KR920001640A - 변조방식을 이용한 플라즈마 발생장치 및 방법 - Google Patents
변조방식을 이용한 플라즈마 발생장치 및 방법 Download PDFInfo
- Publication number
- KR920001640A KR920001640A KR1019900008939A KR900008939A KR920001640A KR 920001640 A KR920001640 A KR 920001640A KR 1019900008939 A KR1019900008939 A KR 1019900008939A KR 900008939 A KR900008939 A KR 900008939A KR 920001640 A KR920001640 A KR 920001640A
- Authority
- KR
- South Korea
- Prior art keywords
- voltage
- modulation
- synthesizer
- signal generator
- generator
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 7
- 230000002194 synthesizing effect Effects 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32678—Electron cyclotron resonance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 3도는 본 발명을 달성하기 위한 마그네틱코일 전류발생장치의 블록도.
제 4(a)도 내지 제 4(d)도는 제 3도의 신호발생기에서 만들어내는 전압파형을 나타낸 도면.
제 5(a) 내지 제5(d)도는 제 3도의 전류발생장치에 의해 만들어진 변조된 전류파형을 나타낸 도면.
Claims (6)
- 마그네틱코일과, 신호발생기와, 고정전류방식에서 가변전류로 변경하기 위해 변조용 신호발생기의 출력전압과 기준전압을 합성하여 변조된 전압파형을 만드는 전압형성기와, 상기 전압합성기의 출력전압을 전압에 의해 가변하는 전류 전원장치로 구성되고, 전압합성기를 이용하여 기준전압과 변조용 신호발생기의 전압을 변조시켜 전압에 의해 가변되는 전류전원장치에 입력시킴으로써 자장용 코일의 전류를 변조시켜서 플라즈마 균일성을 증가시키는 것을 특징으로 하는 방법.
- 제 1항에 있어서, 변조용 신호발생기의 듀티사이클이 0.1 내지 0.9가 되고 주파수는 1/10 내지 10㎐이 되는 것을 특징으로 하는 방법.
- 제 1항에 있어서, t₁과 t₂의 듀티사이클과 주파수 T를 적절히 설정할 경우 이온밀도가 평균화되어 웨이퍼 전체 직경에 대하여 비교적 평평한 이온밀도분포를 가지는 것을 특징으로 하는 방법.
- 제 1항에 있어서, 변조전류 발생장치를 1개 이상 사용하여 두 코일에 의한 플라즈마 이온밀도분포의 합성이 평탄화 되도록 하는 것을 특징으로하는 방법.
- 제 1항에 있어서, 변조용 신호발생기의 출력파형이 구형파, 톱니파, 나사산파, 싸인파 등을 사용하는 것을 특징으로 하는 방법.
- 마그테닉코일과, 여러개의 출력파형을 사용하는 신호발생기와, 고정전류방식에서 가변전류로 변경하기 위해 변조용 신호 발생기의 출력전압과 기준전압을 합성하여 변조된 전압파형을 만드는 전압합성기와, 상기 전압합성기의 출력전압을 전압에 의해 가변하는 전류 전원장치로 구성된 것을 특징으로 하는 플라즈마 발생장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900008939A KR930004713B1 (ko) | 1990-06-18 | 1990-06-18 | 변조방식을 이용한 플라즈마 발생장치 및 방법 |
JP2201077A JPH0783016B2 (ja) | 1990-06-18 | 1990-07-27 | 変調方式を用いるプラズマ発生装置及び方法 |
US07/560,756 US5087857A (en) | 1990-06-18 | 1990-07-31 | Plasma generating apparatus and method using modulation system |
DE4027341A DE4027341A1 (de) | 1990-06-18 | 1990-08-29 | Vorrichtung und verfahren zum erzeugen eines plasmas |
GB9022039A GB2245416B (en) | 1990-06-18 | 1990-10-10 | A magnetic field generating apparatus and a plasma generating apparatus for use therewith |
TW079109533A TW198764B (ko) | 1990-06-18 | 1990-11-13 | |
HK89997A HK89997A (en) | 1990-06-18 | 1997-06-26 | A magnetic field generating apparatus and a plasma generating apparatus for use therewith |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019900008939A KR930004713B1 (ko) | 1990-06-18 | 1990-06-18 | 변조방식을 이용한 플라즈마 발생장치 및 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920001640A true KR920001640A (ko) | 1992-01-30 |
KR930004713B1 KR930004713B1 (ko) | 1993-06-03 |
Family
ID=19300212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900008939A KR930004713B1 (ko) | 1990-06-18 | 1990-06-18 | 변조방식을 이용한 플라즈마 발생장치 및 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5087857A (ko) |
JP (1) | JPH0783016B2 (ko) |
KR (1) | KR930004713B1 (ko) |
DE (1) | DE4027341A1 (ko) |
GB (1) | GB2245416B (ko) |
HK (1) | HK89997A (ko) |
TW (1) | TW198764B (ko) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2546405B2 (ja) * | 1990-03-12 | 1996-10-23 | 富士電機株式会社 | プラズマ処理装置ならびにその運転方法 |
JP2584389B2 (ja) * | 1992-06-10 | 1997-02-26 | 栄電子工業 株式会社 | Ecrプラズマエッチング加工方法 |
JP2933802B2 (ja) * | 1992-06-22 | 1999-08-16 | 松下電器産業株式会社 | ドライエッチング方法およびその装置 |
JPH06342769A (ja) * | 1992-08-21 | 1994-12-13 | Nissin Electric Co Ltd | エッチング方法及び装置 |
JP2584396B2 (ja) * | 1992-10-08 | 1997-02-26 | 栄電子工業 株式会社 | Ecrプラズマ処理方法 |
JP2693899B2 (ja) * | 1992-10-09 | 1997-12-24 | 栄電子工業株式会社 | Ecrプラズマ加工方法 |
JP3252507B2 (ja) * | 1993-01-29 | 2002-02-04 | ソニー株式会社 | プラズマ処理装置 |
JP3036296B2 (ja) * | 1993-05-25 | 2000-04-24 | 富士通株式会社 | プラズマディスプレイ装置の電源装置 |
US5534108A (en) * | 1993-05-28 | 1996-07-09 | Applied Materials, Inc. | Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor |
KR100327346B1 (ko) | 1999-07-20 | 2002-03-06 | 윤종용 | 선택적 폴리머 증착을 이용한 플라즈마 식각방법 및 이를이용한 콘택홀 형성방법 |
US6566272B2 (en) | 1999-07-23 | 2003-05-20 | Applied Materials Inc. | Method for providing pulsed plasma during a portion of a semiconductor wafer process |
US20070048882A1 (en) * | 2000-03-17 | 2007-03-01 | Applied Materials, Inc. | Method to reduce plasma-induced charging damage |
US8617351B2 (en) * | 2002-07-09 | 2013-12-31 | Applied Materials, Inc. | Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction |
US8048806B2 (en) * | 2000-03-17 | 2011-11-01 | Applied Materials, Inc. | Methods to avoid unstable plasma states during a process transition |
US6472822B1 (en) | 2000-04-28 | 2002-10-29 | Applied Materials, Inc. | Pulsed RF power delivery for plasma processing |
US7374636B2 (en) * | 2001-07-06 | 2008-05-20 | Applied Materials, Inc. | Method and apparatus for providing uniform plasma in a magnetic field enhanced plasma reactor |
JP4009087B2 (ja) * | 2001-07-06 | 2007-11-14 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法 |
TWI283899B (en) * | 2002-07-09 | 2007-07-11 | Applied Materials Inc | Capacitively coupled plasma reactor with magnetic plasma control |
US7458335B1 (en) | 2002-10-10 | 2008-12-02 | Applied Materials, Inc. | Uniform magnetically enhanced reactive ion etching using nested electromagnetic coils |
US7422654B2 (en) * | 2003-02-14 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
US6942813B2 (en) * | 2003-03-05 | 2005-09-13 | Applied Materials, Inc. | Method of etching magnetic and ferroelectric materials using a pulsed bias source |
US7179754B2 (en) * | 2003-05-28 | 2007-02-20 | Applied Materials, Inc. | Method and apparatus for plasma nitridation of gate dielectrics using amplitude modulated radio-frequency energy |
US7521000B2 (en) * | 2003-08-28 | 2009-04-21 | Applied Materials, Inc. | Process for etching photomasks |
US7879510B2 (en) * | 2005-01-08 | 2011-02-01 | Applied Materials, Inc. | Method for quartz photomask plasma etching |
US7829243B2 (en) * | 2005-01-27 | 2010-11-09 | Applied Materials, Inc. | Method for plasma etching a chromium layer suitable for photomask fabrication |
US8293430B2 (en) * | 2005-01-27 | 2012-10-23 | Applied Materials, Inc. | Method for etching a molybdenum layer suitable for photomask fabrication |
US7790334B2 (en) * | 2005-01-27 | 2010-09-07 | Applied Materials, Inc. | Method for photomask plasma etching using a protected mask |
EP1753011B1 (de) * | 2005-08-13 | 2012-10-03 | HÜTTINGER Elektronik GmbH + Co. KG | Verfahren zur Erzeugung von Ansteuersignalen für HF-Leistungsgeneratoren |
DE102006052061B4 (de) * | 2006-11-04 | 2009-04-23 | Hüttinger Elektronik Gmbh + Co. Kg | Verfahren zur Ansteuerung von zumindest zwei HF-Leistungsgeneratoren |
US7786019B2 (en) * | 2006-12-18 | 2010-08-31 | Applied Materials, Inc. | Multi-step photomask etching with chlorine for uniformity control |
KR101953596B1 (ko) * | 2016-09-28 | 2019-03-04 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라스마 처리 장치 및 플라스마 처리 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2217415A (en) * | 1939-12-29 | 1940-10-08 | Gen Electric | Discharge apparatus |
BE517412A (ko) * | 1952-02-05 | |||
FR91221E (ko) * | 1963-03-08 | 1968-08-28 | ||
GB1525393A (en) * | 1974-10-02 | 1978-09-20 | Daido Steel Co Ltd | Heat treating apparatus and method |
EP0173583B1 (en) * | 1984-08-31 | 1990-12-19 | Anelva Corporation | Discharge apparatus |
JPS6393881A (ja) * | 1986-10-08 | 1988-04-25 | Anelva Corp | プラズマ処理装置 |
JPH0620048B2 (ja) * | 1987-01-30 | 1994-03-16 | 富士電機株式会社 | 乾式薄膜加工装置 |
US4818916A (en) * | 1987-03-06 | 1989-04-04 | The Perkin-Elmer Corporation | Power system for inductively coupled plasma torch |
DE3810197A1 (de) * | 1987-03-27 | 1988-10-13 | Mitsubishi Electric Corp | Plasma-bearbeitungseinrichtung |
US4911814A (en) * | 1988-02-08 | 1990-03-27 | Nippon Telegraph And Telephone Corporation | Thin film forming apparatus and ion source utilizing sputtering with microwave plasma |
JPH0233187A (ja) * | 1988-07-22 | 1990-02-02 | Mitsubishi Electric Corp | ラスター水平位置制御装置 |
JPH02174229A (ja) * | 1988-12-27 | 1990-07-05 | Sumitomo Metal Ind Ltd | プラズマ装置およびその使用方法 |
-
1990
- 1990-06-18 KR KR1019900008939A patent/KR930004713B1/ko not_active IP Right Cessation
- 1990-07-27 JP JP2201077A patent/JPH0783016B2/ja not_active Expired - Lifetime
- 1990-07-31 US US07/560,756 patent/US5087857A/en not_active Expired - Lifetime
- 1990-08-29 DE DE4027341A patent/DE4027341A1/de not_active Ceased
- 1990-10-10 GB GB9022039A patent/GB2245416B/en not_active Expired - Fee Related
- 1990-11-13 TW TW079109533A patent/TW198764B/zh active
-
1997
- 1997-06-26 HK HK89997A patent/HK89997A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW198764B (ko) | 1993-01-21 |
KR930004713B1 (ko) | 1993-06-03 |
GB9022039D0 (en) | 1990-11-21 |
DE4027341A1 (de) | 1991-12-19 |
GB2245416B (en) | 1994-11-16 |
US5087857A (en) | 1992-02-11 |
JPH0783016B2 (ja) | 1995-09-06 |
JPH0448726A (ja) | 1992-02-18 |
GB2245416A (en) | 1992-01-02 |
HK89997A (en) | 1997-08-01 |
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