KR880701456A - 반도체 소자 - Google Patents

반도체 소자

Info

Publication number
KR880701456A
KR880701456A KR1019870701116A KR870701116A KR880701456A KR 880701456 A KR880701456 A KR 880701456A KR 1019870701116 A KR1019870701116 A KR 1019870701116A KR 870701116 A KR870701116 A KR 870701116A KR 880701456 A KR880701456 A KR 880701456A
Authority
KR
South Korea
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
KR1019870701116A
Other languages
English (en)
Other versions
KR910005734B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR880701456A publication Critical patent/KR880701456A/ko
Application granted granted Critical
Publication of KR910005734B1 publication Critical patent/KR910005734B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02428Structure
    • H01L21/0243Surface structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02513Microstructure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647Lateral overgrowth
    • H01L21/0265Pendeoepitaxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Recrystallisation Techniques (AREA)
KR1019870701116A 1986-04-10 1987-03-19 반도체 소자 KR910005734B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US85048386A 1986-04-10 1986-04-10
US850483 1986-04-10
PCT/US1987/000612 WO1987006392A1 (en) 1986-04-10 1987-03-19 Semiconductor device including an epitaxial layer on a lattice-mismatched single crystal substrate

Publications (2)

Publication Number Publication Date
KR880701456A true KR880701456A (ko) 1988-07-27
KR910005734B1 KR910005734B1 (ko) 1991-08-02

Family

ID=25308247

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870701116A KR910005734B1 (ko) 1986-04-10 1987-03-19 반도체 소자

Country Status (7)

Country Link
EP (1) EP0263866B1 (ko)
JP (1) JP2854302B2 (ko)
KR (1) KR910005734B1 (ko)
CA (1) CA1272527A (ko)
DE (1) DE3779547T2 (ko)
ES (1) ES2004276A6 (ko)
WO (1) WO1987006392A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6428808A (en) * 1987-07-23 1989-01-31 Matsushita Electric Ind Co Ltd Method for growing epitaxial thin film crystal
US5079616A (en) * 1988-02-11 1992-01-07 Gte Laboratories Incorporated Semiconductor structure
GB8905511D0 (en) * 1989-03-10 1989-04-19 British Telecomm Preparing substrates
JP4569026B2 (ja) * 2001-03-30 2010-10-27 信越半導体株式会社 半導体基板及びその製造方法
JP7532366B2 (ja) * 2018-12-04 2024-08-13 エスアールアイ インターナショナル バンプボンディングを不要にするためのコンプライアント層の使用

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2757470A1 (de) * 1977-12-22 1979-07-05 Siemens Ag Verfahren zum herstellen einer halbleiteranordnung

Also Published As

Publication number Publication date
JP2854302B2 (ja) 1999-02-03
KR910005734B1 (ko) 1991-08-02
ES2004276A6 (es) 1988-12-16
DE3779547T2 (de) 1993-01-28
DE3779547D1 (de) 1992-07-09
JPS63503104A (ja) 1988-11-10
CA1272527A (en) 1990-08-07
EP0263866B1 (en) 1992-06-03
WO1987006392A1 (en) 1987-10-22
EP0263866A1 (en) 1988-04-20

Similar Documents

Publication Publication Date Title
KR900011017A (ko) 반도체장치
DE68926256D1 (de) Komplementäre Halbleiteranordnung
KR900007100A (ko) 반도체장치
KR850006779A (ko) 반도체 장치
KR860007755A (ko) 반도체 장치
DE3773957D1 (de) Halbleitervorrichtung.
KR900008703A (ko) 반도체 장치
KR900001037A (ko) 반도체 장치
KR860004470A (ko) 반도체 장치
DK297187A (da) Regnbuedannende anordning
KR880701017A (ko) 반도체 장치
DE68928760D1 (de) Halbleitervorrichtung
KR900702572A (ko) 반도체 장치
KR890015422A (ko) 반도체 장치
KR890004438A (ko) 반도체 장치
KR890005864A (ko) 반도체 장치
KR900008615A (ko) 반도체장치
KR890015471A (ko) 반도체 장치
DK360387A (da) Bestraalingsanordning
BR8703368A (pt) Dispositivo vibro-estimulador
KR880701456A (ko) 반도체 소자
KR900011013A (ko) 반도체장치
DE69025825D1 (de) Halbleiteranordnung
DE69027586D1 (de) Halbleiteranordnung
KR900000905A (ko) 반도체장치

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20010731

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee