핀22: 2-point protrusion 25: bending pin

본 고안은 다극으로 구성되는 하우징과 웨이퍼를 결합하여 기판과 기판을 수평 또는 수직 연결하기 위한 기판연결용 코넥터에 관한 것이다.The present invention relates to a substrate connecting connector for connecting a substrate and a substrate consisting of a multi-pole and a horizontal or vertical connection between the substrate and the substrate.

종래 음차부(tuning fork : 音叉部)를 갖는 하우징과, 이 하우징에 대응되게 결합되는 웨이퍼를 구비하여 기판과 기판을 수평 또는 수직으로 연결하는 코넥터에 있어서는 하우징과 웨이퍼가 안내 부재 없이 단순히 결합되기 때문에 결합 오차가 발생할시에는 쉽게 결합되지 않을 뿐만 아니라 결합후에도 기판에 작용되는 외력등에 의하여 단자간의 접속력이 떨어지는 결점을 갖고 있어 전기적 특성을 해하는 경우가 발생하게 되는 것이다.In a connector having a housing having a tuning fork and a wafer coupled correspondingly to the housing and connecting the substrate to the substrate horizontally or vertically, the housing and the wafer are simply joined without a guide member. When the coupling error occurs, not only is not easily coupled, but also after the coupling has a defect that the connection force between the terminals due to the external force acting on the substrate, which causes the case that the electrical characteristics are damaged.

본 고안은 종래의 이와같은 문제점을 해결하기 위하여 안출된 것으로서 웨이퍼에 안내부재를 갖게 하여 결합을 용이하게 하고 웨이퍼와 하우징에 매설되는 단자의 하부핀에는 긴착돌기를 형성시켜 기판에의 장착성을 좋게 하며, 하우징에 매설되는 단자의 음차부에는 접속력을 높이기 위해 2점돌기를 형성시켜 3방향에서 웨이퍼의 단자와 점접속되도록 하고, 하우징은 기판의 수평연결 뿐만 아니라 수직연결도 가능하도록 단자의 상부핀에 절곡핀을 일체로 형성시킨 것이다.The present invention has been made to solve such a problem in the prior art to have a guide member on the wafer to facilitate the coupling and to form a protruding protrusion on the lower pin of the terminal embedded in the wafer and the housing to improve the mountability on the substrate. In order to increase the connecting force, the tuning-in part of the terminal embedded in the housing forms a two-point protrusion to make a point connection with the wafer terminal in three directions, and the housing has an upper pin of the terminal to enable vertical connection as well as horizontal connection of the substrate. The bending pins are formed integrally with each other.

이와같은 본 고안을 첨부된 도면에 의거하여 구체적으로 설명하면 다음과 같다.This invention is described in detail with reference to the accompanying drawings as follows.

본 고안은 웨이퍼(1)와, 이 웨이퍼(1)에 숫결합될 수 있고 2가지 형태의 단자를 갖는 하우징(2)으로 구성된다.The present invention consists of a wafer 1 and a housing 2 that can be male coupled to the wafer 1 and has two types of terminals.

상기 웨이퍼(1)는 제1도 내지 제3도에서 보는 바와같이 일측이 개방된 삽입공(3)을 형성하고 이 삽입공(3)내의 저부에 2개 내지 20개의 단자(4)가 일정간격으로 매설된다.The wafer 1 forms an insertion hole 3 with one side open as shown in FIGS. 1 to 3, and two to twenty terminals 4 are arranged at a predetermined interval in the bottom of the insertion hole 3. Is buried.

제1도는 2개의 단자(4)가 배열된 웨이퍼(1)를 예시한다.1 illustrates a wafer 1 in which two terminals 4 are arranged.

상기 단자(4)는 중간에 돌기(5)를 가진 U자형의 매설부(6)를 가지며 상부에는 첨단이 테이퍼 형상을 하는 상부핀(7)이, 하부에는 상부핀(7)과 직각면을 갖도록 매설부(6)일측에 형성되어지고 중간에 긴착돌기(8)를 가진 하부핀(9)으로 구성된다.The terminal 4 has a U-shaped buried portion 6 having a protrusion 5 in the middle thereof, and an upper pin 7 having a tapered shape at the tip thereof, and a right angle surface with the upper pin 7 at the lower portion thereof. The buried portion 6 is formed on one side to have a lower pin (9) having a fastening protrusion (8) in the middle.

하우징(2)은 제4도에서 보는 바와같이 상부 중앙에 십자공(10)과, 이 십자공(10)과 연관되는 일자공(一字孔 : 11)이 형성된다.As shown in FIG. 4, the housing 2 has a cross hole 10 at the upper center, and a straight hole 11 associated with the cross hole 10 is formed.

상기 일자공(11)은 상하로 관통된것으로서 후술하는 상부핀(17, 17')이 삽설되고 이 일자공(11)전방에는 상하로 상부 절곡홈(12)과 하부절곡홈(13)이 형성되어 진다.The straight hole 11 is penetrated up and down, and the upper pins 17 and 17 'to be described later are inserted, and the upper bending groove 12 and the lower bending groove 13 are formed up and down in front of the straight hole 11. It is done.

상기 연관되는 십자공(10)과 일자공(11)은 하우징(2)상에 2개 내지 20개가 일정간격로 형성된다.The associated cross holes 10 and straight holes 11 are formed on the housing 2 at two to twenty at regular intervals.

제4도는 2개의 십자공(10)과 일자공(11)이 형성된 하우징(2)을 예시한다.4 illustrates a housing 2 in which two cross holes 10 and a straight hole 11 are formed.

이와같은 하우징(2)내에는 제5도에서 보는 바와같은 단자(14)가 매설되어 지는 바 이 단자(14)는 중간에 돌기(15)를 가진 U자형의 매설부(16)를 가지며, 매설부(16)중앙의 상하로는 첨단이 테이퍼 형상을 하는 상부핀(17)과 긴착돌기(18)가 중간에 형성된 하부핀(19)이 형성되어지고, 매설부(16)의 일측에는 상기 상부핀(17)과 직각면을 갖는 음차부(20)가 형성되어진다.In such a housing 2, a terminal 14 as shown in FIG. 5 is embedded. The terminal 14 has a U-shaped buried portion 16 having a protrusion 15 in the middle thereof. Upper and lower portions of the central portion 16 are formed with an upper pin 17 having a tapered shape and a lower pin 19 having an intermediate protrusion 18 formed therebetween, and on one side of the buried portion 16, the upper portion. A tuning fork portion 20 having a plane perpendicular to the pin 17 is formed.

상기 음차부(20)에는 웨이퍼(1)의 상부핀(7)이 끼워지게 되는 것으로 상기 상부핀(7)과의 접속력을 좋게 하기 위해 접속부위를 1점돌기(21)와 이 1점돌기(21)와 암결합 형식을 취하면서 상부핀(7)상에 1점돌기(21)와 함께 3방향에서 3점의 점접촉을 할수 있도록 하기 위한 2점돌기(22)가 형성되어 진다.The top pin 7 of the wafer 1 is inserted into the tuning fork part 20 so that the connection point with the top pin 7 is improved by one point protrusion 21 and this one point protrusion. A two-point protrusion 22 is formed on the upper pin 7 to allow three point contact in three directions with the one-point protrusion 21 on the upper pin 7.

이와같이 구성된 하우징(2)을 제6도에서 보는 바와같이 기판(23)에 장착하고 전기한 웨이퍼(1)를 기판(24)에 장착하게 된다.As shown in FIG. 6, the housing 2 configured as described above is mounted on the substrate 23, and the above-described wafer 1 is mounted on the substrate 24. As shown in FIG.

웨이퍼(1)와 하우징(2)을 각각 기판(24, 23)에 장착할 때에는 각 단자(4, 14)의 하부핀(9, 19)에 돌출된 긴착돌기(8, 18)에 의하여 각 단자(4, 14)의 하부핀(9, 19)과 일치되게 천공된 기판(24, 23)의 단자공(24', 23')에 유동없이 끼워지게 되므로 납땜작업이 용이하다.When the wafer 1 and the housing 2 are mounted on the substrates 24 and 23, respectively, each terminal is provided by the attachment protrusions 8 and 18 protruding from the lower pins 9 and 19 of the terminals 4 and 14. The soldering operation is easy because it is inserted into the terminal holes 24 ′ and 23 ′ of the substrates 24 and 23 perforated in accordance with the lower pins 9 and 19 of the 4 and 14.

이와같이 장착된 하우징(2)상에 웨이퍼(1)를 끼우면 하우징(2)이 웨이퍼(1)의 삽입공(3)내로 정확히 유도되면서 웨이퍼(1)의 상부핀(7)이 하우징(2)의 십자공(10)내에 위치하는 음차부(20)내로 3점 점접촉하면서 끼워지게 되는 것이다.When the wafer 1 is inserted onto the housing 2 thus mounted, the housing 2 is accurately guided into the insertion hole 3 of the wafer 1, so that the upper pin 7 of the wafer 1 is moved into the housing 2. It is to be inserted into three points in contact with the tuning fork portion 20 located in the cross hole (10).

상기한 단자(14)가 매설된 하우징(2)은 기판과 기판을 수평 연결하고 위한 것으로 기판과 기판을 수직 연결하기 위해서는 제7도 및 제8도에서 보는 바와같이 긴착돌기(18')를 가진 단자(14')의 하부핀(19')을 매설부(16)의 후방으로 절곡하여 하우징(2)의 하부절곡홈(13)에 삽착되게 하고, 길게 형성된 상부핀(17')의 전방을 절곡시켜 긴착돌기(18")를 갖는 절곡핀(25)이 형성되도록하여 이 절곡핀(25)이 하우징(2)의 상부절곡홈(12)에 삽착되게 하면 가능한 것이다.The housing 2 in which the terminal 14 is embedded is for horizontally connecting the substrate to the substrate. In order to vertically connect the substrate to the substrate, as shown in FIGS. 7 and 8, the housing 2 has an abutment protrusion 18 ′. The lower pin 19 'of the terminal 14' is bent to the rear of the buried portion 16 to be inserted into the lower bent groove 13 of the housing 2, and the front of the long upper pin 17 'is formed. It is possible to bend it so that the bending pin 25 which has the constriction | protrusion protrusion 18 "is formed so that this bending pin 25 may be inserted in the upper bending groove 12 of the housing 2.

제8도는 이와같은 단자(14')를 매설한 하우징(2)의 작용상태를 나타내는 것으로서 상기 하부핀(19')과 절곡핀(25)이 일치되게 끼워질 수 있는 단자공(26')을 가진 기판(26)에 하우징(2)을 장착하게 된다.FIG. 8 shows the operation state of the housing 2 in which the terminal 14 'is embedded. The terminal hole 26' into which the lower pin 19 'and the bending pin 25 can be fitted in the same manner is shown in FIG. The housing 2 is mounted on the excitation substrate 26.

상기의 경우 전술한 바 있는 단자(14)를 가진 하우징(2)에 비하여 기판(26)에의 보지성은 더욱 좋아진다.In this case, the holding property to the substrate 26 is better than that of the housing 2 having the terminal 14 described above.

기판(26)에 하우징(2)이 장착되면 기판(24)에 장착된 웨이퍼(1)가 전술한 바와같은 방식으로 하우징(2)에 결합되는 것이다.When the housing 2 is mounted on the substrate 26, the wafer 1 mounted on the substrate 24 is coupled to the housing 2 in the manner described above.

이상에서 설명한 바와같이 본 고안은 웨이퍼에 안내부재를 갖게 하므로서 결합이 용이해지고 웨이퍼와 하우징에 매설되는 단자의 하부핀 등에 긴착돌기를 형성하므로써 기판에의 장착성이 좋아지며, 하우징에 매설되는 단자의 음차부를 3점 점접속되도록 하므로써 접속력이 향상되며, 하부판과 상부핀을 절곡하므로써 기판의 수평연결 뿐만 아니라 수직연결도 가능하게 되는 것이다.As described above, the present invention facilitates the coupling by providing the guide member on the wafer, and improves the mountability on the substrate by forming a close protrusion on the wafer and the lower pin of the terminal embedded in the housing, and the tuning fork of the terminal embedded in the housing. The connection force is improved by allowing the three-point connection of the part, and the vertical connection as well as the horizontal connection of the substrate is possible by bending the lower plate and the upper pin.

Claims (4)

