KR870008964A - 액체 경화성 폴리오르가노실록산 조성물 - Google Patents

액체 경화성 폴리오르가노실록산 조성물 Download PDF

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KR870008964A
KR870008964A KR870001865A KR870001865A KR870008964A KR 870008964 A KR870008964 A KR 870008964A KR 870001865 A KR870001865 A KR 870001865A KR 870001865 A KR870001865 A KR 870001865A KR 870008964 A KR870008964 A KR 870008964A
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composition
silicon
units
bonded hydrogen
hydrogen atoms
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KR870001865A
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KR950006642B1 (ko
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아이렌 구텍크 베트
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노르만 에드워드 루이스
다우. 코닝 코포레이션
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70Siloxanes defined by use of the MDTQ nomenclature

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

액체 경화성 폴리오르가노실록산 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (8)

  1. A.25℃에서 점도가 0.1 내지 40 Pa.s이고 2개의 말단 위치 각각에 비닐 라디칼을 함유하는 하나 이상의 액체 플라디오르가노실록산,
    B.필수적으로 일반식 R3″ SiO 1/2의 트리오르가노실록시 단위, 일반식 CH2=CH()2SiO/2 의 디오르가노비닐실록시 단위(여기서, R″, 및는 각각 1 내지 약 20개의 탄소원자를 함유하며 에틸렌계 불포화가 없는 1가의 탄화수소 라디칼 또는 할로탄화수소 라디칼이다) 및 SiO2단위를 함유하고, SiO2단위에 대한 트리오르가노실록시 단위 및 디오르가노비닐실록시 단위의 합한 몰비는 0.7 내지 1.2이며, 0.1 내지 8중량%의 실리콘―결합 비닐 라디칼을 함유하는, 조성물의총 중량을 기준으로 4 내지 약 40%의 벤젠―용해성 수지상 공중합체;
    C.분자당 3개 이상의 실리콘―결합 수소원자를 함유하는 오르가노하이드로겐실록산 경화제,
    D.분자당 평균 50개까지의 디오르가노실록산 단위 및 2개의 실리콘―결합 수소원자를 함유하는, 조성물에 존재하는 실리콘―결합 수소원자의 10 내지 85%를 제공하기에 충분한 양의 디오르가노하이드로겐실록시―말단 폴리디오르가노실록산, 및
    E.조성물의경화를 촉진시키기에 충분한 양의 백금―함유 하이드로실화 촉매를 균질하게 혼합시킴으로써 수득된 생성물을 함유하며, 단, 각 실리콘―결합 수소원자에 대해 1.5이상의 비닐 라디칼을 함유하며, 상기 경화제 및 상기 디오르가노하이드로겐실록시―말단 폴리디오르가노실록산의 합한 농도가 조성물을 경화시키기에 충분한, 광학적으로 투명한 폴리오르가노실록산 탄성중합체를 생성하는 경화성 조성물.
  2. 제 1항에 있어서, 비닐―함유 플리디오르가노실록산이 하기 알반식으로 나타내어지는 조성물.
    상기식에서,
    R는 1가의 탄화수소 라디칼 또는 1가의 할로탄화수소 라디칼이고,
    Vi는 비닐 라디칼이며, n는 25℃에서 0.1 내지 약 40 Pa.s의 점도에 상응하는 중합도를 나타낸다.
  3. 제2항에 있어서, R는 1 내지 10개의 탄소원자를 함유하는 1가의 탄화수소 또는 할로겐화 탄화수소 라디칼이고, 상기 오르가노하이드로겐실록산이 분자당 HSiO1.5R'HSiO 및 R'2HSiO0.5(여기서, R'는 1 내지 10개의 탄소원자를 함유하는 1개의 탄화수소 또는 할로겐화 탄화수소 라디칼이다)중에서 선택된 3개 이상의 반복 단위를 함유하고, 어떠한 남아있는 반복 단위도 모노오르가노실록산, 디오르가노실록산, 트리오르가노실록시 및 SiO2중에서 선택되는 조성물.
  4. 제 3항에 있어서, 상기 조성물의 점도가 25℃에서 100 Pa.s를 초과하지 않으며 R, R', R″ 및는 메틸, 페닐 또는 3,3,3―트리플루오로프로필인 조성물.
  5. 제 4항에 있어서, R, R', R″ 및는 메틸이고, 경화제는 분자당 평균 10 내지 50개의 반복단위 및 3내지 5개의 실리콘―결합 수소원자를 함유하는 디메틸실록산/메틸하이드로겐실록산 공중합체를 포함하며, 조성물이 실리콘―결합 수소원자 몰당 2 내지 4몰의 비닐 라디칼을 함유하고, 디오르가노하이드로겐실록시 말단 폴리디오르가노실록산의 실리콘―결합 탄화수소 라디칼이 메틸이며, 상기 백금―함유 하이드로실화 촉매는 헥사클로로 백금산과 비닐함유 오르가노실록산 화합물의 반응생성물인 조성물.
  6. 제 5항에 있어서, 상기 조성물이 2개의상기 액체 플리디오르가노실록산을 함유하며, 이중 하나는 25℃에서 0.1 내지 3Pa.s의 점도를 나타내고, 또 다른 하나는 25℃에서 20 내지 40Pa.s의 점도를 나타내며, 디메틸하이드로겐실록시 말단 플리디메틸실록산이 상기 조성물에 존재하는 실리콘―결합 수소원자의 30 내지 70몰%를 함유하는 조성물.
  7. 제 6항에 있어서, 백금 촉매억제제를 함유하는 조성물.
  8. 제 7항에 있어서, 상기 백금 촉매억제제가 아세틸렌계 알콜인 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870001865A 1986-03-03 1987-03-03 액체 경화성 폴리오르가노실록산 조성물 KR950006642B1 (ko)

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Application Number Priority Date Filing Date Title
US83581786A 1986-03-03 1986-03-03
JP835,817 1986-03-03
US927997 1986-11-07
US06/927,997 US4845164A (en) 1986-03-03 1986-11-07 Liquid curable polyorganosiloxane compositions
JP927,997 1986-11-07
US835817 1992-02-18

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KR950006642B1 KR950006642B1 (ko) 1995-06-21

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US (1) US4845164A (ko)
EP (1) EP0240162B1 (ko)
KR (1) KR950006642B1 (ko)
DE (1) DE3786580T2 (ko)
ES (1) ES2004890A6 (ko)

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KR950006642B1 (ko) 1995-06-21
ES2004890A6 (es) 1989-02-16
DE3786580T2 (de) 1994-02-17
US4845164A (en) 1989-07-04
DE3786580D1 (de) 1993-08-26
EP0240162A3 (en) 1988-12-07
EP0240162B1 (en) 1993-07-21
EP0240162A2 (en) 1987-10-07

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