KR840001047A - 복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법 - Google Patents

복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법 Download PDF

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KR840001047A
KR840001047A KR1019820002586A KR820002586A KR840001047A KR 840001047 A KR840001047 A KR 840001047A KR 1019820002586 A KR1019820002586 A KR 1019820002586A KR 820002586 A KR820002586 A KR 820002586A KR 840001047 A KR840001047 A KR 840001047A
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layer
copper
microns
nickel
thickness
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KR1019820002586A
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케이 코니섹크 지리
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원본미기재
오우크 인더스트리이즈 인코포레이팃드
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Publication of KR840001047A publication Critical patent/KR840001047A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
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    • Y10T428/12694—Pb- and Sn-base components: alternative to or next to each other and next to Cu- or Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12701—Pb-base component
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
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    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
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    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Manufacturing & Machinery (AREA)
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  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

내용 없음

Description

복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (15)

  1. 다음을 포함하는 인쇄회로 제조에 유용한 제품.
    (1) 10-15미크론의 두께를 갖는 구리로된 운반체층,
    (b) 1-12미크론의 두께를 갖는 얇은 구리층 및
    (c) 니켈, 니켈-주석합금, 니켈-철합금, 납 및 주석-납합금으로 구성되는 구룹에서 선택되며, 두께가 0.1-0.2 미크론이고 (a) 층 및 (b)층사이에 위치하여 그 두층을 확실히 해주고, (b) 층에 충분히 응착되어 (a) 층을 제거하는 부식제가 (b) 층을 제거하지 못하게하는 중간의 금속성층.
  2. 제1항에 있어서, 중간층에 니켈인 것을 특징으로하는 제품.
  3. 제1항에 있어서, 구리로된 얇은층의 두께가 5-9미크론인 것을 특징으로 하는 제품.
  4. 제1항에 있어서, 구리로된 얇은 구리층의 바깥쪽 표면이 응착촉진 및 응착되게 처리되는 것을 특징으로 하는 제품.
  5. 부도성 물질로 된 코어 및 그 양쪽면에 응착된 다음을 포함하는 금속성 박편으로 구성된 인쇄회로 제조에 유용한 제품.
    (a) 10-15미크론의 두께를 갖는 구리로 된 운반체층,
    (b) 1-12미크론의 두께를 갖고, 부도성물질로된 코어에 접착되는 외부 표면이 응착 촉진 및 응착되게 된 구리로 된 얇은 층. 및(c) 니켈, 니켈-주석합금, 니켈-철합금, 납 및 주석-납 합금으로 구성되는 그룹에서 선택되며 (a) 층과 (b) 층사이에 위치하여 두층을 확실히하여 주며, (b) 층에 충분히 응착되어 (a) 층을 제거하는 부식제가 (b) 층을 제거하지 못하게 하는 두께가 0.1-2.0미크론인 중간의 금속성층.
  6. 제5항에 있어서 코어가 보강된 에폭시 판 인것을 특징으로 하는 제품.
  7. 제5항에 있어서 코어가 폴리이미드를 포함하는 것을 특징으로 하는 제품.
  8. 제5항에 있어서 코어가 폴리에스테를 포함하는 것을 특징으로 하는 제품.
  9. 제5항에 있어서 코어가 폴리테트 라플로라이드를 포함하는 것을 특징으로 하는 제품.
  10. 제5항에 있어서 코어가 보강되지 않은 부도체를 사용하는 것을 특징으로 하는 제품.
  11. 제5항에 있어서 코어가 하나 이상의 인쇄회로 층을 포함하는 것을 특징으로 하는 제품.
  12. 다음 단계를 포함하는 인쇄 회로판의 제조에 유용한 생산물을 만드는 방법.
    (a) 10-15미크론의 두께를 갖는 구리로된 운반체층의 전착시키는 단계, (b) 니켈, 니켈-주석 합금, 니켈-철 합금, 납 주석-납합금으로 구성되는 그룹에서 선택되는 금속으로 된, 두께가 0.1-2.0미크론인 얇은 층을 구리로 된 운반체층에 전착시키는 단계 및 (c) 1-12미크론의 두께를 갖는 구리로 된 얇은층을 상기 금속층에 충분히 응착시켜 35미크론의 구리로 된 층을 제거하는 부식액에 의하여, 제거됨을 막아주도록 하는 상기층의 전착단계 및 (d) 얇은 층의 바깥쪽 표면을 응착촉진 및 응착되도록 하는 처리단계.
  13. 제12항에 있어서, (a),(b),(c) 및 (d)의 단계로 서술된 전착된 조합물의 제조과정에 부도체 물질로 이루어진 코어물질 양쪽면 위에 얇게 입히는 단계가 추가된 방법.
  14. 부도체를 포함하는 코어 및 코어 양쪽면에 붙여지는 10-15미크론의 두께를 갖는 구리로된 운반체층, 응착촉진 및 응착되게 표면 처리가 된 1-12미크론의 두께를 갖는 구리로된 얇은층 및 두 구리층 사이에 위치하여 두층을 확실히 하여주는 니켈, 니켈-주석합금, 니켈-철합금, 납 및 주석-납합금으로 구성되는 그룹에서 선택되며 구리로 된 운반층을 제거하는 부식제에 의한 구리로 된 얇은 층의 제거를 막는 구실을 하는 두께가 0.1-2.0미크론인 중간 금속성물질로 이루어진 얇은 금속성 박편이 함유된 박편을 사용하는 다음의 단계로 이루어지는 인쇄회로의 제조방법; (a) 부식액에서 언급된 구리로 된 운반체층을 제거하는 단계, (b) 또 다른 부식액에서 언급된 중간층을 제거하는 단계, (c) 남아 있는 판에 구멍을 뚫어 코어의 장쪽면에 있는 언급된 구리로 된 얇은 층을 연결될 수 있게하는 단계.
  15. 제14항에 있어서 남은 구리로 된 얇은층의 도금단계 및 언급된 코어의 양쪽면을 구멍을 통하여 연결하는 단계를 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019820002586A 1981-06-12 1982-06-10 복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법 KR840001047A (ko)

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US06/272,988 US4394419A (en) 1981-06-12 1981-06-12 Printed circuit material
US272988 1999-03-20

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KR840001047A true KR840001047A (ko) 1984-03-26

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US4394419A (en) 1983-07-19
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EP0071706A2 (en) 1983-02-16

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