음차부를 갖는 단자가 다수 매설된 하우징과 상기 하우징에 대응결합되는 웨이퍼로서 조합구성되면서 수평 또는 수직상태로 배열되는 기판과 기판을 연결하도록 된 암.수 결합형 다극 코넥터를 형성함에 있어서, 코넥터를 구성하는 웨이퍼(1)는, 상면이 개방된 삽입공(3)을 형성함과 동시에 그 저면부에는 U자형의 매설공을 연설하고, 상기 매설공에는 기판과의 긴착결합수단을 갖는 다수의 숫단자(4)를 매설하여 이루는 한편, 상기 웨이퍼(1)에 결합되는 하우징(2)은 내부에 다수의 십자공(10)및 이에 연관되는 다수의 일자공(11)을 관통형성하고, 상기 일자공(11)의 전방 상, 하부에는 상부절곡홈(12)과 하부절곡홈(13)을 각각 요설형성하며, 각각의 십자공(10)과 일자공(11)에는 상기 숫단자(4)가 일치 삽입되도록된 소정형태의 음차부(20)가 형성된 다수의 암단자(14)를 매설하여 구성된 것을 특징으로 하는 기판연결용 코넥터.A connector is formed in forming a male-female coupled multipole connector configured to connect a substrate with a plurality of terminals having a tuning-fork part and a substrate arranged in a horizontal or vertical state while being combined as a housing correspondingly coupled to the housing. The wafer 1 has a plurality of male terminals which form an insertion hole 3 having an open upper surface and at the same time a U-shaped buried hole in its bottom portion, and the buried hole having a close coupling means with a substrate. While embedding (4), the housing (2) coupled to the wafer (1) penetrates a plurality of cross holes (10) and a plurality of linear holes (11) associated therewith, and the linear holes An upper bent groove 12 and a lower bent groove 13 are recessed in the front upper and lower portions of 11, respectively, and the male terminals 4 coincide with each of the cross holes 10 and the straight holes 11. A plurality of female terminals formed with a tuning fork portion 20 of a predetermined form to be inserted A connector for connecting a board, characterized in that (14) is embedded. 제1항에 있어서, 하우징(2)에 매설되는 암단자(14)는 중앙에 돌기(15)가 돌출형성된 U자형의 매설부(16) 일측으로 음차부(20)를 연장형성하여 이루고, 상기 음차부(20)에는 상호 대응되는 1점돌기(21)와 2점돌기(22)를 각각 형성하여 숫단자(4)와 3점 점접속되도록하는 한편, 매설부(16) 일측에는 상기 음차부(20)와 직각면을 이루는 상태로서 상부핀(17)과 하부핀(19)을 연장형성 하여 이루되, 하부핀(19)의 중앙부에는 긴착돌기(18)를 돌출형성함으로서 기판에 결합시 긴밀한 상태로 결합되도록하여 구성된 것을 특징으로하는 기판연결용 코넥터.The female terminal 14 embedded in the housing 2 is formed by extending the tuning fork portion 20 toward one side of the U-shaped buried portion 16 having a protrusion 15 protruding from the center. In the tuning fork part 20, the one-point protrusions 21 and the two-point protrusions 22 are respectively formed to be connected to the male terminal 4 and three-point points, respectively, while the buried part 16 has one side of the tuning fork part. The upper pin 17 and the lower pin 19 are formed to extend in a state perpendicular to the surface 20, and the center portion of the lower pin 19 protrudes to form a protruding protrusion 18 in close contact with the substrate. Connector for connecting the board, characterized in that configured to be coupled in a state. 제2항에 있어서, 암단자(14)를 이루는 상부편(25)과 하부핀(19')을 매설부(16)후방으로 절곡 형성하여 이룸과 동시에 각각의 상부핀(25)과 하부핀(19')중앙에는 긴착돌기(18", 18')를 돌출형성하여 이룸으로서 상부핀(25)과 하부핀(19')이 음차부(20)와 직각면을 이루도록하여 기판과의 수직결합이 가능토록 구성한 것을 특징으로 하는 기판 연결용 코넥터.The upper pin 25 and the lower pin 19 'constituting the female terminal 14 are bent to the rear of the buried portion 16, and at the same time, the upper pin 25 and the lower pin ( 19 ') in the center of the protrusions (18 ", 18') by forming a protrusion so that the upper pin 25 and the lower pin (19 ') forms a perpendicular surface to the tuning fork (20) is a vertical coupling with the substrate A connector for board connection, which is configured to be possible. 제1항에 있어서, 웨이퍼(1)에 매설되는 숫단자(4)는 전면중앙에 돌기(5)가 돌출형성된 U자형의 매설부(6)중앙상면과 하방일측으로 상부핀(7)과 하부핀(9)을 각각 연장형성하여 상호 직각면을 이루도록하되, 하부핀(9)의 중앙부에는 긴착돌기(8)를 돌출형성하여 구성된 것을 특징으로 하는 기판 연결용 코넥터.The male terminal 4 embedded in the wafer 1 has an upper pin 7 and a lower side of the U-shaped buried portion 6 in which the projection 5 protrudes from the front surface of the male terminal 4. Each of the pins (9) to extend to form a mutually perpendicular surface, the connector for connecting the substrate, characterized in that formed in the center of the lower pin (9) protruding the protruding projection (8).
KR2019890019432U 1989-12-21 1989-12-21 Connector KR920003028Y1 (en)

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KR920003028Y1 true KR920003028Y1 (en) 1992-05-18

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